Honor is preparing to launch its first ever flip foldable smartphone, the Magic Flip. A recent leak has provided details about the launch timeline and design of the device.
Honor Magic Flip Launch Timeline & Live Image
According to a leak on Weibo, the Magic Flip is expected to be released during China’s Spring Festival, which will take place between February 10th and 17th, 2024. The leak also includes an image that showcases the rear design of the phone.
The leaked picture reveals that the Magic Flip features two circular ring modules on the back. The top module is likely to house the image sensors, while the lower one is expected to sport the external cover display. The design of the phone is reminiscent of clamshell folding phones from Huawei, Honor’s former parent company.
The Magic Flip is said to be powered by a 4,500mAh battery pack, which consists of a 2,420mAh + 1,980mAh dual-cell battery.
It’s important to note that this information is based on an unconfirmed report, so it should be taken with a pinch of salt. More updates will be provided as additional details become available.