Key Takeaways
1. The Oppo Find X9 series will include models with screen sizes of 6.59 inches and 6.78 inches, featuring flat displays instead of curved ones.
2. There is speculation about a 6.3-inch model, which may be a compact version or a separate variant within the X9 lineup.
3. The series is expected to have four different models, but further details are still emerging.
4. The Find X9 devices will be powered by MediaTek’s upcoming Dimensity 9500 chip, built on a 3nm process.
5. The Dimensity 9500 will feature advanced CPU cores and support for AI and machine learning, with a planned launch in September alongside the Find X9 series.
Oppo is preparing to launch its Find X9 series, and leaks are starting to trickle in as we approach the anticipated fall release. One of the latest insights comes from Digital Chat Station, which shares information about the display sizes of these new phones.
Screen Sizes Revealed
The tipster claims that two models in the Find X9 series will sport screen sizes of 6.59 inches and 6.78 inches, likely representing the standard Find X9 and the Find X9 Pro. Notably, it appears that Oppo is moving away from the curved screens seen in the previous Find X8 series, opting instead for flat displays across the X9 lineup.
Compact Model Possibility
Additionally, there’s talk of a 6.3-inch model, but it’s uncertain whether this model is part of the main X9 series or if it’s a separate variant. In context, the previous Find X8s had a screen of similar size, meaning this new 6.3-inch option could either replace it or be a more compact version within the X9 family.
The Find X9 series is said to include four different models, but details beyond the screen sizes and design are still unfolding. However, what seems to be confirmed is a significant hardware upgrade happening inside the devices.
Hardware Upgrades on the Horizon
Reports indicate that Oppo is gearing up to launch the series featuring MediaTek’s soon-to-be-announced Dimensity 9500 chip. This new processor is rumored to be manufactured using TSMC’s advanced third-generation 3nm process (N3P). It is expected to include a CPU architecture with one “Travis” core, three “Alto” cores, and four “Gelas” cores, along with an Immortalis-Drage GPU.
These innovative cores are based on Arm’s latest X9 architecture, designed to support the SME (Scalable Matrix Extension) instruction set, which aims to enhance efficiency for AI and machine learning tasks. If all goes according to plan, the Dimensity 9500 is set to be unveiled in September, with the first batch of Find X9 devices likely launching at the same time.
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