Honor is set to launch the highly anticipated Honor Magic 6 RSR Porsche Design in March, according to a reliable leaker from China. This device will be the second collaboration between Honor and Porsche Design, following the release of the Magic V2 RSR Porsche Design foldable phone last month.
The Magic 6 RSR Porsche Design will be powered by the Snapdragon 8 Gen 3 chipset, which is also featured in the Honor Magic 6 and Magic 6 Pro flagship phones. Meanwhile, its rival, the Huawei P70, is expected to be equipped with a new Kirin chipset, possibly the 9000s chip or its new variant.
One of the standout features of the Huawei P70 is its 50-megapixel Sony LYT-900 camera sensor, which is also present in other upcoming smartphones such as the Oppo Find X7 Ultra, Xiaomi 14 Ultra, and Vivo X100 Ultra. On the other hand, the Honor Magic 6 RSR Porsche Design will be the first phone to sport the one-inch OmniVision OV50K camera sensor. Unfortunately, further details about the smartphone are still unknown at this time.
In addition to the Magic 6 RSR Porsche Design, the leaker mentioned the existence of the Magic 6 Pro+. However, no information regarding its specifications has been shared. It is expected that both the Pro+ and RSR Porsche Design will be unveiled together in March.
Overall, smartphone enthusiasts are eagerly awaiting the launch of the Honor Magic 6 RSR Porsche Design, which promises to be a powerful and innovative device. With its top-of-the-line specifications and collaboration with Porsche Design, this flagship phone is sure to make a statement in the market.
