Tag: Dimensity 9500

  • Honor Magic 8 Pro Air: Slim 6.1mm Flagship with 5500mAh Battery

    Honor Magic 8 Pro Air: Slim 6.1mm Flagship with 5500mAh Battery

    Key Takeaways

    1. Honor has launched the Magic 8 Pro Air in China, competing with the iPhone Air and Galaxy S25 Edge, and offers better specifications than Samsung’s flagship.
    2. The device features the MediaTek Dimensity 9500 chipset, up to 16GB of RAM, and 1TB of storage, all in a slim design of 6.1mm and weighing 155g.
    3. It boasts a premium display with ultra-narrow bezels of 1.08mm and a peak brightness of 6,000 nits, along with a 3D ultrasonic fingerprint sensor.
    4. The camera system includes a 50MP main lens, a 64MP telephoto lens with 3.2x optical zoom, a 50MP ultrawide camera, and a 50MP front-facing camera.
    5. The phone has a 5,500mAh battery, IP68/IP69 dust and water resistance, 120Hz refresh rate, 50W wireless charging, and a starting price of approximately $645 in China.


    After several days of anticipation, Honor has formally revealed the Magic 8 Pro Air in China. This new device competes with popular models like the iPhone Air and Galaxy S25 Edge. Notably, Honor’s sleek phone boasts a superior set of specifications compared to Samsung’s recent flagship.

    Specifications and Performance

    The device is powered by the Dimensity 9500, which is MediaTek’s latest flagship SoC. Honor has equipped the Magic 8 Pro Air with up to 16GB of RAM and 1TB of storage. However, these performance-driven features are not the only impressive aspects; the design is also a key selling point. The smartphone is advertised as being 6.1mm thick and weighing a mere 155g, though it remains uncertain if this thickness includes the camera bump.

    Display Features

    On the front side, Honor emphasizes that the Magic 8 Pro Air showcases a premium display with “ultra-narrow” bezels. The bezels are said to be just 1.08mm thick, and the screen is capable of reaching a peak brightness of 6,000 nits. Additionally, it includes a 3D ultrasonic fingerprint sensor and various screen protection features to enhance durability.

    Camera Capabilities

    Honor also draws attention to the camera arrangement of the Magic 8 Pro Air. The rear camera setup consists of three lenses, with the primary one being a 50MP shooter that has a size of 1/1.3 inches and an f/1.6 aperture. Accompanying it is a 64MP telephoto lens with 3.2x optical zoom, and a 50MP ultrawide camera. For selfies, there’s a 50MP front-facing camera as well.

    Battery and Additional Features

    Despite its thin and lightweight design, the phone is equipped with a substantial battery rated at 5,500mAh. For comparison, the iPhone Air measures 5.6mm at its thinnest and is fitted with a 3,124mAh battery that, based on user feedback, often fails to deliver all-day battery life.

    The Magic 8 Pro Air also boasts IP68 and IP69 ratings for dust and water resistance, a 120Hz refresh rate along with 4320Hz PWM dimming, 50W wireless charging, and support for 80W wired charging (with the 160W Anker Prime Charger currently priced at $115.99 on Amazon). The starting price in China is CNY 4,499, which is approximately $645, while the highest-end version is priced at CNY 5,499, roughly $789. Honor has not yet confirmed when the Magic 8 Pro Air will be available globally.

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  • Oppo Find X9s Leak: Key Specs of Dual 200 MP Camera Flagship

    Oppo Find X9s Leak: Key Specs of Dual 200 MP Camera Flagship

    Key Takeaways

    1. The Oppo Find X9s series is expected to launch in early 2026, with leaks suggesting key specifications.
    2. The non-Pro version will feature a flat 6.3-inch OLED display with a built-in 3D ultrasonic fingerprint sensor.
    3. The phone is rumored to have a dual 200 MP camera setup, including a main HP5 sensor and a telephoto lens.
    4. It is expected to have a battery capacity of over 7,000 mAh and offer full water resistance.
    5. The Find X9s will likely be one of the first smartphones to use the Dimensity 9500+ chipset, competing directly with the Vivo X300s.


    The Oppo Find X9s series is anticipated to be released in early 2026. Although the company hasn’t revealed any details yet, a recent leak has provided insight into the specifications of what is thought to be the non-Pro version of the phone. This information comes from a trusted source on Weibo, known as Digital Chat Station, and indicates that the device will feature a flat 6.3-inch display.

    Display and Camera Features

    According to the leak, this OLED screen will include a 3D ultrasonic fingerprint sensor built into it. Interestingly, Digital Chat Station has mentioned that the Find X9s will be equipped with a dual 200 MP camera setup. The information suggests that the main camera will be a 200 MP HP5, alongside a similar telephoto sensor.

    Previous reports from the same tipster indicated that the Find X9s might be launching with an IMX09E as the primary camera and the IMX09A as the telephoto lens. This raises the possibility that Oppo has made some changes recently in their plans.

    Battery and Specifications

    In the most recent updates, Digital Chat Station has revealed that the Find X9s will come with a larger battery capacity of over 7,000 mAh, representing a significant enhancement compared to its predecessor (with 16/256 GB currently priced at $561.6 on TradingShenzhen). There are also indications of “full water resistance,” and the phone is expected to be one of the first to utilize the Dimensity 9500+ chipset.

    The launch is projected for early 2026, and this smartphone is set to directly compete with the Vivo X300s. More information about the Oppo Find X9s series is likely to surface in the near future.

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  • Redmi K90 Pro Key Spec Leaked Before Official Announcement

    Redmi K90 Pro Key Spec Leaked Before Official Announcement

    Key Takeaways

    1. Xiaomi has launched the Redmi K90 and K90 Pro Max in October 2025, with more models expected, including the K90 Pro and K90 Ultra.
    2. The K90 Pro prototype features a 6.6-inch display, similar in size to the Redmi K80 Pro’s 6.67-inch screen.
    3. The K90 Pro is rumored to use the Dimensity 9500 processor, while the K90 Ultra may feature the upgraded Dimensity 9500+.
    4. The K90 Ultra is expected to launch around mid-2026, coinciding with MediaTek’s release of its Plus version of the flagship SoC.
    5. There is no confirmed launch date for the K90 Pro, but it may debut in China early next year if not released by December 2025.


    Xiaomi has unveiled the Redmi K90 and K90 Pro Max in October 2025, but the series is still not finished. There are rumors that at least two more models are on the way: the K90 Pro and the K90 Ultra. A reliable leaker from Weibo known as Digital Chat Station has already shared some initial information about the K90 Ultra, and recently, a significant specification for the K90 Pro has also been revealed.

    Display Details

    The information comes from another well-known Weibo leaker, Smart Pikachu. According to this leak, the phone’s current prototype has a 6.6-inch screen, which means the new device will maintain a similar size as the Redmi K80 Pro.

    Looking back, the Redmi K80 Pro had a 6.67-inch display and was equipped with the Snapdragon 8 Elite (the OnePlus Pad 3 also uses the same SoC, currently priced at $579.99 on Amazon). However, the next phone might see a considerable upgrade regarding its processor. Early rumors indicate that Xiaomi might opt for a Dimensity flagship SoC rather than the Qualcomm’s 8 Elite Gen 5.

    Processor Changes

    Recent reports suggest that the Redmi K90 Pro will run on the Dimensity 9500, while the K90 Ultra is expected to feature the Dimensity 9500+. If this information is accurate, the K90 Ultra might be launched around the middle of 2026, as this is typically when MediaTek rolls out the Plus version of its latest flagship SoC.

    As for when the Redmi K90 Pro might be launched, there’s currently no solid information available. Yet, if Xiaomi doesn’t release it before December 2025, it could potentially debut in China early next year.

     

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  • Honor Magic 8 Mini: Key Specs of Upcoming Slim Phone Revealed

    Honor Magic 8 Mini: Key Specs of Upcoming Slim Phone Revealed

    Key Takeaways

    1. Honor introduced the Magic 8 series in October, including the standard Magic 8 and Magic 8 Pro.
    2. Rumors suggest a new compact flagship phone, likely named the Magic 8 Mini, with a slim design of about 5–6 mm.
    3. The Magic 8 Mini is expected to have a 6.31-inch flat LTPO display with a 1.5K resolution and a possible 200MP main camera.
    4. It will run on the Dimensity 9500 chipset and may feature a battery capacity of around 5,500mAh.
    5. There is no confirmed release date for the Magic 8 Mini; however, Honor will launch the Honor 300 series on November 24 in China.


    Honor introduced the Magic 8 series in October, which includes the standard Magic 8 and the more advanced Magic 8 Pro. Rumors are now swirling about a new compact flagship phone that hasn’t been officially named yet, but it is believed to be called the Magic 8 Mini.

    Key Specifications Leaked

    A recent leak from the tipster Digital Chat Station has disclosed some important details based on a pre-production model. This leak indicates that the new phone will have a compact design with a slim profile of about 5–6 mm.

    The device is expected to sport a 6.31-inch flat LTPO display that boasts a 1.5K resolution. There’s buzzing talk about a possible 200MP main camera, although the tipster hints that a 50MP 1/1.5″ sensor might be the choice instead. On the brighter side, it is rumored to come equipped with a telephoto lens.

    Performance Expectations

    In line with earlier leaks, the Honor Magic 8 Mini is anticipated to run on the Dimensity 9500 chipset. However, the slim design might lead to a battery capacity of roughly 5,500mAh.

    For reference, the Vivo X300 also features a 6.3-inch display and is powered by the Dimensity 9500 processor. Nonetheless, the Vivo device houses a bigger 6,040mAh battery but is thicker, measuring at 8 mm. Other premium compact smartphones are expected to debut soon, such as the Oppo Find X9s, iQoo 15 Mini, and OnePlus 15T. Still, the Honor Magic 8 Mini might catch attention with its sleeker design.

    Release Date Still Unknown

    As of now, there’s no definite release date for the Magic 8 Mini. In other developments, the company plans to launch the Honor 300 series on November 24 in China.

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  • Apple A19 Pro Die Shot Reveals Smaller Chip with Subtle Design Changes

    Key Takeaways

    1. Apple has reduced the die area of its A19 Pro from 105 mm² to 98.6 mm² using TSMC’s advanced N3P node.
    2. The A19 Pro features six GPU cores and maintains a similar design structure to its predecessors, the A18 Pro and A17 Pro.
    3. MediaTek increased its die area to meet performance goals, while Qualcomm kept a similar die size.
    4. Future A20/A20 Pro models are expected to use TSMC’s N2 node with a gate-all-around design for higher transistor density.
    5. The advancements in SoC technology reflect ongoing improvements in performance and efficiency in semiconductor design.


    After sharing thorough teardowns of the Snapdragon 8 Elite Gen 5 and Dimensity 9500, semiconductor specialist @KurnalSalts has now revealed a detailed die image of Apple’s newest flagship SoC, the A19 Pro. MediaTek had to increase die area to comply with performance goals. Conversely, Qualcomm managed to maintain a similar die size.

    Apple’s Die Area Reduction

    In contrast, Apple has actually decreased its die area from 105 mm² to 98.6 mm². This achievement is largely due to utilizing TSMC’s advanced N3P node, which enables Apple to fit more transistors within the same space. The A19 Pro variant discussed here is the full version, featuring six GPU cores. Design-wise, not much has shifted, as the A19 Pro essentially retains the same structure as the A18 Pro (TSMC N3E) and A17 Pro (TSMC N3B) that came before it.

    Future Developments in SoC Design

    We might observe some variations in the forthcoming A20/A20 Pro, since it is anticipated to utilize TSMC’s N2 node – a first in using a gate-all-around design. This innovation will allow for even greater transistor density, which should lead to a significant boost in performance.

     

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  • Snapdragon 8 Elite Gen 5 Outperforms Dimensity 9500 in AnTuTu

    Snapdragon 8 Elite Gen 5 Outperforms Dimensity 9500 in AnTuTu

    Key Takeaways

    1. The Snapdragon 8 Elite Gen 5 is the top performer in AnTuTu’s October 2025 rankings, outperforming competitors like the Dimensity 9500.
    2. All five of the top ten smartphones in the performance chart are powered by Qualcomm’s latest high-end SoC.
    3. MediaTek’s Dimensity 9500 debuted in the rankings, securing the sixth position with one of its devices.
    4. AnTuTu rankings are based on at least 1,000 valid benchmark tests per device.
    5. Synthetic benchmarks are just one part of the assessment; factors like camera quality, display, and battery life also matter in smartphone evaluations.


    The performance chart for flagship devices from AnTuTu for October 2025 has been released, showing that the Snapdragon 8 Elite Gen 5 is leading the pack, clearly outperforming the Dimensity 9500. Specifically, all five of the top ten smartphones listed are equipped with Qualcomm’s latest high-end system-on-chip (SoC).

    MediaTek’s Entry

    In this ranking, MediaTek’s Dimensity 9500 marks its debut, coming in at the sixth position through one of the devices. Below are further insights regarding the smartphones and their rankings in the performance chart:

    AnTuTu Rankings Explained

    It’s essential to understand that the monthly performance rankings from AnTuTu are created by taking into account several criteria. One of these is that each phone must complete at least 1,000 valid benchmark tests. Additionally, it’s important to remember that synthetic benchmarks are only part of the overall assessment. Other significant factors, such as the quality of the camera, the display, and battery life, should also be weighed when deciding on a purchase.

     

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  • Vivo X300 Pro Global Launch: Pro Camera and Telephoto Kit

    Vivo X300 Pro Global Launch: Pro Camera and Telephoto Kit

    Key Takeaways

    1. Vivo launched the X300 series globally, with the X300 Pro as the flagship model featuring the Dimensity 9500 chip.
    2. The global version of the X300 Pro has a smaller battery (5,440 mAh) compared to the Chinese version (6,510 mAh), but supports 40 W wireless and 90 W wired fast charging.
    3. The camera setup includes a 50 MP main camera, a 200 MP telephoto lens, and a 50 MP ultrawide lens, enhanced by the Pro Imaging Chip VS1 for better photo quality.
    4. Vivo offers a photography kit outside China, including a ZEISS 2.35x telephoto extender for improved zoom capability.
    5. The X300 Pro features a 6.78-inch display with a 120 Hz refresh rate, IP68/69 water and dust resistance, and comes with 16 GB of RAM and 512 GB of storage, priced at €1,399 in Europe.


    Vivo has launched the X300 series worldwide, with the X300 Pro being the brand’s top flagship smartphone. It runs on the Dimensity 9500, which is the latest high-performance chip from MediaTek. However, the global version has a smaller battery compared to the Chinese variant.

    Battery Specifications

    To give you some context, the Chinese Vivo X300 Pro comes with a 6,510 mAh battery, whereas the international version has a 5,440 mAh battery. On the bright side, the global model still supports 40 W wireless charging and 90 W wired fast charging (145 W Baseus 20K power bank currently priced at $69.99 on Amazon).

    Camera Features

    The camera setup is identical to its Chinese counterpart. It includes a 50 MP Sony LYT-828 main camera on the rear, alongside a 200 MP Samsung HPB telephoto lens and a 50 MP JN1 ultrawide lens. Vivo emphasizes that these cameras are powered by the Pro Imaging Chip VS1, which is designed to deliver sharp details, brighter low-light photos, and high-quality videos. The images we took with this phone (shown below) are indeed quite impressive.

    Photography Kit

    Moreover, Vivo has made its photography kit available outside of China. One option includes the ZEISS 2.35x telephoto extender kit, which, as its name implies, enhances the zoom capability of the telephoto sensor. Based on our experiments, the teleconverter does provide detailed zoomed images, particularly in bright daylight.

    Additional Features

    On the front side, the Vivo X300 Pro sports a 50 MP Samsung JN1 selfie camera. Other notable features of this flagship smartphone are its 6.78-inch display with a 120 Hz refresh rate, USB 3.2 Gen 1 Type-C connection, IP68/69 ratings for water and dust resistance, and it comes pre-installed with Android 16.

    In the European market, the Vivo X300 Pro is offered with 16 GB of RAM and 512 GB of storage, retailing at €1,399. Don’t miss our hands-on video review below for more details on this new flagship camera device.

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  • Vivo X300 Launches Globally with 200 MP Zeiss Camera and Battery Cut

    Vivo X300 Launches Globally with 200 MP Zeiss Camera and Battery Cut

    Key Takeaways

    1. Vivo has launched the X300 series camera phones featuring the Dimensity 9500 processor, available outside China.
    2. The European version of the X300 has a smaller battery (5,360 mAh) compared to the Chinese version (6,040 mAh), but both support 90 W wired and 40 W wireless fast charging.
    3. Both the X300 and X300 Pro share identical specifications, including a ZEISS camera system with a 200 MP primary camera and a 50 MP ultrawide camera.
    4. The X300 features a 6.31-inch LTPO AMOLED display with a 120 Hz refresh rate and runs on OriginOS 6 based on Android 16.
    5. The European price for the X300 (12 GB RAM, 256 GB storage) is €1,049 (about $1,214), significantly higher than the Chinese price of CNY 4,399 (about $620).


    Vivo has introduced the X300 series, which is a new generation of camera phones featuring the advanced Dimensity 9500 processor. Both the standard X300 and the X300 Pro have officially made their way to markets outside of China. Of the two, the regular X300 is the more budget-friendly option; however, it should be noted that the battery capacity in the European version is lower than that of its Chinese counterpart.

    Battery Differences

    Specifically, the non-Pro Vivo X300 in Europe is equipped with a 5,360 mAh battery, while the version launched in China has a larger 6,040 mAh battery. On the bright side, the fast charging capabilities remain impressive, featuring 90 W wired fast charging and 40 W wireless charging, which are unchanged across regions.

    Camera and Display Features

    Aside from the battery, all other specifications are identical, including the impressive ZEISS camera system. For those who might not have seen our previous Chinese reports, the Vivo X300 boasts a 200 MP HPB primary camera, a 50 MP Sony LYT-602 telephoto lens with 3x optical zoom, and a 50 MP Samsung JN1 ultrawide camera.

    On the front side, the X300 is equipped with a 50 MP Samsung JN1 camera for selfies. It also features a vibrant 6.31-inch LTPO AMOLED display with a smooth 120 Hz refresh rate. For security, there’s an ultrasonic in-display fingerprint scanner, and the device runs on OriginOS 6, which is based on Android 16 right out of the box.

    Additional Features and Pricing

    Other important features of the phone include dual stereo speakers, Bluetooth 5.4, a USB 3.2 Gen 1 Type-C port, and an IP68/69 rating for dust and water resistance. In Europe, the Vivo X300 comes with a configuration of 12 GB of RAM and 256 GB of storage, priced at €1,049, which is approximately $1,214. For comparison, the same setup is priced at CNY 4,399, or about $619.66 (with the 16/256 GB variant costing around $891.03 on TradingShenzhen).

     


     

  • MediaTek’s Upcoming High-End Dimensity Chipset Plans Revealed

    MediaTek’s Upcoming High-End Dimensity Chipset Plans Revealed

    Key Takeaways

    1. MediaTek launched the Dimensity 9500 to compete with Qualcomm’s Snapdragon 8 Elite Gen 5, currently adopted by Oppo and Vivo.
    2. MediaTek typically introduces mid-cycle updates for flagship chipsets, as seen with the Dimensity 9300 Plus and Dimensity 9400 Plus.
    3. A new chipset, possibly named ‘Dimensity 9400++’, is rumored to launch in Q1 2026, instead of a true Dimensity 9500 successor.
    4. The Dimensity 9400++ is expected to feature four ARM Cortex-A720 cores, three Cortex-X4 cores, and a Cortex-X925 prime core at 3.73 GHz.
    5. The new chipset may utilize hardware optimizations and software improvements, but further details are not yet available.


    Digital Chat Station has provided insights into the future of MediaTek’s high-end Dimensity line. Last month, MediaTek launched the Dimensity 9500, which competes with Qualcomm’s Snapdragon 8 Elite Gen 5. Currently, only Oppo and Vivo have adopted the Dimensity 9500 for their Find X9 and X300 series devices, respectively.

    Upcoming Chipset Refresh

    MediaTek usually launches a mid-cycle update for its flagship mobile chipsets at some point. For example, the Dimensity 9300 Plus was introduced in July 2024, eight months after the original Dimensity 9300. Similarly, MediaTek enhanced the Dimensity 9400 by releasing the Dimensity 9400 Plus in the spring, which now powers devices like the Samsung Galaxy Tab S11 and Galaxy Tab S11 Ultra, currently priced at $1,149.99 on Amazon. Among these models is the Dimensity 9400e, a slower version of the 9400 that made its debut a month after the standard model.

    Rumored Launch Details

    Digital Chat Station suggests that MediaTek might follow a similar pattern with the Dimensity 9500 series, hinting at a new chipset launch early next year. On Weibo, the leaker mentioned that MediaTek is planning to announce what it calls a ‘Dimensity 9400++’ in Q1 2026, rather than a true Dimensity 9500 chipset. This new unnamed chipset is expected to return to TSMC’s N3E node, which is used for the Dimensity 9400 Plus, rather than the newer Dimensity 9500.

    Specifications of the Dimensity 9400++

    The alleged Dimensity 9400++ is said to include four ARM Cortex-A720 efficiency cores, three Cortex-X4 cores, and a single Cortex-X925 prime core running at 3.73 GHz, similar to its predecessor. Additionally, Digital Chat Station anticipates that the unreleased chipset will maintain the Immortalis-G925 MC12 GPU clocked at 1,612 MHz. MediaTek is reportedly looking to set the Dimensity 9400++ apart from its existing chipset through hardware optimizations and software improvements. Unfortunately, Digital Chat Station has not provided any further details on this matter yet.

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  • Oppo Find X9s Leaks: Compact Rival to OnePlus 15T & Vivo X300

    Oppo Find X9s Leaks: Compact Rival to OnePlus 15T & Vivo X300

    Key Takeaways

    1. The Oppo Find X9 series includes the regular X9 and X9 Pro models, with rumors of an additional Find X9s variant.
    2. The Find X9s is expected to feature a 6.3-inch LTPS display with a 1.5K resolution and flat design.
    3. It may be powered by the MediaTek Dimensity 9500+ chipset, an overclocked version of the existing Dimensity 9500.
    4. A triple rear camera system is anticipated, including a 50MP primary sensor and a periscope telephoto lens.
    5. The Find X9s could have a 7,000mAh battery, ultrasonic fingerprint scanner, and wireless charging, competing with devices like the Vivo X300.


    The Oppo Find X9 series was just revealed in China, consisting of the regular X9 and the X9 Pro models. Rumors suggest that more versions, like the Oppo Find X9s, might be on the way. Before any official word comes out, a leak has shared significant information about this new compact flagship smartphone.

    Display Features

    According to a reliable source on Weibo, known as Digital Chat Station, the Find X9s is likely to have a 6.3-inch LTPS display with a resolution of 1.5K. The screen is expected to be flat, featuring rounded corners and sleek symmetrical bezels.

    Performance and Specs

    The anticipated flagship device may come equipped with the MediaTek Dimensity 9500+ chipset, which is rumored to be an overclocked variant of the existing Dimensity 9500. This SoC is already used in the Find X9 and X9 Pro models.

    The Oppo Find X9s is expected to sport a triple rear camera system, with a primary 50MP sensor from the IMX9 series currently under testing. Additionally, it will include a periscope telephoto lens for enhanced photography capabilities.

    Battery and Competition

    Earlier predictions from the tipster indicated that the phone might house a battery of around 7,000mAh, which is noticeably larger compared to the Vivo X300’s 6,040mAh battery. The Find X9s could also include an ultrasonic fingerprint scanner and offer wireless charging capabilities.

    This compact flagship positioning means it will compete against devices like the Vivo X300, which features a similar 6.3-inch display and runs on the Dimensity 9500 chipset. Another compact option, the OnePlus 15T, is rumored to be in development as well.

    The tipster mentions that the Oppo Find X9s might launch next year, although a specific release date has not yet been disclosed. In the meantime, Oppo is preparing to release the standard Find X9 and the X9 Pro globally on October 28.