The latest scoop from tipster @digitalchatstation reveals details about the upcoming Realme GT Neo 6 series devices. The series will be equipped with the upcoming Snapdragon 8s Gen 3 processor (SM8635) and boast a 1.5K screen.
Recent Leaks on Realme GT Neo 5 Series
Snapdragon 8s Gen 3 Geekbench score and core architecture
Recent leaks have shed light on the Geekbench benchmark information of Realme’s new phone, the RMX3851. The device is expected to utilize the SM8635 processor, with benchmark scores showcasing its prowess. While the single-core score of 1512 and multi-core score of 3799 may not provide definitive insights due to variability, they hint at the device’s high-performance capabilities.
Processor Architecture Details
Notably, the processor’s core architecture includes 1 x 3.01GHz Cortex-X4, 4 x 2.61GHz Cortex-A720, and 3 x 1.84GHz Cortex-A520 cores, with the software code-named “pineapple,” aligning it with the Snapdragon 8 Gen 3. For those unfamiliar, the flagship Snapdragon 8 Gen 3 SoC utilizes the same cores, albeit with a slightly higher frequency. For graphics, this chip comes with the Adreno 735 GPU, which is a slight downgrade from the Adreno 750 of the flagship Snapdragon 8 gen 3. Given the leaks are true, the Snapdragon 8s Gen 3 promises robust performance, catering to the demands of modern mobile users.
Comparison with Previous Models
Compared with its predecessors, the Realme GT Neo 5 series, the upcoming Neo 6 series promises significant upgrades. Last year’s Realme GT Neo 5 debuted with the Snapdragon 8+ Gen 1 processor, targeting mid-range consumers with a starting price of 2,499 yuan ($350). Meanwhile, the Realme GT Neo 5 SE, equipped with Snapdragon 7+ Gen 2 processors, aimed for a more budget-friendly segment, starting at 1,999 yuan ($277).
Insights on Upcoming Qualcomm Chips
Insights from @Ice Universe hint at Qualcomm’s imminent release of the SM7675 and SM8635 chips, anticipated to hit the market in March. Both chips are expected to be variants of the same architecture, sharing the development code name “Cliffs” within Qualcomm.
