Category: Computers

  • TSMC Launches 1.4nm Process Technology for Next-Gen Devices

    TSMC Launches 1.4nm Process Technology for Next-Gen Devices

    Key Takeaways

    1. TSMC has unveiled its 1.4nm process technology, set to begin production in 2028, showcasing advancements over the 2nm process.
    2. The 1.4nm process promises a 30% reduction in power consumption and a 15% performance improvement.
    3. TSMC’s next-generation 2nm process is expected to power devices from major companies like Apple, Nvidia, and AMD.
    4. The 1.4nm process offers a 20% increase in logic density compared to the 2nm process, making it 30% faster and 60% more efficient than the 3nm process.
    5. Apple’s iPhone 17 will use the 3nm N3P node, indicating a gradual transition to the 2nm and 1.4nm technologies in the coming years.

    Back in June 2024, Samsung made waves by introducing advancements in its foundry for the 4nm, 2nm, and 1.4nm process nodes. Now, TSMC (Taiwan Semiconductor Manufacturing Company) has revealed its own state-of-the-art 1.4nm process technology, which will be utilized in upcoming products from major players like Nvidia, Apple, AMD, and more.

    TSMC’s 1.4nm Process Unveiled

    The largest contract chipmaker in the world has disclosed that the 1.4nm A14 process is set to start production in 2028, featuring several enhancements over the 2nm process. This new process technology promises a 30 percent decrease in power consumption while improving performance by approximately 15 percent. To put it in context, TSMC’s 2nm process is on track to begin production later this year.

    TSMC’s 2nm Node Overview

    With a diverse client base, TSMC’s next generation process will likely supply power to upcoming iPhones, Nvidia GPUs, AMD processors, and a whole lot more. According to TSMC, there is a 20 percent boost in logic density, which contributes to the performance increase over the 2nm process. When you compare it to the current TSMC 3nm process, the 1.4nm is nearly 30 percent quicker and 60 percent more efficient.

    To refresh your memory, Apple’s upcoming iPhone 17 series is anticipated to incorporate the latest N3P node (3nm) for the A series chips, indicating that the transition to 2nm could take a couple of years to materialize. In simple terms, the technology from the 1.4nm process is still a few generations down the line as well. That’s all we have for now, so keep an eye out for more updates!

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  • Lenovo Unveils New 5G Router Supporting Multiple SIM Cards

    Lenovo Unveils New 5G Router Supporting Multiple SIM Cards

    Key Takeaways

    1. The Lenovo Xiaoxin 5G CPE supports up to three SIM cards, including those from China Mobile and China Unicom.
    2. It is currently only available for sale in China, priced around $86, with uncertain future availability in other countries.
    3. The router offers WiFi 6 connectivity on 2.4GHz and 5GHz bands, with download speeds up to 2Gbit/s and uploads up to 900Mbit/s.
    4. It can switch to 4G LTE networks if 5G signals are unavailable, but this results in lower internet speeds.
    5. The device can connect up to 24 devices via WiFi or Gigabit Ethernet and operates on a passively cooled Unisoc V510 chip with 512MB of RAM.

    The Lenovo Xiaoxin 5G CPE is a brand-new 5G router that can support up to three SIM cards. Included are SIM cards from China Mobile and China Unicom, and there’s also an extra slot for another SIM. However, a key drawback is that this router is only available for sale in China right now. It is priced around $86, and it remains uncertain whether it will be released in other countries in the future.

    Connectivity Options

    Users can connect devices using WiFi 6 across the typical 2.4GHz and 5GHz bands. The router supports OFDMA and MIMO technology, allowing for download speeds of up to 2Gbit/s and uploads reaching 900Mbit/s. If there’s no 5G signal available, the router can switch to 4G LTE networks, though this will cause a significant drop in internet speeds.

    Device Capacity and Performance

    The Lenovo Xiaoxin 5G CPE can support as many as 24 devices, which can connect through WiFi or Gigabit Ethernet. Lastly, this 5G router operates on the passively cooled Unisoc V510 chip, which comes with 512MB of RAM.

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  • Serene Industries Launches $850 Cleaver Aluminum Keyboard with Hall Effect Switches

    Serene Industries Launches $850 Cleaver Aluminum Keyboard with Hall Effect Switches

    Key Takeaways

    1. Minimalist Design: The Cleaver keyboard features a simple yet functional monoblock design, combining the chassis, electronics, and silicone core into one unit.

    2. Durable Build: Made from a single piece of aluminum, the keyboard offers protection against dust and spills with its silicone-potted PCB and robust construction.

    3. Unique Key Features: It includes hot-swappable wired Hall effect switches and aluminum keycaps with 1204 holes for RGB lighting, focusing on precision manufacturing.

    4. Target Audience: Priced at $850, the Cleaver is aimed at collectors and enthusiasts rather than average consumers, serving as both a functional keyboard and a statement piece.

    5. Pre-order Availability: The Cleaver is available for pre-order in Windows or Mac layouts, with options for clear and black anodized finishes.

    A new luxury mechanical keyboard named Cleaver is currently available for pre-order, offering more than just a simple minimalist design. Crafted from a single piece of aluminum and developed by Serene Industries (the same company behind the Icebreaker), this Hall effect keyboard comes with a steep price tag of $850, clearly targeting a specific audience.

    Simplified Yet Functional Design

    Rather than adding unnecessary keys or flashy features, the Cleaver opts for simplicity. It employs a monoblock structure that merges the chassis, electronics, and silicone core into one cohesive unit. Serene claims that the PCB is silicone-potted, providing resistance against dust and spills. Additionally, there’s a 1/4-20” thread integrated into the body, possibly intended for mounting or rig configurations. While it may resemble a decorative item on your desk, it operates as a complete mechanical keyboard equipped with hot-swappable wired Hall effect switches. The keycaps, also aluminum, are designed with 1204 holes to allow RGB lighting to shine through, showcasing a focus on precision manufacturing beyond just aesthetics.

    Unique Build Characteristics

    The case appears thinner than one might expect. Although the Cleaver features full-height switches, its layered construction allows it to maintain a low-profile feel, according to the company. This design choice, along with the aluminum frame and silicone-dampened base, ensures a clean sound profile while also offering protection from dust and water.

    Everything about this keyboard is built to last, including the key legends and the USB-C port. It’s entirely manufactured and assembled in the US, with production set to start two weeks after the launch. Given its price, it’s not intended for average consumers — it’s clearly targeted at collectors or dedicated enthusiasts who have been eagerly awaiting something more avant-garde (and visually impressive, of course).

    Pre-order Options Available Now

    If this aligns with your interests, the Cleaver can be pre-ordered now in either Windows or Mac layouts, featuring clear and black anodized finishes, along with aluminum keycaps. It’s essential to recognize that this is not your typical keyboard. It serves more as a statement piece equipped with switches.

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    Serene Industries Launches $850 Cleaver Aluminum Keyboard with Hall Effect SwitchesSerene Industries Launches $850 Cleaver Aluminum Keyboard with Hall Effect Switches
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  • Russia’s Goal: Homegrown 28nm Chips by 2030

    Russia’s Goal: Homegrown 28nm Chips by 2030

    Key Takeaways

    1. MCST plans to produce locally made 28-nanometer chips by 2030, focusing on server-class processors using home-grown silicon.
    2. Russia’s domestic supply chain is improving, with new photolithography tools being developed, but mass production capabilities are still limited.
    3. Key challenges include aligning process recipes, sourcing materials, and ensuring quality control for the new chip manufacturing facility.
    4. Licensing issues hinder the use of x86 and Arm technology, pushing MCST to rely on its own Elbrus architecture for efficiency and security.
    5. A significant software gap exists, as there are not enough skilled engineers to adapt software for the Elbrus platform, impacting its acceptance in the market.

    Russia is gearing up to send out locally made 28-nanometer chips by the end of this decade. At the core of this initiative is MCST, the organization behind the SPARC-based Elbrus CPU series. Konstantin Trushkin, the Deputy Director, mentioned that the first production facilities are expected to be operational between 2028 and 2030. This timeline provides MCST with ample opportunity to launch server-class processors that utilize home-grown silicon.

    Progress in Domestic Equipment

    The domestic supply chain is making strides despite starting from a significant deficit. In March 2025, the state-supported ZNTC finished a 350-nanometer photolithography tool and plans to showcase a 130-nanometer version in 2026. However, neither of these tools has reached mass production yet. Currently, Russia can only prototype using these older technology nodes; any finer processes require outsourcing or grey-market imports, such as used ASML PAS 5500 scanners.

    Challenges Ahead

    Although a 28 nm fab is planned, the industry still faces challenges in aligning process recipes, obtaining materials, and maintaining quality control. Trushkin points out that transferring a complex chip design to a new facility necessitates a skilled partner who can work on silicon and tooling together to solve problems.

    Licensing Issues and Security Concerns

    The barriers of licensing prevent the use of x86 and Arm intellectual property for local mass production. MCST supports Elbrus, its own VLIW architecture, which maximizes efficiency per unit of silicon area. Security issues bolster its argument: officials consider imported processors as unverifiable and, therefore, a potential risk to national systems.

    The Software Gap

    Just having the hardware won’t make Elbrus widely accepted. Dmitry Gusev, the deputy head of InfoTeKS, recalls how he abandoned Elbrus six years ago due to a lack of engineers who could adapt code for the platform. This gap in skills still exists. Software companies will continue to compete for the same limited talent unless universities and training institutions broaden the Elbrus curriculum.

    Assuming the 28 nm fab is operational by 2028, MCST anticipates launching market-ready server processors by 2031. However, this timeline depends on having a dependable production partner, established process flows, and a supportive software ecosystem—none of which are assured at this moment.

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  • Intel’s Lunar Lake AI PCs Struggle Sales Compared to Raptor Lake

    Intel’s Lunar Lake AI PCs Struggle Sales Compared to Raptor Lake

    Key Takeaways

    1. AI Trend Race: Since ChatGPT’s launch in late 2022, companies are rushing to leverage AI for marketing, with Microsoft promoting AI in its Windows laptops through initiatives like “CoPilot+ PC.”

    2. Chip Development: Intel and AMD are focusing on creating specialized “AI PC” chips for laptops, with Intel releasing its Core Ultra 100 and 200 APUs, while AMD has included “AI” in the names of its latest mobile chips.

    3. Consumer Preferences: Intel has seen a shift in consumer demand, favoring older Raptor Lake laptops over newer AI-focused models, leading to a shortage in production capacity for those older models.

    4. Marketing Challenges: The marketing strategies for Intel and AMD’s new processors have been ineffective, lacking engaging use cases that highlight their strengths, such as battery life and gaming capabilities.

    5. Future Insights: AMD’s upcoming earnings call will reveal whether its Ryzen AI-based laptops are performing better in the market compared to Intel’s recent offerings.

    Since ChatGPT’s launch in late 2022, a new race in AI has begun, prompting firms of all sizes to cash in on the “AI” trend. Microsoft also wanted in on the action, aiming to promote its Windows laptops through AI marketing. Last year, they rolled out the “CoPilot+ PC” initiative to certify laptops that achieve a certain level of machine learning performance.

    Chip Makers in the AI Game

    Both Intel and AMD, the leading manufacturers of Windows PC chips, have been developing “AI PC” chips tailored for laptops. Intel kicked off its AI PC journey with the Core Ultra 100 Meteor Lake APUs in 2023, which was followed by the Core Ultra 200 Lunar Lake APUs last year. AMD, not to be outdone, went a step further by incorporating “AI” into the names of their newest mobile APUs.

    Consumer Preferences Shift

    However, it appears that Intel’s pursuit of the AI PC trend hasn’t yielded the expected results. Intel has disclosed that buyers are leaning towards older Raptor Lake mobile laptops instead of the newer Meteor Lake/Lunar Lake models. In their recent Q1 2025 earnings call, Intel mentioned that the rising interest in older Raptor Lake and Alder Lake laptops has led to a shortage in their Intel 7 process capacity. This increased demand for the 13th-generation Raptor Lake laptops is largely attributed to their lower price point. The company stated that laptop manufacturers are “hedging their bets” due to “macroeconomic concerns and tariffs.”

    Marketing Missteps

    Taking cost factors into account, it’s worth questioning whether the Meteor Lake and Lunar Lake laptops were effectively marketed to the public. Over the last couple of years, Intel and AMD have branded their products as ready for the AI era, highlighting larger NPUs and more advanced iGPUs. Yet, without engaging use cases, the whole AI PC narrative appears to have unraveled.

    As noted by Hardware Canucks on X, things could have turned out differently if the latest Intel and AMD processors had been marketed based on their true strengths. For example, laptops featuring Intel’s Lunar Lake APUs, such as the latest Vivobook S 14, can finally claim battery life comparable to that of Apple MacBooks.

    In addition, with the recent Arc and Radeon iGPUs, users can enjoy modern gaming on sleek, lightweight devices. These significant selling points haven’t been effectively utilized by Intel, AMD, and Microsoft, overshadowed by the AI PC jargon.

    AMD is set to hold its earnings call next, and as Tom’s Hardware highlights, it will be fascinating to see if the Ryzen AI-based laptops are mirroring Intel’s path or performing better compared to AMD’s previous generation chips.

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  • Lexar NQ780: New PCIe 4×4 SSD for Gamers and Creators

    Lexar NQ780: New PCIe 4×4 SSD for Gamers and Creators

    Key Takeaways

    1. Lexar’s NQ780 SSD is designed for both business and gaming, offering a balance of performance and practicality.
    2. The NQ780 features SLC cache technology for improved performance and low latency, despite having lower read/write speeds than the NM1090 Pro.
    3. The NQ780 is significantly more affordable, priced at $79.99 for 1TB compared to the NM1090 Pro’s $179.99.
    4. The NQ780 does not require additional PCIe 5.0 components, making it easier to upgrade.
    5. Larger storage options are available for the NQ780 at competitive prices, with a 4TB version costing $289.99, while the NM1090 Pro is more expensive for similar capacities.

    Lexar is promoting the NQ780 as a new SSD that combines performance with practicality, suggesting it is the perfect upgrade for laptops used for both business and gaming. With its sleek and low-profile design, it also features Intelligent Power Control capabilities. The M.2 2280 drive is equipped with SLC cache technology, which aims to minimize latency and boost performance.

    Performance Metrics

    While the NQ780 may have read and write speeds rated at about half of its more advanced sibling, the NM1090 Pro—which reaches up to 14,000MB/s read and 13,000MB/s write—it comes with a significantly lower price tag. Moreover, it doesn’t necessitate the acquisition of additional PCIe 5.0-compatible components.

    Pricing Comparison

    In fact, the NM1090 Pro has just become available on Amazon in a 1TB version, priced at $179.99. In contrast, the NQ780 offers the same capacity for only $79.99.

    For those looking for larger storage, the PCIe 4 drive is available for $149.99 at 2TB, while the NM1090 Pro of the same size goes for $269.99. Additionally, the NQ780 is offered in a 4TB version at $289.99, which is not an option with Lexar’s “professional” PCIe 5.0 alternative.

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  • China’s Tianwen-3 Mission to Bring Back Mars Samples by 2031

    China’s Tianwen-3 Mission to Bring Back Mars Samples by 2031

    Key Takeaways

    1. International Collaboration: The China National Space Administration is inviting global research teams to participate in the Tianwen-3 Mars sample return mission set to launch between late 2028 and early 2029.

    2. Mission Structure: Tianwen-3 will consist of a lander, ascent module, service module, orbiter, and return capsule, with a total payload capacity of 20 kilograms for international research.

    3. Scientific Goals: The mission aims to detect biosignatures, explore subsurface layers, and study the geology and atmosphere of Mars.

    4. Advanced Instruments: The payload will include tools like Mars Subsurface Penetrating Radar, a Raman and Fluorescence Analyzer, and high-resolution imaging devices for detailed surface mapping.

    5. Preselected Landing Sites: Three potential landing zones—Amazonis Planitia, Utopia Planitia, and Chryse Planitia—were chosen for their suitability to preserve biosignatures and favorable engineering conditions.

    On April 24, 2025, during the 10th China Space Day event, the China National Space Administration announced that they are opening slots for international collaboration on the Tianwen-3 Mars sample return mission. This mission is planned to launch between late 2028 and early 2029, using two Long March 5 rockets: one will deploy a lander along with an ascent vehicle, while the second rocket will carry an orbiter and a spacecraft designed to return to Earth.

    Mission Structure and Goals

    The structure of Tianwen-3 includes a lander, an ascent module, a service module, an orbiter, and a return capsule. China has set aside 20 kilograms for payload capacity, with 15 kg designated for the orbiter and 5 kg for the lander, which will be utilized by research teams from around the world. The main goals of the mission are to detect possible biosignatures, explore subsurface layers, and investigate the geology and atmosphere of Mars.

    Scientific Instruments

    The scientific payload will include a Mars Subsurface Penetrating Radar that will help map underground formations, along with a Raman and Fluorescence Analyzer aimed at detecting organic molecules. The orbiter will also carry an Energetic Neutral Atom and Aurora Detector, as well as a vector magnetometer. Additionally, the return orbiter will be equipped with a mid-infrared hyperspectral imager and a multispectral camera, which will enable high-resolution surface mapping.

    Preselected Landing Zones

    Three potential landing sites have been chosen from a total of 86 candidates: Amazonis Planitia, Utopia Planitia, and Chryse Planitia. These sites were selected based on their ability to preserve biosignatures and engineering factors like altitude and light conditions. After the orbiter maintains a circular orbit of 350 km, it is expected that samples will be back on Earth by 2031 following a two-Martian-year elliptical mission by the service module.

    The Tianwen-3 mission would represent a significant advancement in the field of planetary exploration. If it succeeds, it will bring back the first samples from Mars gathered by China, further establishing the country’s position as a key player in deep-space science.

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  • Anker Prime 14-in-1 Thunderbolt 5 Dock with 8K Support Available

    Anker Prime 14-in-1 Thunderbolt 5 Dock with 8K Support Available

    Key Takeaways

    1. Ports and Connectivity: The docking station features various ports, including a 3.5 mm audio jack, multiple USB-C and USB-A ports, and Thunderbolt 5 ports for high-speed connections.

    2. Display Support: It supports 8K@60Hz resolution for Windows and 6K@60Hz for Mac, with HDMI 2.1 and DisplayPort 2.1 connections, though only one display can be used at a time.

    3. Cooling Features: Designed for creators and gamers, it includes a cooling fan and vents to maintain optimal performance.

    4. Compatibility: Compatible with Windows 10/11 and macOS 15 and newer, but not with ChromeOS or Linux.

    5. Pricing and Availability: Priced at $399.99 in the US and €419.00 in Europe, with immediate shipping in the US and varied availability in Europe.

    The Anker Prime TB5 Docking Station (14-in-1, 8K, Thunderbolt 5) is now available in North America and Europe. This fresh desktop gadget has been crafted for creators and gamers, featuring a cooling fan and vents to keep things running smoothly.

    Front and Back Ports

    On the front side of the Prime TB5 Docking Station, you’ll find a 3.5 mm audio jack, two USB-C ports that provide a combined output of 45 W, and a USB-A port for additional connectivity. The back boasts an upstream Thunderbolt 5 port that connects to the host device with a generous 140W pass-through charging capability, along with two downstream Thunderbolt 5 ports that allow for connections to peripherals with an impressive data transfer rate of up to 120 Gbps. Additionally, there are two more USB-A ports, each offering a 10 Gbps data transfer speed.

    Display Connections and More

    The docking station includes HDMI 2.1 and DisplayPort 2.1 to connect to displays, supporting resolutions of up to 8K@60Hz for Windows users, or up to 6K@60Hz for MacBook users. Keep in mind that both cannot be used at the same time, but a second monitor can be linked through one of the Thunderbolt 5 ports. The rear also features a 2.5 Gbps Ethernet port and an AC input. Other nice touches include ambient lighting that offers various dynamic effects and the ability to perform firmware updates through its companion app.

    Compatibility and Pricing

    The Anker docking station works with devices running Windows 10 / 11 or macOS 15 and newer, but it is not compatible with ChromeOS or Linux systems. You can purchase the Anker Prime TB5 Docking Station (14-in-1, 8K, Thunderbolt 5) for $399.99 or €419.00. While it ships right away in the US, customers in some EU nations might have to wait until early or mid-May for their new accessory. The launch date in the UK is still uncertain.

    Anker’s new product is shaping up to be a useful addition for many users.

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  • China Achieves 5nm Chip Tech Without EUV: SMIC Defies Sanctions

    China Achieves 5nm Chip Tech Without EUV: SMIC Defies Sanctions

    Key Takeaways

    1. SMIC has successfully produced 5nm chips using older DUV equipment instead of EUV lithography.
    2. The technique employed is called Self-Aligned Quadruple Patterning (SAQP), which simulates EUV accuracy.
    3. This achievement challenges the belief that EUV is essential for producing advanced chips below 7nm.
    4. The production process is more time-consuming, error-prone, and costly but has resulted in functional 5nm-class chips.
    5. The new chips are already integrated into devices like the Huawei Mate 60, outperforming competitors with features like satellite call capabilities.

    In a significant development that could transform the worldwide semiconductor market, China’s Semiconductor Manufacturing International Corporation (SMIC) has seemingly succeeded in producing 5nm chips without relying on extreme ultraviolet (EUV) lithography.

    Innovative Techniques Used

    Instead, SMIC has employed older deep ultraviolet (DUV) equipment, combined with a complex technique called Self-Aligned Quadruple Patterning (SAQP). This achievement, highlighted in several tweets by semiconductor expert William Huo on X, represents not just a technological advance but also a bold message in the realm of geopolitics.

    Overcoming Challenges

    Traditionally, the industry has believed that EUV lithography, which is only available from the Dutch firm ASML, was essential for producing chips at 5nm and lower. With the limitations on EUV access imposed by the U.S. and its partners, many experts thought that China would be unable to progress beyond the 7nm level. However, SMIC has managed to forge ahead, using intensive DUV methods to extract every possible nanometer from their older equipment.

    Results of the Breakthrough

    According to Huo, this process involved layering several lithography and etching steps, particularly utilizing SAQP to simulate the accuracy of EUV. Although this technique is more time-consuming, prone to mistakes, and costly, it proves effective. The outcome? A functioning 5nm-class chip, which is reportedly already integrated into devices such as the Kirin 9000S-powered Huawei Mate 60, that notably outperformed the iPhone 15 by providing satellite call capabilities first.

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  • Minisforum DeskMini F1FGM Micro-ATX with Ryzen 9 9955HX Preview

    Minisforum DeskMini F1FGM Micro-ATX with Ryzen 9 9955HX Preview

    Key Takeaways

    1. Minisforum is launching a new product, the DeskMini F1FGM, in the Mobile on Desktop (MoDT) market in 2025.
    2. The DeskMini F1FGM features the Ryzen 9 9955HX processor with 16 Zen 5 cores, capable of reaching 5.4 GHz.
    3. The Ryzen 9 9955HX has a configurable thermal design power (TDP) from 55 to 75 W, with plans to push it to 160 W for enhanced performance.
    4. The DeskMini F1FGM includes four DDR5 RAM slots and supports a mix of PCIe 4.0 and PCIe 5.0 expansion ports, along with five SSD slots.
    5. The official release of the DeskMini F1FGM is expected in the second half of 2025, with pricing and availability still uncertain.

    Minisforum is gearing up to make a comeback in the Mobile on Desktop (MoDT) market with an exciting new product. Just to remind you, back in late 2023, they launched the BD770i, which came equipped with a Ryzen 7 7745HX processor, dual-channel DDR5 RAM, and a couple of PCIe 5.0 M.2 slots. Following that, they released the BD790i, featuring the more robust Ryzen 9 7945HX, which is currently priced at $539 on Amazon. This processor also belongs to the same Dragon Range series as the Ryzen 7 7745HX.

    New Developments in 2025

    Jumping ahead to 2025, PC Watch has discovered that Minisforum is displaying a new MoDT motherboard at Japan IT Week in Tokyo. The DeskMini F1FGM, as shown in the image below, is powered by AMD’s latest Fire Range series processor, the Ryzen 9 9955HX. This chip boasts 16 Zen 5 CPU cores that can reach an impressive 5.4 GHz. The Ryzen 9 9955HX features a configurable thermal design power (TDP) ranging from 55 to 75 W by default and is crafted using a 4 nm FinFET process to enhance energy efficiency.

    Performance Enhancements

    PC Watch suggests that Minisforum aims to push the Ryzen 9 9955HX to a much higher level of 160 W, claiming it will deliver desktop-like performance. To accommodate this elevated TDP, the company has integrated a custom heat spreader made of aluminium and copper. Despite being a mobile processor, the Ryzen 9 9955HX will be installed in the DeskMini F1FGM with four slots for DDR5 UDIMM RAM. It’s important to note that the Ryzen 9 9955HX is not designed to be user-replaceable.

    In other specs, the DeskMini F1FGM will feature PCIe 4.0 x16 and PCIe 5.0 x16 expansion ports, along with capacity for five SSDs. This includes a mix of 2x SATA 3.0, 2x M.2 2280 Gen 4, and 1x M.2 2280 Gen 5 slots. At this time, pricing and availability are still uncertain. Nevertheless, PC Watch mentions that the DeskMini F1FGM is expected to be officially released “around the second half of 2025.”

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    Minisforum DeskMini F1FGM Micro-ATX with Ryzen 9 9955HX Preview
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