Category: Computers

March 4, 2024
PELADN WI-6 Mini PC: Intel 12th Gen N100 CPU Sale in China – 999 Yuan
PELADN WI-6 mini PC is available for purchase on JD.com in China starting today. This mini PC is offered in three different configurations depending on the storage and memory capacity it possesses.
Key Specifications of the WI-6 Mini PC
The PELADN WI-6 mini PC is powered by a 4-core 4-thread Intel 12th generation Alder Lake N100 processor, capable of reaching speeds of up to 3.4 GHz. It features integrated UHD graphics, with options for 8GB or 16GB of DDR4 3200MHz RAM and storage capacities in 256GB, 512GB, or 1TB M.2 2280 SSD. To maintain optimal temperatures, the device is equipped with a single fan for cooling.
Connectivity and Design
In terms of connectivity, the WI-6 mini PC offers 2 HDMI ports, 1 USB-C port, 2 USB 3.0 ports, 2 USB 2.0 ports, 1 RJ45 network port, and a 3.5mm headphone jack. It also supports WiFi 5.0 and Bluetooth 4.2 for wireless connectivity. The device measures 124 x 112 x 35 mm and weighs approximately 0.32kg. It operates on a 12V/3A power supply and runs on the Windows 11 operating system.
Pricing Details
- 8GB RAM + 256GB version: 999 yuan (~$138)
- 16GB RAM + 512GB version: 1199 yuan (~$166)
- 16GB RAM + 1TB version: 1699 yuan (~$236)
For users requiring more computational power in a compact form factor, the PELADN HI-3 Mini PC could be a suitable alternative. This device features an i5-11300H CPU with 4 cores, 8 threads, and a turbo boost clock speed of up to 4.4GHz. Additionally, the HI-3 Mini PC includes a dedicated NVIDIA MX450 GPU with 2GB of GDDR6 memory. It was launched late last year and is priced at around 2599 yuan ($356).
Tags: laptop specifications, Mini-PC, PELADN WI-6
March 4, 2024
Apple to Unveil OLED iPads, M3 MacBook Air, and More this Week
According to a source cited by MacRumors, Apple is anticipated to unveil a range of fresh products in the upcoming week. The tech giant traditionally discloses its product launches via press releases on its official website. Therefore, if the information holds true, Apple should be making an official announcement shortly. While specific details remain under wraps, there is widespread anticipation regarding potential new releases such as iPads, Mac computers, and revamped accessories.
Speculated Apple Product Launch
Renowned for his industry expertise, Mark Gurman from Bloomberg has also hinted at Apple's plans to introduce a series of new devices. This lineup may include the launch of updated models for iPad Pro, iPad Air, and MacBook Air, in addition to the unveiling of fresh Magic Keyboard and Apple Pencil accessories.
Stay tuned for more updates on these anticipated Apple product launches as the tech community eagerly awaits the official announcements.
Tags: Apple, New Products, Technology Rumors
March 4, 2024
Samsung Explores MUF Technology for Next-Gen Server DRAM
Samsung is looking into incorporating molded-in-fill (MUF) technology in its next generation of dynamic random-access memory (DRAM), as per a report from TheElec. This decision indicates Samsung's exploration of innovative methods to boost the performance and efficiency of its memory products. The MUF technology, previously employed by SK Hynix in the production of high-bandwidth memory (HBM), presents promising opportunities for Samsung's future DRAM projects.
Samsung’s tests on an MR MUF process have indicated promising outcomes
MUF technology involves injecting a substance between semiconductors after creating numerous small holes in the semiconductor layers. This process is designed to securely link multiple vertically stacked semiconductors. Samsung's recent experiments with an MR MUF process for 3D stacked memory have demonstrated improved throughput in comparison to traditional methods like thermal pressed non-conductive film (TC NCF). However, there are concerns about its impact on physical properties.
Samsung's Strategic Application of MUF Technology
While Samsung identified MUF as unsuitable for HBM technology due to specific demands, it envisions potential uses in 3DS registered dual in-line memory modules (RDIMMs), predominantly deployed in server settings. This choice is in line with Samsung's dedication to advancing server DRAM memory technologies to meet the changing demands of the industry.
Advantages of MUF Technology in Semiconductor Industry
MUF's success in HBM production by SK Hynix has attracted attention in the semiconductor sector. This epoxy resin molding compound is believed to offer benefits such as preventing wafer warpage and enhancing overall performance. Samsung's efforts to develop its proprietary MUF compound in partnership with Samsung SDI indicate a strategic step towards establishing custom solutions tailored to its needs.
Implications of Samsung's Potential Adoption of MUF Technology
The potential integration of MUF technology by Samsung carries weight in the semiconductor market. As the world's leading storage semiconductor enterprise, Samsung's backing of MUF could accelerate its broad acceptance and adoption as a mainstream technology. This advancement has the potential to reshape the landscape of the semiconductor material market, ushering in significant changes in the industry.
Tags: DRAM Innovation, Samsung Research, Semiconductor Technology
March 4, 2024
Honor Magic 6 RSR Porsche Design, MagicBook Pro 16 Pre-Orders Start in China
In February, Honor teased the impending launch of the Magic 6 RSR, suggesting a March unveiling in China. A recent Weibo post from a Chinese source discloses that Honor has kickstarted pre-orders for the Magic 6 RSR and two other products.
Honor Initiates Pre-Orders for Three New Offerings
A Chinese tech influencer reports that Honor is now accepting pre-orders for three upcoming devices: the Magic 6 RSR Porsche Design, the Magic 6 Ultimate, and the MagicBook Pro 16. While specifics about the Magic 6 models remain undisclosed, the new laptop is set to feature Intel’s latest Ultra 7 processor alongside the Nvidia RTX4060 GPU.
Last year, Honor's Magic 5 series comprised the Magic 5, Magic 5 Pro, and Magic 5 Ultimate models. While the Pro and Ultimate variants shared similar specs, the Ultimate version boasted a distinct design, showcasing a unique camera setup and a construction of ceramic or leather.
In January this year, Honor introduced the Magic 6 and Magic 6 Pro smartphones in China. It remains uncertain whether the Magic 6 RSR and Ultimate models are distinct entities or variations of the same device. Should they be identical, the third model might offer a completely different experience. Official confirmation from Honor is awaited to shed light on these pre-orders, offering insight into the upcoming devices slated for the Chinese market this month.
Reports suggest that the highlight of the Snapdragon 8 Gen 3-powered Magic 6 RSR will be its 50-megapixel OV50K primary camera, touted as OmniVision's inaugural one-inch camera sensor.
Tags: Honor Magic 6 RSR Porsche Design, Honor Magic6 series, unofficial pre-orders
March 4, 2024
Lenovo ThinkBook 14 2024 Core Edition Laptop Launches in China at 4999 Yuan: Intel Core Ultra 5-125H + 16GB + 1TB
After the recent launch of the ThinkBook 14+/16+ 2024 laptops, Lenovo introduces the ThinkBook 14 2024 Core Edition laptop, which is now available for purchase on JD.com priced at 4,999 Yuan (~$695). This laptop is powered by the Intel Core Ultra 5 CPU and features a 16GB + 1TB configuration.
Lenovo ThinkBook 14 2024 Core Edition Specifications
The Lenovo ThinkBook 14 2024 Core Edition sports a 14-inch 2.8K 120Hz IPS display with a resolution of 2880 x 1800, providing a 90% screen-to-body ratio. The screen ensures vivid colors with its 100% sRGB color gamut and boasts a brightness of 400 nits. Moreover, it is TÜV Rheinland certified for eye safety.
Performance and Features
Under the hood, this laptop packs a punch with a 14-core 18-thread Intel Core Ultra 5 125H AI-enabled CPU, integrated Intel ARC graphics, 16GB 5600MHz DDR5 dual-channel memory, and a 1TB M.2 2280 PCIe 4.0 SSD. Noteworthy is the expandability of the memory slots up to 64GB and the hard drive slots up to 2TB. The cooling system utilizes a “Single fan + dual heat pipe” configuration, delivering 40W of performance.
Battery Life and Connectivity
With a 60 Whr battery capacity, the ThinkBook 14 2024 Core Edition supports Fn+Q for toggling between three performance modes. The laptop claims a 50% charge can be achieved in just 30 minutes of charging while in shutdown mode.
Ports
- 1 x Thunderbolt 4 interface
- 1 x USB-C 3.2 Gen 2 interface
- 2 x USB-A 3.2 Gen 1 interfaces
- 1 x HDMI 2.1 interface
- 1 x RJ45 interface
- 1 x SD card interface
- 1 x 3.5mm headphone jack
Tags: Core Edition Laptop, laptop specifications, Lenovo ThinkBook 14, Performance Features
March 3, 2024
AOOSTAR GEM12 Pro Gaming Mini PC with Built-In Screen and Fingerprint Scanner
Chinese mini-PC manufacturer AOOSTAR has introduced the GEM12 Pro gaming mini PC in the domestic market. This new gaming mini PC launch follows closely after the GEM 10 gaming mini-PC release, but the GEM12 Pro stands out with its distinctive design features. Powered by the AMD Ryzen 7 8845HS processor, this mini PC includes a built-in screen and a fingerprint scanner for secure biometric authentication.
Unique Features of AOOSTAR GEM12 Pro
The built-in screen of the AOOSTAR GEM12 Pro displays crucial system information like CPU, GPU, RAM temperature, and speed, allowing users to customize it with a clock and personal photos. Positioned adjacent to the screen, the fingerprint scanner enables convenient and secure Windows Hello fingerprint unlocks.
Powerful Specifications
Equipped with the Ryzen 7 8845HS processor from the AMD Hawk Point series, the AOOSTAR GEM12 Pro boasts 8 cores, 16 threads, up to 32GB of RAM, and 1TB of NVMe storage. Additionally, variants with Ryzen 7 7840HS and Ryzen 9 6900HX processors are available. Featuring the Radeon 780M iGPU, this mini PC ensures a premium gaming experience for modern games, with options available without the built-in screen and fingerprint scanner.
Connectivity and Cooling
The GEM12 Pro includes an OCuLink port for easy connection to an external graphics dock, enabling the use of a desktop-grade GPU. Connectivity options comprise USB4, USB 3.2 Gen 2, DPI 1.4, and HDMI 2.1. Designed for demanding gaming sessions, the mini PC incorporates an advanced Glacier 3.0 cooling system with a large vapor chamber, supporting 75W of performance.
Pricing & Availability
In China, the AOOSTAR GEM12 Pro gaming mini PC is priced at 2,699 yuan ($375) for the barebone version with the Ryzen 7 8845HS model, while the Ryzen 7 7840HS model is available for pre-sale at 2,499 yuan ($347). Global release details for this new AOOSTAR gaming mini PC have not been disclosed yet.
Tags: AMD Ryzen, AOOSTAR GEM12 Pro Mini, Gaming Mini PC
March 2, 2024
AOOSTAR GEM12 Pro Mini Gaming PC: Ryzen 7 8845HS, Fingerprint Scanner, Built-in Screen
AOOSTAR recently introduced a fresh mini PC in the Chinese market known as the GEM12 Pro. This petite computing device is tailored for gamers seeking to optimize space without compromising on performance. What sets it apart is its integrated screen and fingerprint scanner.
Specifications and Features
The GEM12 Pro is powered by robust AMD Ryzen processors, with choices such as the Ryzen 7 8845HS. With a capacity of up to 32GB of RAM and 1TB of storage, it offers speed and ample space suitable for most games and applications. Its built-in Radeon 780M graphics contribute to seamless gaming experiences.
Unique Attributes
One standout feature of this mini PC is its screen, capable of displaying system information or personal images, along with a fingerprint scanner for convenient and secure logins. Additionally, it features an OCuLink port for connecting to an external graphics dock, enhancing gaming performance. The GEM12 Pro also includes various ports for device and display connections.
Cooling System and Pricing
AOOSTAR has integrated a cooling system named “Glacier 3.0” into the GEM12 Pro, ensuring optimal performance even under heavy workloads. The initial price for the base model of the GEM12 Pro starts at 2699 yuan (approximately $347) in China. Although currently exclusive to China, AOOSTAR typically expands its product availability globally, hinting at potential access in other countries soon.
Tags: AOOSTAR GEM12 Pro Mini, Radeon 780M, Ryzen 7 8845HS
March 1, 2024
HDMI Forum Denies AMD’s Linux Driver Support for HDMI 2.1
AMD’s efforts to improve its open-source Linux graphics driver (AMDGPU) by incorporating HDMI 2.1 features have faced a significant obstacle. Despite extensive internal development aimed at enabling crucial functionalities such as 4K@120Hz and 5K@240Hz, the HDMI Forum has rejected AMD’s proposal.
AMD’s Proposal Rejected
The rejection has implications for Linux users with newer AMD Radeon graphics cards, who may find themselves unable to fully exploit the capabilities of HDMI 2.1-enabled displays. AMD conveyed its disappointment with the Forum’s decision, emphasizing that achieving an open-source HDMI 2.1 implementation would be unfeasible without infringing upon HDMI Forum stipulations.
Legal and Compliance Concerns
The HDMI Forum justified its decision based on legal and compliance concerns related to the open-source dissemination of the HDMI 2.1 specification. This development underscores the challenges encountered by open-source HDMI developers following the HDMI Forum’s move to restrict its specifications in 2021.
Recommendation for Linux Users
Consequently, the latest HDMI features are expected to remain inaccessible through open-source drivers. AMD’s suggestion for Linux users seeking features like high-refresh-rate 4K gaming is to opt for DisplayPort connections as an alternative.
Windows Users Unaffected
In contrast, Windows users with AMD graphics will continue to enjoy full HDMI 2.1 functionality, underscoring a disparity within the open-source development landscape. This discrepancy also sheds light on potential tensions within the relationship between AMD and the HDMI Forum.
Uncertain Future for Linux Users
The rejection raises questions about whether Linux users with AMD graphics will ever harness the full potential of next-generation HDMI 2.1 displays. Currently, both AMD and the HDMI Forum seem entrenched in their respective stances, limiting choices for consumers and leaving the situation unresolved.
Tags: amd, HDMI 2.1, Open-source development
March 1, 2024
ASUS Unveils ExpertBook B3 Flip 2024 with Intel Core i7 CPU
Asus has recently introduced the updated ExpertBook B3 Flip 2024 flipbook, focusing on substantial enhancements, particularly in the Intel Core 5/7 processor segment. The pricing for the ExpertBook B3 Flip has not been disclosed yet, but it promises a range of features aimed at improving productivity, connectivity, and overall user experience. ASUS is expected to unveil the pricing details of this refreshed ExpertBook soon.
Versatile Design of ASUS ExpertBook B3 Flip 2024
The ExpertBook B3 Flip is centered around its adaptable design, showcasing a 360° any-position hinge that allows for complete display flexibility. This unique hinge design enables users to seamlessly transition between laptop, tablet, tent, and stand modes, catering to diverse usage scenarios. Additionally, the inclusion of a world-facing camera offers a new perspective, while the fast-charging garaged stylus provides intuitive input for enhanced productivity.
Processor Options of ASUS ExpertBook B3 Flip 2024
The ASUS ExpertBook B3 Flip 2024 offers a range of processor options, including:
- Intel® Core™ 7 processor 150U 1.8 GHz (12MB cache, 10 cores)
- Intel® Core™ 5 processor 120U 1.4 GHz (12MB cache, 10 cores)
- Intel® Core™ 3 processor 100U 1.2 GHz (10MB cache, 6 cores)
- Intel® Core™ i7-1355U processor 1.7 GHz (12MB cache, up to 5.0 GHz, 10 cores)
- Intel® Core™ i5-1335U processor 1.3 GHz (12MB cache, up to 4.6 GHz, 10 cores)
- Intel® Core™ i3-1315U processor 1.2 GHz (10MB cache, up to 4.5 GHz, 6 cores)
The device does not offer an option for dedicated graphics but features a 1080P 60Hz 14-inch IPS touchscreen, available in 250 nit/400 nit versions with 45% NTSC and 72% NTSC color gamuts, catering to individual preferences. Furthermore, a wide array of interfaces, including Thunderbolt 4, USB-A, RJ45, Micro-SD, and audio interfaces, ensure versatile connectivity options for users.
Advanced Features and Connectivity of ASUS ExpertBook B3 Flip 2024
The ExpertBook B3 Flip prioritizes health protection with ASUS Antibacterial Guard and a TÜV Rheinland-certified display, promoting everyday eye care and hygiene. Advanced connectivity options include WiFi 6E technology enhanced by ASUS WiFi Master technology and optional fast 4G LTE nano-SIM support for seamless on-the-go connectivity.
One of the standout features of the ExpertBook B3 Flip is its advanced noise-cancelation technology, designed to enhance remote learning and conferencing experiences. The notebook incorporates two-way AI-based noise-canceling technology that utilizes sophisticated machine-learning algorithms to eliminate background noise, ensuring clear voice calls and video chats. Additionally, innovative 3D noise-cancellation (3DNR) technology and a physical webcam shield contribute to improved video-conferencing and remote-learning experiences.
Durability and Reliability of ASUS ExpertBook B3 Flip 2024
Built to withstand daily challenges, the ExpertBook B3 Flip boasts MIL-STD 810H certification, having undergone rigorous pressure and drop tests. Reinforced processes enhance durability and reliability, while a waterproof layer protects against liquid spills. Moreover, antibacterial coatings on the keyboard and palm rest prevent bacterial infestation, ensuring a hygienic user experience.
Tags: Advanced Connectivity, ASUS ExpertBook B3 Flip 2024, Productivity Enhancements
March 1, 2024
Lenovo Laptop Featuring Snapdragon X Elite Processor Seen on Geekbench
Qualcomm introduced the Snapdragon X Elite processor in October 2023, paving the way for its incorporation into upcoming Windows laptops in 2024. This advanced processor is centered around the custom-designed Qualcomm Oryon CPU, offering enhanced performance capabilities compared to its industry peers.
Performance Benchmarks Revealed
Recent evaluations of a Lenovo laptop equipped with this processor have sparked interest as the results fall below Qualcomm’s initial claims. In Geekbench 6.2 tests, the Snapdragon X Elite achieved 1,628 points for single-core performance and 11,392 points for multi-core tasks. These scores notably lag behind Qualcomm’s published benchmark results of 2,777 for single-core and 14,056 for multi-core at 23 Watts, rising to 2,966 and 15,239 respectively at 80 Watts.
Unveiling the Snapdragon X Elite’s Potential
The precise power consumption of this chip remains undisclosed, though the configuration confirms an 8+4 CPU core setup. The underperformance observed in the benchmarks hints at potential issues with inconsistent clock speeds, suggesting that the chip might be a pre-production sample requiring adjustments.
Further Insights into Performance
In individual assessments focusing solely on the chip, it exhibited improved performance, achieving a single-core score of 2,574 and a multi-core score of 12,562. This variance suggests that the initial Lenovo laptop used for testing may need further enhancements to optimize its performance.
GPU and System Specifications
Furthermore, the tested Lenovo laptop features an unspecified Adreno GPU, which also showed subpar performance in benchmarks, likely due to the chip’s pre-production stage. The GPU scored only 10 points in the Geekbench OpenCL benchmark. The laptop operates with 32GB of RAM and runs on a Windows 11 Pro Insider Preview build.
Final Thoughts
While the Snapdragon X Elite processor shows potential for Windows laptops, the initial benchmark results underscore the necessity for Qualcomm to conduct optimization efforts before the chip is market-ready.
Details regarding pricing and availability of the Snapdragon X Elite processor are yet to be revealed.
Tags: Benchmark performance, Lenovo laptop, Qualcomm Snapdragon X Elite