Tag: TSMC N3P

  • Snapdragon 8 Elite Gen 5: Qualcomm’s 2nm Upgrade & Foldable Rumors

    Snapdragon 8 Elite Gen 5: Qualcomm’s 2nm Upgrade & Foldable Rumors

    Key Takeaways

    1. Qualcomm’s Snapdragon 8 Elite Gen 5 is currently made using TSMC’s N3P manufacturing process, found in flagship devices like the OnePlus 15.
    2. The N3P process offers improved transistor density, performance, and reduced power usage compared to the older N3E.
    3. Qualcomm’s CEO, Cristiano Amon, confirmed that the Snapdragon 8 Elite Gen 5 will be produced by Samsung Foundry using a new 2-nanometer process.
    4. The collaboration with Samsung aims to enhance performance and efficiency for the Snapdragon 8 Elite Gen 5.
    5. The shift to Samsung’s technology could impact the smartphone market and competition with other chip manufacturers.

    Rumors about Samsung Foundry testing a new version of the Snapdragon 8 Elite Gen 5 have been circulating for quite some time. At present, Qualcomm relies on TSMC’s N3P manufacturing technique for the Snapdragon 8 Elite Gen 5, which is featured in recent flagship devices such as the OnePlus 15 (currently priced at $899.99 on Amazon). The N3P process, a 3 nm-class node, delivers slight improvements in transistor density and performance compared to TSMC’s older N3E, along with a reduction in power usage.

    Confirmation from Qualcomm’s CEO

    Recently, Qualcomm’s CEO, Cristiano Amon, confirmed during CES 2026 that the speculation surrounding the Snapdragon 8 Elite Gen 5 being produced by Samsung Foundry is indeed true. He stated, “Among several chip design companies, we began discussions with Samsung Electronics first regarding foundry production utilising the latest 2-nanometer process…We have also completed the design work, aiming for commercialisation soon.”

    Future Prospects

    This shift to Samsung’s 2-nanometer technology may lead to notable advancements in performance and efficiency for the upcoming Snapdragon 8 Elite Gen 5. As Qualcomm pushes forward with this new collaboration, it will be interesting to see how these developments impact the smartphone market and whether it can compete effectively against other leading chip manufacturers.

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  • Apple A20 Will Not Use TSMC’s 2nm Technology in 2026

    Apple A20 Will Not Use TSMC’s 2nm Technology in 2026

    Key Takeaways

    1. The Apple A20 chip will be released with the iPhone 18 in 2026, but it won’t be made using TSMC’s advanced N2 node as previously expected.
    2. The A20 will instead use TSMC’s N3P node, the same technology as the A19 chip scheduled for release this year.
    3. The A20 will feature TSMC’s CoWoS (Chip on Wafer on Substrate) packaging to differentiate it from the A19.
    4. TSMC’s 2 nm node is set to begin mass production in late 2025, which aligns with the timeline for the Apple A20 chips.
    5. The upcoming Apple M5 chip for iPad Pros will also use N3P technology, likely due to rising wafer costs.

    There has been a lot of talk about Apple’s A20 chip, which is expected to come out with the iPhone 18 in 2026. Some wild stories suggest that Intel Foundry might be involved in making it. However, it seems unlikely that Apple would switch to using the 18A tech so quickly, especially since it has strong partnerships with TSMC. Recently, 9to5Mac has shared some new details about the A20 that might not sit well with some die-hard Apple supporters.

    Manufacturing Details

    In a twist from previous information, the Apple A20 will not be produced on TSMC’s advanced N2 node as once thought. Instead, it will remain on the N3P node, which is also the same one used for the A19 chip set to release this year. To set the A20 apart from its predecessor, it will feature TSMC’s sought-after CoWoS (Chip on Wafer on Substrate) packaging.

    Future Production Plans

    According to TSMC’s plans, its 2 nm node is expected to begin mass production in the second half of 2025, aligning with the schedule for the Apple A20 chips for the iPhone 18. Even the upcoming Apple M5 chip for the iPad Pros will stick with the N3P technology, likely due to the rising costs of wafers. N2 is TSMC’s first technology to utilize Nanosheets (gate-all-around), which should bring noticeable improvements in performance, efficiency, and thermal management.

    MacRumors has indicated these developments may change the expectations for Apple’s future chip advancements.

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  • MediaTek Dimensity 9500: N3P Process for 2025 Flagship Chip

    MediaTek Dimensity 9500: N3P Process for 2025 Flagship Chip

    The new MediaTek Dimensity 9500 processor is going to use TSMC’s N3P process node, moving away from earlier ideas about a 2nm manufacturing method. This change seems to be due to the high costs and low production capacity, especially with Apple readying to adopt TSMC’s 2nm node for its upcoming M5 series chips.

    A Major Design Change

    The Dimensity 9500 represents a big architectural change, shifting to a 2+6 core arrangement rather than the 4+4 setup of its predecessor. The fresh layout includes two Cortex-X930 “super cores” and six Cortex-A730 performance cores, with clock speeds expected to surpass the 4 GHz mark. There’s also talk that this processor will support the SME (Scalable Matrix Extension) instruction set.

    Performance Comparison

    In contrast, the Dimensity 9400 features one 3.62 GHz Cortex-X925 super core, three 3.3 GHz Cortex-X4 large cores, and four 2.4 GHz Cortex-A720 large cores. According to industry insider Digital Chat Station, the X930 cores in the Dimensity 9500 are likely to provide significantly better single-core performance.

    Launch Timeline and Competition

    MediaTek is targeting an October 2025 release, which could lead to a competition with Samsung’s Exynos 2600, rumored to be manufactured using Samsung Foundry’s 2nm technology. Both processors may power various flagship devices, with rumors hinting that the Exynos 2600 could be at the heart of Samsung’s Galaxy Z Fold 7, Z Flip 7, and S26 series.

    While TSMC’s N3P process might not be as power-efficient as the upcoming 2nm, it still offers an upgrade over the N3E process found in the current Dimensity 9400. Choosing N3P also highlights a wider industry trend, as several leading tech firms are seemingly reconsidering their quick shift to TSMC’s 2nm node due to the high costs and limited production capacity.

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