Tag: Dimensity 9500

  • MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

    MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

    Key Takeaways

    1. The Dimensity 9500 is expected to score 3,900 in single-core and 11,000 in multicore Geekbench tests, showing competitive performance despite lagging behind Qualcomm and Apple’s chips.
    2. It features a 16 MB L3 cache and a 10 MB System Level Cache, along with LPDDR5X-10677 MT/s memory and support for four-lane UFS 4.1 storage.
    3. The Dimensity 9500 is projected to be 49% faster in single-core and 36% faster in multicore performance compared to its predecessor, the Dimensity 9400.
    4. These performance gains may indicate a significant redesign in Arm’s architecture, particularly with the new Cortex-X925 (Lumex).
    5. The Dimensity 9500 is anticipated to launch in late September, potentially setting new standards in high-performance mobile processors.

    Weibo leaker Digital Chat Station, or DCS for short, recently shared insights on how the Apple A19 Pro and Snapdragon 8 Elite 2 will stack up against their predecessors. With the future of the Exynos 2600 being unclear, the only major player left in the high-end smartphone SoC arena is MediaTek’s Dimensity 9500. If DCS’s predictions hold true, it may fall just short of its rivals.

    Performance Insights

    The Dimensity 9500 is said to achieve scores of 3,900 in Geekbench’s single-core tests and 11,000 in multicore tests. While the single-core score is a bit behind Qualcomm and Apple’s offerings, the multicore score indicates it remains relevant in the competitive landscape. It will feature a 16 MB L3 cache and a 10 MB System Level Cache (SLC) for the GPU and other components. For memory, it will utilize LPDDR5X-10677 MT/s modules. It’s also compatible with four-lane UFS 4.1 storage.

    Benchmark Comparisons

    As per our benchmark database, the Dimensity 9400 averages scores of 2,605 and 8,078 in Geekbench 6.4. If DCS’s figures are on point, the Dimensity 9500 is expected to be 49% faster in single-core performance and 36% faster in multicore performance. These projections are exceptionally high and nearly impossible to achieve with just a slight node upgrade (from TSMC N3E to N3P). This suggests that Arm has a significant redesign in the works with the Cortex-X925, now referred to as Lumex. Ideally, we should see the SoC make an appearance on a benchmarking platform before its anticipated launch in late September.

    Conclusion

    Digital Chat Station on Weibo has provided these updates, giving us a glimpse into the future of high-performance mobile processors. The advancements in the Dimensity 9500 could set a new standard in the market, making it an exciting development to watch as it approaches its release.

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    MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

     

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  • Oppo Find X9 and X9 Pro to Get Major Design Overhaul Soon

    Oppo Find X9 and X9 Pro to Get Major Design Overhaul Soon

    Key Takeaways

    1. The Oppo Find X8 series competes with the Vivo X200 lineup, both featuring the Dimensity 9400 chipset and round camera designs.
    2. Upcoming versions aim to challenge Vivo’s X300 series, utilizing the new Dimensity 9500 technology.
    3. Design changes may include corner-positioned cameras, similar to OnePlus 13 models and Vivo S30 Pro Mini.
    4. The series is expected to have two models, likely the Find X9 and X9 Pro, with a possible Plus version.
    5. The premium Find X9 Ultra may launch later with the Qualcomm Snapdragon 8 Elite 2 processor.

    The Oppo Find X8 series has been in competition with the Vivo X200 lineup, both being among the first to use the Dimensity 9400 chipset and featuring prominent round camera humps along with premium specs.

    Upcoming Rivals

    Their upcoming versions are expected to challenge Vivo’s X300 series for the title of the first smartphones to utilize the Dimensity 9500 technology. However, there may be a shift in design, as suggested by the reliable leaker, Digital Chat Station.

    Design Changes

    According to the leak, the Find X9 series could adopt corner-positioned cameras, similar to the recent OnePlus 13 models or even the Vivo S30 Pro Mini.

    The new devices are likely to keep the flat screen design of their predecessors, but with potentially thinner bezels thanks to advanced LIPO tech.

    Variants and Expectations

    Interestingly, the rumor mentions two models in different sizes, likely the Find X9 and X9 Pro, while a Plus version may also be included in the series.

    It will be fascinating to see if the design enhancements will also apply to the premium Find X9 Ultra, which could be released later with the more powerful Qualcomm Snapdragon 8 Elite 2 processor.

    The OnePlus 13T has now launched and is available in Europe through TradingShenzhen, adding to the competitive landscape of high-end smartphones.

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  • MediaTek Dimensity 9500 Set to Outperform Snapdragon 8 Elite 2

    MediaTek Dimensity 9500 Set to Outperform Snapdragon 8 Elite 2

    Key Takeaways

    Qualcomm is set to introduce its top SoC for this year, the Snapdragon 8 Elite 2, a bit earlier than usual. However, it seems that its competitor MediaTek might get ahead of the game if recent leaks are accurate.

    MediaTek’s Early Entry

    According to the leaker Digital Chat Station, MediaTek is gearing up to unveil its Dimensity 9500 flagship chipset prior to Qualcomm’s release of the Snapdragon 8 Elite 2 this year. While the leaker hasn’t specified an exact launch date for MediaTek’s chipset, Qualcomm has already announced that its Snapdragon Summit will begin on September 23. Therefore, we can expect the Dimensity 9500 to be unveiled just before that date.

    Upcoming Device Launches

    Typically, the official launches of these two chipsets will be closely followed by the release of next-gen flagship devices using them. Models such as the Xiaomi 16, iQOO 14, and an upgraded version of the OnePlus 13 are likely to come equipped with the Snapdragon 8 Elite 2. On the other hand, the Dimensity 9500 is anticipated to be quickly adopted by the Oppo Find X9 and the Vivo X300 series.

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  • Oppo Find X9 Lineup May Skip Curved Display and Size Details Leak

    Oppo Find X9 Lineup May Skip Curved Display and Size Details Leak

    Key Takeaways

    1. The Oppo Find X9 series will include models with screen sizes of 6.59 inches and 6.78 inches, featuring flat displays instead of curved ones.
    2. There is speculation about a 6.3-inch model, which may be a compact version or a separate variant within the X9 lineup.
    3. The series is expected to have four different models, but further details are still emerging.
    4. The Find X9 devices will be powered by MediaTek’s upcoming Dimensity 9500 chip, built on a 3nm process.
    5. The Dimensity 9500 will feature advanced CPU cores and support for AI and machine learning, with a planned launch in September alongside the Find X9 series.

    Oppo is preparing to launch its Find X9 series, and leaks are starting to trickle in as we approach the anticipated fall release. One of the latest insights comes from Digital Chat Station, which shares information about the display sizes of these new phones.

    Screen Sizes Revealed

    The tipster claims that two models in the Find X9 series will sport screen sizes of 6.59 inches and 6.78 inches, likely representing the standard Find X9 and the Find X9 Pro. Notably, it appears that Oppo is moving away from the curved screens seen in the previous Find X8 series, opting instead for flat displays across the X9 lineup.

    Compact Model Possibility

    Additionally, there’s talk of a 6.3-inch model, but it’s uncertain whether this model is part of the main X9 series or if it’s a separate variant. In context, the previous Find X8s had a screen of similar size, meaning this new 6.3-inch option could either replace it or be a more compact version within the X9 family.

    The Find X9 series is said to include four different models, but details beyond the screen sizes and design are still unfolding. However, what seems to be confirmed is a significant hardware upgrade happening inside the devices.

    Hardware Upgrades on the Horizon

    Reports indicate that Oppo is gearing up to launch the series featuring MediaTek’s soon-to-be-announced Dimensity 9500 chip. This new processor is rumored to be manufactured using TSMC’s advanced third-generation 3nm process (N3P). It is expected to include a CPU architecture with one “Travis” core, three “Alto” cores, and four “Gelas” cores, along with an Immortalis-Drage GPU.

    These innovative cores are based on Arm’s latest X9 architecture, designed to support the SME (Scalable Matrix Extension) instruction set, which aims to enhance efficiency for AI and machine learning tasks. If all goes according to plan, the Dimensity 9500 is set to be unveiled in September, with the first batch of Find X9 devices likely launching at the same time.

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    Oppo Find X9 Lineup May Skip Curved Display and Size Details Leak

     

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  • OPPO Find X9 Ultra: 200MP Camera with Powerful Zoom Features

    OPPO Find X9 Ultra: 200MP Camera with Powerful Zoom Features

    Key Takeaways

    1. OPPO’s Find X9 series is expected to enhance camera quality, particularly in zoom capabilities, continuing the trend set by previous “Ultra” models.
    2. The new OPPO Find X9 series may feature the MediaTek Dimensity 9500 SoC for improved performance, differing from the Snapdragon chipset used in the Find X8 Ultra.
    3. The Find X9 Ultra could include a significant camera upgrade with a dual-periscope lens setup featuring a 50MP and a 200MP sensor.
    4. There is potential for the inclusion of a spectral image sensor in the Find X9 Pro or standard Find X9 models, aimed at improving color accuracy.
    5. The details about the OPPO Find X9 series are based on leaks and are not officially confirmed yet, hinting at strong performance and camera features.

    In the last few years, OPPO’s top-tier smartphones have become known for their outstanding camera features, particularly the “Ultra” versions. A new leak indicates that the OPPO Find X9 series will continue this trend, aiming for even better camera quality, particularly in zoom capabilities.

    New Chipset for Enhanced Performance

    As per trusted Weibo leaker Digital Chat Station, the OPPO Find X9 series is likely to include the cutting-edge MediaTek Dimensity 9500 SoC. This robust chipset guarantees a fast and smooth user experience. Unlike the Find X8 series, where the “Ultra” model utilized a Snapdragon flagship SoC, the OPPO Find X9 Ultra might also be equipped with Dimensity technology.

    Exciting Camera Features Ahead

    If you are keen on optical zoom, the OPPO Find X9 Ultra may feature significant camera upgrades. Reports indicate that the company is working on a prototype that incorporates a 50MP and a 200MP dual-periscope lens setup. This would specifically include Samsung’s ISOCELL JN5 and ISOCELL HP5 sensors. To compare, the current Find X8 Ultra comes with two 50MP periscope lenses. However, it’s important to note that the final sensors for the production version still haven’t been officially finalized.

    Potential New Technologies

    An intriguing prospect is the possible inclusion of the Find X8 Ultra’s spectral image sensor in the more budget-friendly Find X9 Pro or even the standard Find X9 models. This component is effective for improving color accuracy and better representation of skin tones.

    While these details are based on leaks and not yet official confirmations, the indications for the OPPO Find X9 series point to strong performance and remarkable camera features throughout the lineup. It would be great to see more leaks about these exciting upcoming smartphones in the near future.

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  • Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked

    Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked

    Key Takeaways

    1. Qualcomm and MediaTek will launch new chipsets next month, including the Snapdragon 8s Gen 4 and Dimensity 9400+ for upcoming devices.
    2. Qualcomm’s upcoming chipsets, “SM8850” (likely Snapdragon 8 Elite 2) and “SM8845,” will be made using TSMC’s 3nm process and feature Nuvia architecture.
    3. MediaTek’s Dimensity 9500 series, including the Dimensity 9500 and budget-friendly Dimensity 9450, will also use TSMC’s 3nm N3P technology.
    4. The Dimensity 9500 is expected to have a 1+3+4 core setup with ARM’s new X9 and A7 series cores and could achieve an AnTuTu score of around 3.5 million.
    5. The Snapdragon 8 Elite-equipped Samsung Galaxy S25 Ultra is available for purchase on Amazon.

    Both Qualcomm and MediaTek are set to unveil new chipsets next month, with the Snapdragon 8s Gen 4 and Dimensity 9400+ ready to be utilized by many devices right after their release. Both firms are aiming for their upcoming flagship models, and a recent leak has disclosed additional details about the Snapdragon 8 Elite 2 and Dimensity 9500.

    Qualcomm’s Upcoming Flagships

    According to Digital Chat Station, Qualcomm plans to introduce two high-end chipsets by the end of the year, identified as “SM8850” and “SM8845.” The first one is almost certainly the Snapdragon 8 Elite 2—or whatever name the successor of Snapdragon 8 Elite will carry—while the identity of “SM8845” remains uncertain. Regardless, both chipsets will be manufactured using TSMC’s 3nm process and will continue to incorporate Qualcomm’s Nuvia architecture.

    MediaTek’s Competitive Edge

    In a similar vein, MediaTek’s Dimensity 9500 series will also be produced on TSMC’s 3nm N3P technology. There are two expected chipsets: the Dimensity 9500 and a tentatively titled Dimensity 9450. It’s likely that the “Dimensity 9450” will be a more budget-friendly, slightly less powerful alternative to the primary Dimensity 9500.

    The Dimensity 9500 is anticipated to have a 1+3+4 core setup, featuring ARM’s yet-to-be-released X9 and A7 series cores, codenamed “Travis,” “Alto,” and “Gelas.” For the GPU, MediaTek seems to stick with ARM’s Immortalis series as well. Allegedly, the Dimensity 9500 could reach an AnTuTu score around 3.5 million. In contrast, the top-performing Dimensity 9400 device in AnTuTu rankings, the Vivo X200 Pro, achieves a total score of 2.44 million—indicating this would be a notable enhancement.

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    Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked
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  • MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score

    MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score

    Key Takeaways

    1. MediaTek is expected to launch the Dimensity 9500 chip in late 2024, with engineering samples already prepared.
    2. The Dimensity 9500 features an eight-core structure (1+3+4) and aims for an AnTuTu benchmark score of around 3.5 million points.
    3. The chip will include one Cortex-X930 “Travis” core, expected to exceed 4GHz, positioning it competitively against Apple’s M4 chip.
    4. Major brands like Vivo and Oppo are set to be the first to use the Dimensity 9500 in flagship models, with potential launches as early as late September.
    5. MediaTek is also launching the Dimensity 9400 Plus next month, an overclocked version of the D9400, for various upcoming devices.

    MediaTek introduced the Dimensity 9400 chip in October 2024. There are strong rumors suggesting that the Taiwanese chipmaker is developing the Dimensity 9500, which could be launched in the final quarter of this year. A recent post on Weibo by trustworthy leaker Digital Chat Station has shared some initial insights about the D9500 chip.

    Dimensity 9500 Might Be the Top Android SoC

    Details about Dimensity 9500 shared by DCS

    The Weibo post from DCS indicates that the engineering samples for MediaTek’s upcoming chipset are prepared. As per the leak, this chip has an eight-core structure with a 1+3+4 setup, aiming for an AnTuTu benchmark score of approximately 3.5 million points. While the source didn’t directly state the chipset’s name, it seems to refer to MediaTek’s next premium processor—the Dimensity 9500.

    D9500 Will Feature One Cortex-X930 Travis Core

    Earlier, the leaker mentioned that the Dimensity 9500 would come with two Cortex-X930 “Travis” cores. However, he now indicates that there will be only one Travis core, which is expected to exceed 4GHz in performance. For single-core capability, the Dimensity 9500 might compete with Apple’s M4 chip due to features like ARM’s Scalable Matrix Extension (SME) and TSMC’s improved 3nm ‘N3P’ process.

    The informant has also suggested that although it’s not officially announced, smartphones using the Dimensity 9500 alongside Qualcomm’s Snapdragon 8 Elite 2 are likely to launch in October. Some manufacturers might even aim for a quicker release by late September, hoping to have their devices ready before November 1st.

    Major Brands to Adopt Dimensity 9500 First

    Leading brands like Vivo and Oppo are anticipated to be the first to implement the Dimensity 9500, with plans to integrate the chipset into upcoming flagship models such as the Vivo X300 and Oppo Find X8. There are also claims that the Honor Magic 9 series will include the Dimensity 9500 chip.

    In related updates, MediaTek is preparing to launch the Dimensity 9400 Plus chip next month. This chip operates at 3.73GHz and is an overclocked variant of the current D9400 chip, set to power various devices like the Oppo Find X8s, Find X8s+, Vivo X200S, Realme GT 7, iQOO Neo 10S, OnePlus Ace 5S, and Redmi K80 Ultra.

    MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score
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  • Xiaomi 16 and OnePlus 14 Launch Expected in September 2023

    Xiaomi 16 and OnePlus 14 Launch Expected in September 2023

    Key Takeaways

    1. Qualcomm and MediaTek are speeding up their flagship chipset release timelines, with the Snapdragon 8 Elite 2 and Dimensity 9500 expected to launch as early as September.
    2. The first wave of Android flagship devices, including models from Xiaomi, OnePlus, and Vivo, may debut in September, ahead of China’s National Day on October 1.
    3. The Snapdragon 8 Elite 2 and Dimensity 9500 could lead to quicker releases of flagship smartphones, similar to past trends with these companies.
    4. The new Android devices will remain exclusive to the Chinese market until 2026, following historical patterns.
    5. Next-gen Android flagships might be released shortly after the iPhone 17 series, which could impact market competition.

    Both Qualcomm and MediaTek has been rapidly advancing their flagship chipsets’ release timelines in recent years. The Dimensity 9400 and Snapdragon 8 Elite made their appearance around mid-October last year, and now it seems that their successors might come out even sooner this year.

    Upcoming Launches

    According to Digital Chat Station, the first wave of Android flagship devices is set to arrive no later than October, likely alongside the Snapdragon 8 Elite 2 and Dimensity 9500. There were earlier reports suggesting the Snapdragon 8 Elite’s successor could be released in early October, but it looks like both it and the MediaTek chipset might actually launch in September instead.

    Early Flagship Debuts

    It’s rumored that OEMs utilizing the Snapdragon 8 Elite 2 and Dimensity 9500 could hasten the release of their flagship models to September, just ahead of China’s National Day on October 1. Historically, companies like Xiaomi, OnePlus, and Vivo are the first to adopt these new chipsets, so it’s possible we could see announcements for the Xiaomi 16 series, OnePlus 14, and Vivo X300 series as early as September.

    Market Exclusivity and Timing

    While this isn’t earth-shattering news—these devices will still be exclusive to the Chinese market until 2026—it does suggest that next-gen Android flagships like the Xiaomi 16 and OnePlus 14 might hit the market just weeks after the iPhone 17 series launches. For context, both the iPhone 15 and iPhone 16 series were available in the last part of September.

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  • MediaTek Dimensity 9500: N3P Process for 2025 Flagship Chip

    MediaTek Dimensity 9500: N3P Process for 2025 Flagship Chip

    The new MediaTek Dimensity 9500 processor is going to use TSMC’s N3P process node, moving away from earlier ideas about a 2nm manufacturing method. This change seems to be due to the high costs and low production capacity, especially with Apple readying to adopt TSMC’s 2nm node for its upcoming M5 series chips.

    A Major Design Change

    The Dimensity 9500 represents a big architectural change, shifting to a 2+6 core arrangement rather than the 4+4 setup of its predecessor. The fresh layout includes two Cortex-X930 “super cores” and six Cortex-A730 performance cores, with clock speeds expected to surpass the 4 GHz mark. There’s also talk that this processor will support the SME (Scalable Matrix Extension) instruction set.

    Performance Comparison

    In contrast, the Dimensity 9400 features one 3.62 GHz Cortex-X925 super core, three 3.3 GHz Cortex-X4 large cores, and four 2.4 GHz Cortex-A720 large cores. According to industry insider Digital Chat Station, the X930 cores in the Dimensity 9500 are likely to provide significantly better single-core performance.

    Launch Timeline and Competition

    MediaTek is targeting an October 2025 release, which could lead to a competition with Samsung’s Exynos 2600, rumored to be manufactured using Samsung Foundry’s 2nm technology. Both processors may power various flagship devices, with rumors hinting that the Exynos 2600 could be at the heart of Samsung’s Galaxy Z Fold 7, Z Flip 7, and S26 series.

    While TSMC’s N3P process might not be as power-efficient as the upcoming 2nm, it still offers an upgrade over the N3E process found in the current Dimensity 9400. Choosing N3P also highlights a wider industry trend, as several leading tech firms are seemingly reconsidering their quick shift to TSMC’s 2nm node due to the high costs and limited production capacity.

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