Category: Computers

  • Minix NUC150: Affordable Mini PC with Compact Design

    Minix NUC150: Affordable Mini PC with Compact Design

    Key Takeaways

    1. Minix launched the budget-friendly mini PC called the NUC150, measuring 117 x 111 x 36 mm for compact spaces.
    2. It offers processor options of the Intel N150 or the more powerful Core 3 N355, with up to 16 GB RAM and 4 TB storage via PCIe 3.0.
    3. The mini PC features two M.2 PCIe slots and various ports, including two USB Type-C ports (one with DisplayPort 1.4).
    4. Connectivity includes WiFi 6 and Bluetooth 5.2 for fast wireless connections.
    5. Pricing starts at $279 for the Intel N150 model, with the Core 3 N355 expected to be more expensive; release date is yet to be confirmed.

    Minix has launched a budget-friendly mini PC called the NUC150. A major feature of this device is its small size, measuring just 117 x 111 x 36 mm. This compact design is perfect for tight areas and for anyone wanting a tidy workspace.

    Processor Options

    The mini PC can be fitted with either the Intel N150 processor or the more powerful Core 3 N355. Both processors belong to the Twin Lake series, with the latter providing better performance. Users can pair the CPU with 16 GB of RAM and have storage options of up to 4 TB using PCIe 3.0.

    Storage and Connectivity

    It’s important to mention that the mini PC includes one M.2 2280 PCIe 3.0×2 slot and another 2242 PCIe 3.0×1 slot (1 TB Corsair MP600 is currently priced at $94.99 on Amazon). In terms of connectivity, the Minix NUC150 offers a variety of ports, such as:

    Among the two USB Type-C ports, one supports full functions, featuring DisplayPort 1.4 and Power Delivery. For wireless options, the Minix NUC150 supports WiFi 6 and Bluetooth 5.2.

    Pricing and Availability

    According to the official site, the mini PC will start at $279, which likely corresponds to the Intel N150 model. The version with the Core 3 N355 is anticipated to be priced higher. While there’s no confirmed release date yet, the site mentions that the NUC150 will be out soon.

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    Minix NUC150: Affordable Mini PC with Compact Design

     

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  • China’s Foundry Capacity Expected to Reach 30% by 2030

    China’s Foundry Capacity Expected to Reach 30% by 2030

    Key Takeaways

    1. By 2030, Mainland China’s semiconductor foundry capacity is projected to reach 30%, surpassing Taiwan’s stable 23%.
    2. China’s growth is driven by state-supported funding, particularly from the “Big Fund,” which supports domestic companies like SMIC and Hua Hong Semiconductor.
    3. Three new fab projects in China are set to begin in 2025, focusing on crucial mature nodes (8 nm to 45 nm) for various industries.
    4. China faces challenges in producing leading-edge products, with SMIC struggling to achieve consistent 5 nm processes while competitors advance to 2 nm.
    5. The shift in global semiconductor capacity reduces reliance on Taiwan and shows that market share does not guarantee technological leadership.

    According to new estimates from Yole Group, it appears that Mainland China is on track to surpass Taiwan in the global semiconductor foundry capacity by the time this decade concludes. The research company anticipates that by 2030, China will hold 30 percent of the worldwide capacity, an increase from 21 percent this year. Meanwhile, Taiwan’s share is expected to remain stable at about 23 percent. South Korea, Japan, and the United States follow behind with shares of 19 percent, 13 percent, and 10 percent, respectively.

    The Driving Force Behind Change

    The reason behind this transformation is largely due to Beijing’s “whole-nation” approach. The state-supported funding from the China Integrated Circuit Industry Investment Fund—commonly referred to as the “Big Fund”—has played a significant role in establishing national players like Semiconductor Manufacturing International Corp (SMIC) and Hua Hong Semiconductor. Currently, domestic companies are responsible for around 15 percent of China’s foundry output, and Yole forecasts that this percentage will increase significantly as new fabs become operational.

    Construction Trends Align with Projections

    Data regarding construction backs up these predictions. SEMI, a U.S. industry group, has reported that three new fab projects in China are expected to commence in 2025, which accounts for one-sixth of the total worldwide. Many of these projects are aimed at mature nodes ranging from 8 nm to 45 nm, a capacity that remains crucial for automotive, industrial control systems, and the growing Internet-of-Things market.

    Challenges Ahead for China

    However, China faces challenges when it comes to leading-edge products. SMIC has not yet proven a consistent 5 nm process, two years after it launched its first 7 nm chips in Huawei devices. On the other hand, Taiwan Semiconductor Manufacturing Co. and Samsung Electronics are pushing rapidly towards mass production at 2 nm. Lacking similar lithography tools—due to U.S. export restrictions—Chinese fabs are likely to concentrate on volume production instead of cutting-edge density.

    In conclusion, the shift in capacity is significant. It diminishes the global reliance on a few Taiwanese locations and indicates that merely having market share does not assure technological dominance anymore.

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  • System76 Meerkat Mini PC: Upgraded Core Ultra 7 & 96GB RAM

    System76 Meerkat Mini PC: Upgraded Core Ultra 7 & 96GB RAM

    Key Takeaways

    1. The System76 Meerkat mini PC now features the new Core Ultra 7 255H “Arrow Lake” CPU, offering 30% better multi-core and 18% better single-core performance compared to the previous model.

    2. It supports up to 96 GB of DDR5-5600 RAM and allows users to upgrade memory and storage through dual SODIMM slots and two M.2 2280 slots.

    3. An affordable option with the Core 3 100U is available, but it lacks discrete graphics and has PCIe 4.0 support for the M.2 slots.

    4. The Meerkat mini PC has strong connectivity options, including dual Thunderbolt 4 ports, multiple USB ports, and dual HDMI 2.1 ports, but it does not include an audio jack.

    5. Pricing starts at $599 for the Core 3 model and $1,048 for the Core Ultra 7 model, with various configuration choices available.

    Linux lovers are probably well aware of System76, a brand recognized for its Linux-based machines that generally get good feedback. One of their products, the Meerkat mini PC, has recently launched with both stronger and more budget-friendly options.

    New Processor Update

    Earlier this January, the System76 Meerkat mini PC saw an upgrade to the Core Ultra 7 155H “Meteor Lake” CPU. Now, it’s available with the new Core Ultra 7 255H “Arrow Lake” CPU. In terms of performance, the 255H boasts around 30% better multi-core performance due to its six P-cores utilizing multithreading, and about 18% enhanced single-core performance as shown by Cinebench 2024.

    Memory and Storage Options

    The Meerkat Linux mini PC can support up to an impressive 96 GB of DDR5-5600 RAM. Users can access and upgrade both the memory and storage, thanks to the dual SODIMM slots and two M.2 2280 slots, with one supporting PCIe 5.0. There’s also a more affordable option featuring the Core 3 100U, which has similar specs but both M.2 slots supporting PCIe 4.0. However, it lacks space for discrete graphics, relying instead on integrated GPUs. For gaming, mini PCs that have OCuLink support, like the GMKtec K11 (currently $649.99 on Amazon), might be a better choice.

    Great Connectivity Options

    The port selection is quite good, including dual Thunderbolt 4 ports, USB 3.2 Gen 2×2 Type-C, three USB 3.2 Gen 2 Type-A ports, a USB 2.0 Type-A port, a 2.5 G Ethernet port, and dual HDMI 2.1 ports. Unfortunately, the audio jack has been taken out, which is a bit of a letdown. The entry-level variant with the Core 3 starts at $599, while the Core Ultra 7 model begins at $1,048. There are many configuration choices available, and the prices seem mostly fair.

    System76, as reported by Liliputing.

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    System76 Meerkat Mini PC: Upgraded Core Ultra 7 & 96GB RAM
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  • Apple Roadmap Leak Reveals Hardware Upgrades for Mac Devices

    Apple Roadmap Leak Reveals Hardware Upgrades for Mac Devices

    Key Takeaways

    1. Apple is set to release the M5 chip this year, primarily for MacBook devices, with the M5 Pro and M5 Max also in development.
    2. Upcoming devices such as the MacBook Pro, iMac, and Mac Mini will be powered by the M5 series, while the new iPad Pro is not included in this release cycle.
    3. The M5 Pro and M5 Max will feature advanced packaging technology to enhance performance and heat management by separating the CPU from the GPU.
    4. The MacBook Air will not receive an M5 upgrade until 2026, but an A18 Pro-powered MacBook Air is confirmed to be in development.
    5. The next generation, M6 series chips, are anticipated for late 2026 and may include an integrated 5G modem, produced using TSMC’s advanced N2 process.

    A previous roadmap has confirmed that Apple is actively developing its next generation of M-series chips. These chips will be released each year, with the Apple M5 expected to make its debut this year alongside a MacBook, rather than an iPad Pro. Apple Insider has provided new insights into what Cupertino plans for the upcoming months. The Apple M5 is anticipated to power several devices during the latter half of 2025.

    Upcoming Devices

    To begin with, there will be a MacBook Pro featuring the M5, M5 Pro, and M5 Max. In addition, an iMac powered by the M5 is set to launch alongside a Mac Mini equipped with both the M5 Pro and M5. In short, any device released in 2024 will receive an M5 upgrade. The M5, along with the M5 Pro and M5 Max, is likely to be produced using TSMC’s N3P technology. Curiously, the new iPad Pro is missing from this list, even though it has begun mass production.

    Performance Enhancements

    Moreover, the M5 Pro and M5 Max will utilize TSMC’s System-in-Integrated-Chips-Moulding-Horizontal (SoIC-mH) packaging. This innovative design will enable Apple to separate the CPU from the GPU, leading to improved performance and heat management. Furthermore, the Mac Pro is anticipated to get a significant upgrade, but it remains uncertain which chip will be included in it.

    If the latest Mac Studio serves as any indication, it could use the Apple M3 Ultra or the yet-to-be-revealed M4 Ultra (with the code name Hidra) mentioned in a previous roadmap. Meanwhile, the MacBook Air, much like its predecessor, will not see an M5 upgrade until 2026. In addition, Apple Insider has confirmed that the previously rumored A18 Pro-powered MacBook Air is indeed real.

    Future Developments

    The excitement continues with the upcoming Apple M6 series. For one thing, it may be the first of Apple’s M-series chips to incorporate an integrated 5G modem, although it is unclear if this will be Apple’s own C1. Another significant enhancement for the MacBook Pro lineup could be a tandem OLED screen, similar to what is currently featured on the iPad Pro, although some reports suggest otherwise.

    The Apple M6, M6 Pro, and M6 Max are expected to be released in the latter half of 2026. These chips are projected to be manufactured using TSMC’s N2 (2 nm) process. TSMC N2 marks the introduction of Nanosheet (also known as GAAFET) transistors, which promise to deliver a substantial improvement in both performance and thermal efficiency.

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  • Starlink-Enabled Sea Drone Tested by Cartels with Two Dishes

    Starlink-Enabled Sea Drone Tested by Cartels with Two Dishes

    Key Takeaways

    1. A sea drone capable of carrying 1.5 tons of cocaine was seized by the Colombian Navy, marking its first use in Latin America.
    2. These narco submarines are semi-submersible, with only air vents and antennas above water; smaller unmanned versions have been found in the Mediterranean.
    3. The seized drone utilized a Starlink satellite communication system, featuring antennas and cameras for live video transmission.
    4. Cartels may be testing the Starlink system, as the captured drone was empty and found near Colombia’s Caribbean coast.
    5. The discovery signals an advancement in drug trafficking methods, with Starlink enhancing the logistical capabilities of cartels.

    A sea drone, which can carry as much as 1.5 tons of cocaine, was seized by the Colombian Navy while navigating the Caribbean coast for the first time, utilizing Starlink for guidance.

    Narco Subs and Their Design

    These drones, referred to as narco submarines, are actually semi-submersible craft with only the air vents and communication antennas above the surface, while smaller unmanned versions have mainly been seized in the Mediterranean region.

    Impressive Technology Used

    The Colombian authorities were taken aback by the size of the first narco sea drone found in Latin America, as well as its use of a Starlink satellite communication system, which features two antennas and cameras capable of sending live video from the engine compartment or the drone’s environment.

    Navy Admiral Juan Ricardo Rozo stated, “this shows an advancement in the logistical abilities of drug trafficking, which is trying to go beyond traditional methods through creativity and very adaptable techniques.”

    Testing New Systems

    It appears that the cartels might be conducting test operations to assess how well the Starlink guidance system works, since the drone was empty and was captured close to Colombia’s Caribbean coastline.

    The Starlink Maritime plan for satellite internet access on open waters starts at just $250 each month, and the Performance dish equipment is currently reduced from $1,499 to $999. Although this is significantly more than the Starlink Mini kit, which is on sale for $314 at Amazon, the cartels likely don’t prioritize cost.

    Capabilities in Coastal Waters

    Additionally, the Mini dish remains functional in coastal regions within the Starlink roaming coverage area, offering speeds up to 100 mph.

    Ultimately, the discovery of the first Starlink-guided narco sea drone, even though it was empty and just undergoing a test run, indicates that trafficking techniques are becoming more advanced, with Starlink being just another asset in this illegal trade.

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    Starlink-Enabled Sea Drone Tested by Cartels with Two Dishes

     

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  • Intel Core Ultra 7 265K CPU Stays Under 80°C in Fanless Case

    Intel Core Ultra 7 265K CPU Stays Under 80°C in Fanless Case

    Key Takeaways

    1. Intel’s new processors, especially the Core Ultra 7 265K, show better power efficiency than expected, despite competition from AMD.
    2. The Raptor Lake and Raptor Lake-R models had power and stability issues, but these have been resolved in the new Arrow Lake models.
    3. The Core Ultra 7 265K features 8 performance cores, 12 efficiency cores, and can reach speeds of up to 5.5 GHz, making it suitable for fanless mini PCs.
    4. The custom fanless build uses the UP3 case by Turemetal, which effectively dissipates heat, keeping CPU temperatures within safe limits.
    5. The build includes an Asus ROG STRIX B860-I GAMING WIFI motherboard, 16 GB of DDR5-4800 RAM, and a 6 TB SATA SSD for music storage, highlighting potential for upgrades.

    Even though Intel’s newest desktop processors may seem to be falling behind AMD’s offerings, their power efficiency is surprisingly better than anticipated. The Raptor Lake and its successor, Raptor Lake-R, faced various power and stability issues, but these problems seem to be resolved with the new Arrow Lake models. Furthermore, a mid-tier processor like the Core Ultra 7 265K is proving to be an excellent option for a fanless mini PC system, as showcased by a custom system builder on the Chinese ChipHell forum.

    Specifications of Core Ultra 7 265K

    The Core Ultra 7 265K isn’t exactly a low TDP model, boasting a standard base power rating of 125 W, which can peak at 250 W. It features 8 performance cores and 12 efficiency cores, translating to a total of 20 threads that can reach speeds of up to 5.5 GHz. Additionally, it incorporates an NPU and an Arc GPU with 4 Xe cores. To maintain reasonable temperatures, the fanless mini PC design omits a dedicated GPU. The system builder has stated that the PC is intended for an audiophile who desires a tranquil setting to enjoy high-fidelity music.

    Turemetal’s Contribution

    Turemetal is already well-known in the fanless market, so the custom builder opted for the new UP3 case, which measures 300 x 300 x 200 mm and includes six 8 mm heatpipes that link the CPU passive block to the radiators on either side. This case provides sufficient heat dissipation material, allowing the CPU temperature to remain between 46-60° C during moderate usage. Under full load, the CPU might hit 80° C, but this is still considered safe within TJMAX specifications. However, the Samsung 990 Evo Plus 1 TB NVMe SSD did not perform well in terms of temperature in this setup, reaching up to 92° C under full load. An extra heatsink for the SSD is recommended in this specific case.

    Additional Components

    This build also features the Asus ROG STRIX B860-I GAMING WIFI motherboard, paired with just 16 GB of DDR5-4800 RAM, which allows for potential future upgrades. Additionally, there is an Intel S35101 6 TB SATA SSD for extensive music storage.

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    Intel Core Ultra 7 265K CPU Stays Under 80°C in Fanless CaseIntel Core Ultra 7 265K CPU Stays Under 80°C in Fanless CaseIntel Core Ultra 7 265K CPU Stays Under 80°C in Fanless CaseIntel Core Ultra 7 265K CPU Stays Under 80°C in Fanless Case
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  • AMD Zen 6 IPC Leak: Exciting 3D V-Cache Boosts Performance

    AMD Zen 6 IPC Leak: Exciting 3D V-Cache Boosts Performance

    Key Takeaways

    1. Upcoming CPU Releases: AMD Zen 6 and Intel Nova Lake are set to be the leading desktop CPU designs, expected around 2026.

    2. Performance Improvements: Intel’s Nova Lake may achieve a 10% boost in single-core performance and up to 60% in multi-core performance compared to Arrow Lake-S CPUs, while Zen 6 is expected to have a 7 to 9% uplift in Floating Point IPC.

    3. Enhanced Cache Features: Zen 6 is rumored to support increased 3D V-Cache, potentially reaching 96 MB or more, with configurations that could allow up to 240 MB of L3 cache.

    4. Gaming Focus: Zen 6 is particularly aimed at gamers, with features like boost clocks exceeding 6 GHz and improved 3D V-Cache for better gaming performance.

    5. Current Options: AMD’s existing Zen 5 processors, like the Ryzen 5 9600X, are available at good prices for those who need upgrades before Zen 6 is released.

    AMD Zen 6 and Intel Nova Lake are likely going to be the leading new desktop CPU designs set to release around 2026. Intel’s Nova Lake is said to feature as much as 56 cores, new P/E cores, a low-power core island, and additional enhancements. On the other hand, AMD is gearing up for Zen 6, which promises significant upgrades, such as possibly astonishing boost clocks, increased core counts, and a state-of-the-art TSMC fabrication process.

    Performance Expectations

    Leaked information suggests that Intel’s Nova Lake might deliver a 10% boost in single-core performance and as much as 60% improvement in multi-core performance compared to Arrow Lake-S CPUs. Unfortunately, we don’t have similar details for Zen 6 yet, as leaks on its performance have been limited.

    Early IPC Insights

    Moore’s Law Is Dead has filled this void by disclosing initial IPC (Instructions Per Cycle) figures for Zen 6. According to a source within AMD, retail Zen 6 CPUs are expected to provide a 7 to 9% uplift in Floating Point (FP) IPC compared to Zen 5.

    However, the source warned MLID that this number is “NOT the final claimed IPC that will consider gaming and other PPC uplift”. Therefore, the leaker suggests that the ultimate IPC enhancement, which includes gains from gaming and other tasks, might reach or surpass 10%.

    Cache and Gaming Focus

    We have previously noted that Zen 6 could support more than just 12-core CCDs; it is also expected to feature increased 3D V-Cache. An AMD source for MLID has confirmed that Zen 6 will include 96 MB of 3D V-Cache. The source also indicated that Zen 6 CPUs could utilize multiple layers of 3D V-Cache, allowing for configurations like 240 MB of L3 cache if AMD opts for two layers of 3D V-Cache.

    Zen 6 is said to be particularly aimed at gaming. Features like boost clocks exceeding 6 GHz and enhanced 3D V-Cache align well with AMD’s supposed strategy. Consequently, those looking to upgrade next year can anticipate notable improvements in gaming performance from generation to generation.

    Current Options

    If the wait is too long, many of AMD’s current-generation Zen 5 processors are available at attractive prices. For example, the 6-core Ryzen 5 9600X, which has shown impressive performance in our evaluations, is currently a great deal on Amazon.

    In conclusion, please keep in consideration that the information shared by MLID remains unverified until AMD officially announces Zen 6. Since Zen 6 is at least a year away, it’s unlikely that AMD will provide any definitive information in the near future.

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    AMD Zen 6 IPC Leak: Exciting 3D V-Cache Boosts Performance
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  • AMD Raises CEO Lisa Su’s Pay to $33M, Still Less Than Nvidia’s

    AMD Raises CEO Lisa Su’s Pay to $33M, Still Less Than Nvidia’s

    Key Takeaways

    1. AMD has increased CEO Lisa Su’s compensation for the next fiscal year, with a total earnings estimate of $31 million, including a $33 million equity award.
    2. Su is the only AMD executive with a base salary over $1 million, currently set at $1.32 million, which is a slight increase from last year’s $1.26 million.
    3. All five executives at AMD will receive a base salary increase of 3% to 5% for the upcoming fiscal year, reflecting overall confidence in leadership.
    4. Su’s equity award consists of 75% performance-based restricted stock units (RSUs) and 25% time-based stock options, converting on August 15.
    5. Despite the increase, Su’s compensation remains lower than Nvidia CEO Jensen Huang’s, who received nearly $49.9 million for fiscal year 2025, emphasizing competitive differences in the semiconductor industry.

    Advanced Micro Devices (AMD) has decided to significantly increase the compensation for its Chief Executive Officer (CEO), Lisa Su, for the next fiscal year. On Wednesday, the semiconductor firm revealed that Su will be receiving an equity award valued at $33 million and her base salary will rise to $1.32 million, up from last year’s $1.26 million.

    Annual Compensation Details

    This announcement came as part of AMD’s yearly executive compensation report, which outlines the salary and incentive structures for its leadership team. The report states that Su’s total earnings for 2024 amounted to $31 million, which includes $21.7 million in stock awards and $6.2 million in other incentive-based awards.

    Su’s Unique Position

    Among the top executives at AMD, Su is the only one whose base salary surpasses $1 million. Her equity award is also the largest, highlighting her important role in leading AMD through a competitive semiconductor market. Chief Technology Officer Mark Papermaster follows, with a $10 million target-value equity award and a base salary of $870,000.

    All five executives listed in the filing will receive a base salary increase of 3% to 5% for the upcoming fiscal year. Su’s $33 million equity award is set to convert on August 15 into a mix of performance-based and time-based stock options: 75% will be performance-based restricted stock units (RSUs), with the remaining 25% as time-based stock options.

    Confidence in Leadership

    These changes in compensation reflect AMD’s trust in Su’s leadership as the firm continues investing in advanced chip designs while competing against major players like Intel and Nvidia.

    Nevertheless, Su’s new pay package is still significantly lower than that of her main industry competitor, Nvidia CEO Jensen Huang. For the fiscal year 2025, Nvidia reported that Huang’s total compensation reached nearly $49.9 million, an increase from $34.2 million the year before. Huang’s compensation includes a base salary of $1.5 million, a target cash bonus of $3 million, and an equity award that could be valued at up to $27.5 million, depending on performance. The increase in Huang’s pay package mirrors Nvidia’s impressive financial results in 2025, which saw revenues of $130.5 billion, an operating income of $86.8 billion, and a shareholder return of 384% over three years.

    Huang’s pay package underscores Nvidia’s leading role in the AI chip market and its position as one of the top tech companies worldwide.

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  • Xiaomi Launches 240W Fast Charging Braided USB-C Cable Globally

    Xiaomi Launches 240W Fast Charging Braided USB-C Cable Globally

    Key Takeaways

    1. Xiaomi has launched a new 6A High-Speed USB4 Braided USB-C cable, currently available in China, with a potential international release soon.
    2. The cable supports up to 240W power delivery and PD 3.1 fast charging, along with data transfer rates of up to 40 Gbps.
    3. It can output video at 8K@60Hz when connected to a laptop and monitor.
    4. The cable features a durable design with a dark gray braided exterior, capable of withstanding over 10,000 bends and resistance to over 100 N of force.
    5. The price in China is CNY 129 (about $18 or €15), but the global launch date and availability details are still unknown.

    Xiaomi has unveiled a new braided USB-C cable on its global site, hinting at a possible international launch soon. Officially called the 6A High-Speed USB4 Braided USB-C to USB-C Cable (1m), this accessory is already on the market in China.

    Impressive Power and Speed

    The Xiaomi 6A High-Speed USB4 Braided USB-C cable claims to deliver up to 240W of power, featuring support for PD 3.1 fast charging and Xiaomi HyperCharge 120W. It also works with the USB4 Gen 3 standard, allowing for data transfer rates of up to 40 Gbps. When connecting a laptop to a monitor, it can handle video output at 8K@60Hz.

    Durable Design

    This coaxial cable, as its name suggests, boasts a sturdy, dark gray braided exterior and measures 1 m (approximately 3.3 ft) in length. Xiaomi asserts that it can endure more than 10,000 bends and has passed tests showing resistance to over 100 N of force.

    Xiaomi has not yet revealed the global launch date for the 6A High-Speed USB4 Braided USB-C to USB-C Cable (1m) or the specific countries where it will be available. In terms of pricing, it is listed for CNY 129 (around $18 or €15) in China. Additionally, the older Xiaomi 6A Type-A to Type-C Cable is priced at €14.99 in countries like Germany. It remains unclear if or when other lengths or colors might be introduced.

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    Xiaomi Launches 240W Fast Charging Braided USB-C Cable Globally

     

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  • Ryzen AI 5 330: New Krackan Point CPU Debuts on Geekbench

    Ryzen AI 5 330: New Krackan Point CPU Debuts on Geekbench

    Key Takeaways

    1. The Ryzen AI 5 330 is a new AMD laptop processor, part of the Ryzen AI 300 Krackan Point series.
    2. It features a less powerful configuration compared to the Ryzen AI 5 340 and has a reduced Radeon 820M iGPU.
    3. Performance scores on Geekbench 6.3 are 1,949 for single-core and 7,047 for multi-core, lower than the Ryzen AI 5 340.
    4. The processor has four CPU cores: one Zen 5 core and three Zen 5c cores, marking a new configuration.
    5. The Ryzen AI 5 330 was tested with an Acer laptop that includes 32 GB of RAM.

    A new AMD laptop processor has appeared on Geekbench. The Ryzen AI 5 330 is part of the Ryzen AI 300 Krackan Point series, and it serves as a less powerful version of the Ryzen AI 5 340. This new chip also comes with a reduced Radeon 820M iGPU, though its specifications are not currently available.

    Performance Scores

    The Ryzen AI 5 330 achieved scores of 1,949 in single-core and 7,047 in multi-core tests using Geekbench 6.3. These scores are significantly lower than those of the Ryzen AI 5 340, which scored 2,776 in single-core and 10,668 in multi-core. The Geekbench backend indicates that the processor is not experiencing throttling, suggesting that the lower single-core score is due to its modest single-core boost clock of 3.721 GHz.

    Core Configuration

    Conversely, the multi-core score reflects the limited number of CPU cores. The Geekbench listing shows that the Ryzen AI 5 330 has a total of four CPU cores: one Zen 5 core and three Zen 5c cores. This makes it the first processor to feature such a configuration. It was also observed alongside an Acer laptop that has 32 GB of RAM.

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    Ryzen AI 5 330: New Krackan Point CPU Debuts on Geekbench
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