Tag: MediaTek

  • Nvidia MediaTek APU for Gaming Laptops Rivals RTX 4070 Performance

    Nvidia MediaTek APU for Gaming Laptops Rivals RTX 4070 Performance

    Key Takeaways

    1. Nvidia is set to launch a new APU for gaming laptops in early 2026, with a TDP of 80 to 120 Watts.
    2. The APU will be based on Arm architecture, marking Nvidia’s entry into the Windows-on-Arm market.
    3. Nvidia is collaborating with MediaTek for the production of this APU, which may perform similarly to an RTX 4070 laptop.
    4. MediaTek will use advanced Arm cores for the CPU, aimed at creating a powerful Arm-based SKU surpassing Qualcomm’s offerings.
    5. The APU is expected to be unveiled at CES 2026, with potential benefits for both gaming laptops and handheld devices.

    Last week, we got to see a glimpse of an intriguing Nvidia APU that has a thermal design power (TDP) ranging from 80 to 120 Watts. Scheduled to launch in early 2026, this APU is aimed at gaming laptops. While it hasn’t been clearly stated, it seems like this could be Nvidia’s entry into the Windows-on-Arm market. A new report from UDN confirms that this APU will indeed be based on Arm architecture and provides us with additional details.

    Collaboration with MediaTek

    Nvidia is apparently teaming up with MediaTek for the production of this APU. It is anticipated to be released alongside a yet-to-be-announced product from Dell. However, UDN mentions that the TDP is expected to be around 65 Watts, and the APU is likely to perform similarly to an RTX 4070 laptop, courtesy of a Blackwell-based GPU. The exact model of the GPU remains unknown, but it can be assumed it will be a reduced version of the GB206 or GB207.

    Powerful Arm Architecture

    MediaTek is expected to utilize standard Arm cores (the successor to Cortex-X925) for the CPU, similar to their plans with the Dimensity 9500. The combination of a fully-featured discrete GPU alongside new Lumex (previously known as Cortex) cores will create the most powerful Arm-based SKU available; likely far surpassing anything currently offered by Qualcomm.

    The anticipated launch timeframe suggests that it may be unveiled at CES 2026, with a broader release to follow in the weeks after. The idea of a gaming laptop powered by Arm is thrilling, but the biggest winners from these components may be gaming handheld devices, though they’ll require something that uses less than 65 Watts to operate efficiently.

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  • MediaTek Develops Next-Gen 2nm Chip Technology

    MediaTek Develops Next-Gen 2nm Chip Technology

    Key Takeaways

    1. Attention is shifting from 3 nm to upcoming 2 nm mobile SoCs, with uncertainty around Apple’s adoption of TSMC’s N2 node.
    2. MediaTek plans to tape-out its 2 nm product, likely the Dimensity 9600, in September 2025, aiming for market release by the end of 2026.
    3. High-volume production of TSMC’s N2 process is expected to start in the latter half of 2026.
    4. MediaTek’s Dimensity 9600 may change the trend of being cheaper than Qualcomm’s chips, especially with rising costs of N2 wafers.
    5. Detailed specifications for the Dimensity 9600 are not yet available, as the chip is still over a year away from release.

    Now that 3 nm mobile SoCs have been in the market for some time, attention is shifting towards the next major transition: 2 nm. Apple typically leads the way in adopting new technologies, but it’s unclear whether they will embrace TSMC’s N2 node. If Apple ends up sticking with the N3P process, MediaTek could potentially be the first to launch a 2 nm smartphone SoC.

    MediaTek’s Timeline

    During its Computex 2025 presentation, the Taiwanese semiconductor company announced that its 2 nm product is set to tape-out in September 2025. This means the design will be completed before it begins mass production. A previous list from TSMC indicated that MediaTek is one of the customers for the 2 nm technology. High-volume production for the N2 process is expected to kick off in the latter half of 2026, and if everything goes as planned, MediaTek’s smartphone SoC could hit the market by the end of 2026.

    The Dimensity 9600

    The chip in question is likely the Dimensity 9600. However, no details about this SoC have emerged yet, and it may take a while for that to happen since the chip is still more than a year away from its release. In the past, MediaTek’s chips were generally cheaper than those of Qualcomm, but this trend might change with the Dimensity 9600. TSMC’s N2 wafers are already quite expensive, and they could become even costlier if the anticipated 10% price increase is implemented.

    MediaTek Develops Next-Gen 2nm Chip Technology
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  • MediaTek Dimensity 9400e: Flagship Chipset for Budget Phones

    Key Takeaways

    1. MediaTek launched the Dimensity 9400e chipset, targeting sub-premium devices, alongside the Dimensity 9400 and 9400+.
    2. The Dimensity 9400e is built on TSMC’s 4nm process and features a 4+4 core setup with Cortex-X4 and Cortex-A720 cores.
    3. It includes advanced features like Adaptive Gaming Technology (MAGT 2.0), Frame Rate Converter (MFRC 2.0+), and support for AI models through the NeuroPilot SDK.
    4. The chipset offers high connectivity speeds, achieving sub-6GHz 4CC-CA downloads of up to 7 Gbps and Wi-Fi 7 speeds of 7.3 Gbps.
    5. The Dimensity 9400e is closely related to the previous Dimensity 9300+ and shares similarities with Qualcomm’s Snapdragon 8s Gen 4 and Snapdragon 8 Gen 3.

    MediaTek has unveiled its latest chipset, the Dimensity 9400e. This new addition joins the Dimensity 9400 and Dimensity 9400+ in MediaTek’s top-tier lineup for the year. However, it is designed specifically for sub-premium devices, with some expected to launch later this month.

    Technical Specifications

    The Dimensity 9400e stands out from its siblings as it is manufactured using TSMC’s 4nm process. It boasts a unique 4+4 core setup, which includes four Cortex-X4 cores (one running at 3.4 GHz and three at 2.85 GHz) and four Cortex-A720 cores that can reach speeds of up to 2.0 GHz. On the graphics side, it features ARM’s Immortalis-G720 MP12.

    Additional Features

    Among the additional features of the Dimensity 9400e are MediaTek’s Adaptive Gaming Technology (MAGT 2.0), MediaTek Frame Rate Converter (MFRC 2.0+), and the latest NeuroPilot SDK for running DeepSeek-R1-Distill LLM models directly on devices. These advancements promise improved gaming and AI capabilities. In terms of connectivity, the Dimensity 9400e is reported to achieve sub-6GHz 4CC-CA download speeds of up to 7 Gbps and Wi-Fi 7 speeds up to 7.3 Gbps.

    Comparison with Previous Models

    The Dimensity 9400e is closely related to last year’s Dimensity 9300+, which powered the Xiaomi 14T Pro (available on Amazon). Its relationship with the Dimensity 9400 and Dimensity 9400+ parallels that of Qualcomm’s Snapdragon 8s Gen 4 and Snapdragon 8 Gen 3. Both chipsets have the same core configuration, Immortalis GPU, and similar network specifications.

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  • MediaTek Launches Helio G200: Enhanced Camera and Connectivity

    MediaTek Launches Helio G200: Enhanced Camera and Connectivity

    Key Takeaways

    1. MediaTek has launched the Helio G200 processor as the flagship model in its Helio G series for 4G smartphones and tablets.
    2. The Helio G200 features an octa-core design with two Cortex-A76 cores and six Cortex-A55 cores, similar to the Helio G100.
    3. Camera capabilities remain similar to the Helio G100, supporting a maximum of 200MP or dual 16MP sensors, with a new 12-bit DCG feature for improved HDR video quality.
    4. The Helio G200 introduces 4G DC SAR technology to enhance connectivity, reducing latency by up to 30% and increasing range by 83%.
    5. Other specifications, including memory and display support, are consistent with the Helio G100, and availability details for devices using the G200 are not yet disclosed.

    MediaTek has unveiled a fresh processor in its Helio G series, aimed at 4G smartphones and tablets. The latest Helio G200 stands as the flagship model, positioned above the Helio G100 that was revealed in August 2024. Nevertheless, there are only minor differences that distinguish the Helio G200 from its predecessor, the Helio G100.

    Specifications and Performance

    The Helio G200 is an octa-core chip manufactured using the TSMC 6nm process, just like the Helio G100. It features two Cortex-A76 cores running at 2.2GHz and six Cortex-A55 cores operating at 2.0GHz, accompanied by a Mali-G57 MC2 GPU clocked at 1.1GHz. Similar to the Helio G100, this new processor supports LPDDR4X memory with a max speed of 4266 Mbps and UFS 2.2 storage. Furthermore, it can handle displays with a maximum resolution of 2520 x 1080 and supports a 120Hz refresh rate.

    Camera Capabilities

    The maximum camera resolution supported by the Helio G200 is also unchanged from the Helio G100, allowing for a single 200MP camera or dual 16MP sensors. However, a fresh feature is the incorporation of 12-bit DCG (dual conversion gain), which enhances the quality of HDR video recording. MediaTek has also claimed to have worked closely with camera app developers to decrease power usage by as much as 20%.

    Connectivity Improvements

    Another innovative feature of the Helio G200 is the introduction of 4G DC SAR technology, which is designed to ‘improve the experience of popular social and messaging applications’ in areas with weak cellular signals. According to MediaTek, this new technology can cut latency by up to 30% and increase connectivity range by as much as 83%.

    Aside from these two enhancements, the rest of the specifications for the Helio G200 remain consistent with those of the Helio G100. MediaTek has not disclosed when devices featuring the new processor will be available for purchase.

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  • MediaTek Launches Dimensity 9400+: Big Core CPU & HDR Video

    MediaTek Launches Dimensity 9400+: Big Core CPU & HDR Video

    Key Takeaways

    1. All Big Core CPU Structure: The Dimensity 9400+ features a powerful CPU configuration with one Cortex-X925 core, three Cortex-X4 cores, and four Cortex-A720 cores, enhancing single-core and multi-core performance for Android devices.

    2. Advanced AI Capabilities: Equipped with the MediaTek NPU 890, the chip supports on-device large language models and accelerates AI tasks by 20% with Speculative Decoding+, enabling developers to create sophisticated AI systems.

    3. Gaming Enhancements: The 12-core Arm Immortalis-G925 GPU provides PC-like visuals and allows for doubled frame rates with Frame Rate Converter 2.0+, while reducing power consumption by 40%.

    4. Connectivity Features: The chip enhances Bluetooth range to 10km, integrates BeiDou for faster GPS fixes, supports Wi-Fi 7 with tri-band capabilities, and includes a 5G modem with speeds up to 7Gbps and Dual SIM Dual Active functionality.

    5. Camera and Audio Innovations: The Imagiq 1090 image processor enables HDR video recording at all zoom levels and Smooth Zoom for better subject tracking, while audio quality is enhanced with 24-bit recording through six AI-enhanced microphones.

    MediaTek has introduced its latest flagship chip, the Dimensity 9400+, which focuses on enhancing AI, gaming, and connectivity for smartphones. This chip is designed with an All Big Core CPU structure, which comprises one Cortex-X925 core clocked at 3.73GHz, three Cortex-X4 cores, and four Cortex-A720 cores. Such a configuration significantly improves both single-core and multi-core performance for top-tier Android devices.

    Advanced AI Capabilities

    The chip is equipped with the enhanced MediaTek NPU 890, which facilitates on-device large language models utilizing Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), and FP8 inferencing. With the introduction of Speculative Decoding+, AI tasks can be accelerated by 20%. Additionally, the Dimensity Agentic AI Engine provides developers with the resources to create sophisticated AI systems.

    Gaming Enhancements

    For gaming enthusiasts, the 12-core Arm Immortalis-G925 GPU offers superior visuals that include PC-like features such as opacity micromap for intricate textures. MediaTek’s Frame Rate Converter 2.0+ allows for a doubling of the frame rate while reducing power consumption by 40%.

    Connectivity Features

    Connectivity is also significantly improved with this chip. It enhances Bluetooth range to as much as 10km (line-of-sight), integrates BeiDou for achieving 33% quicker GPS-like location fixes even without mobile networks, and supports Wi-Fi 7 with tri-band capabilities. The integrated 5G modem can achieve download speeds of up to 7Gbps and supports Dual SIM Dual Active functionality.

    Camera and Audio Innovations

    On the photography front, the Imagiq 1090 image processor allows for HDR video recording at all zoom levels and introduces Smooth Zoom for better subject tracking. In terms of audio quality, it supports 24-bit recording through six built-in microphones with AI enhancements.

    MediaTek claims that the Dimensity 9400+ is designed to manage demanding tasks efficiently while equipping developers with more tools to create improved AI applications. OPPO has already released its flagship Find X8s and Find X8s+ smartphones that incorporate this new chip in China.

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    MediaTek Launches Dimensity 9400+: Big Core CPU & HDR Video

     

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  • MediaTek Dimensity 9400+ Launch: Faster CPU & Enhanced AI Performance

    MediaTek Dimensity 9400+ Launch: Faster CPU & Enhanced AI Performance

    Key Takeaways

    1. The Dimensity 9400+ features a clock speed upgrade to 3.73 GHz for its prime Cortex-X925 core.
    2. The four Cortex-A720 cores have been boosted to 2.4 GHz, improving CPU performance slightly.
    3. The GPU remains the same (Arm Immortalis-G925 MC12), but gaming performance can improve by up to 40% with MediaTek Frame Rate Converter 2.0+.
    4. Memory specifications are unchanged, with LPDDR5X-10667 RAM and UFS 4.0 storage.
    5. Enhanced AI capabilities and increased Bluetooth range to 10 kilometers are notable features of the Dimensity 9400+.

    MediaTek has unveiled its latest system-on-chip (SoC) designed for high-end smartphones. The Dimensity 9400+ brings slight enhancements over the previous Dimensity 9400. Recent leaks have given us a good understanding of its specifications and performance.

    Performance Improvements

    The Dimensity 9400+ features a maximum clock speed of 3.73 GHz for its prime Cortex-X925 core, an upgrade from the 3.62 GHz seen in the standard Dimensity 9400. According to a previous Geekbench leak, the four Cortex-A720 cores have also been boosted to 2.4 GHz, compared to the 2.0 GHz in the original model. Apart from these changes, the two chips are quite similar in terms of CPU capabilities.

    GPU and Memory Specs

    In terms of graphics, the Dimensity 9400+ doesn’t introduce significant upgrades, maintaining the same Arm Immortalis-G925 MC12. However, MediaTek asserts that games compatible with its technology can see up to a 40% performance enhancement using MediaTek Frame Rate Converter 2.0+. The memory remains unchanged as well, featuring LPDDR5X-10667 RAM and UFS 4.0 storage, along with the Imagiq 1090 ISP and MiraVision 1900 display engine.

    AI and Connectivity Features

    The Dimensity 9400+ is designed to enhance AI capabilities, incorporating on-device support for sDeepseek R1 Distill. Additionally, it increases the maximum Bluetooth range to 10 kilometers, as long as the devices are in direct line-of-sight. This new SoC is set to launch with devices like the Vivo X200s, Oppo Find X8s, and Realme GT7 in the near future.

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    MediaTek Dimensity 9400+ Launch: Faster CPU & Enhanced AI Performance

     

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  • MediaTek Kompanio Ultra 910: AI Processor for Chromebooks Launch

    MediaTek Kompanio Ultra 910: AI Processor for Chromebooks Launch

    Key Takeaways

    1. The MediaTek Kompanio Ultra 910 features an 8-core CPU with high-speed capabilities and enhanced power efficiency, enabling all-day battery life for Chromebooks.

    2. It includes a powerful 11-core Immortalis-G925 MC11 GPU that supports ray tracing, improving graphics performance for gaming and multimedia applications.

    3. The processor is equipped with an 8th-generation NPU, providing strong on-device AI performance, capable of real-time image and video generation.

    4. Connectivity options include support for Wi-Fi 7 and Bluetooth 6.0, allowing for fast wireless connections and improved signal stability.

    5. The Kompanio Ultra 910 can handle multiple 4K displays and supports advanced video encoding/decoding, ensuring high-quality multimedia experiences.

    MediaTek has launched its new processor, the Kompanio Ultra 910, which aims to boost the performance of Chromebooks. This latest chipset emphasizes AI features, enhanced power efficiency, and fast connectivity. It introduces sophisticated computing capabilities meant for productivity, creativity, and rich multimedia experiences. Let’s dive into the details of what the Kompanio Ultra 910 brings to the table.

    Specifications and Features of MediaTek Kompanio Ultra 910

    The MediaTek Kompanio Ultra 910 is built using TSMC’s 2nd-gen 3nm technology, providing outstanding power efficiency that allows Chromebooks to achieve all-day battery life alongside noteworthy performance improvements. The core of the Kompanio Ultra 910 includes an 8-core CPU structure, featuring a robust Arm Cortex-X925 core that can reach speeds of up to 3.62GHz, along with three Cortex-X4 cores and four Cortex-A720 cores.

    This architecture, combined with 12MB of L3 cache and 10MB of system-level cache (SLC), guarantees smooth operation for both single-threaded and multi-threaded tasks. For graphics processing, this chip is equipped with an 11-core Immortalis-G925 MC11 GPU that supports ray tracing, which heightens the experience for gaming and graphics-heavy applications.

    Performance Metrics and AI Capabilities

    To match its processing strength, the Kompanio Ultra 910 is compatible with LPDDR5X memory (8533Mbps), ensuring that the CPU, GPU, and NPU can access data without interruptions. Performance tests show commendable results, with a Geekbench 6 single-core score of 2600 and a multi-core score of 8000.

    A standout feature of the Kompanio Ultra 910 is its 8th-generation NPU, which greatly enhances on-device AI performance, allowing real-time generation of images and videos. This NPU can achieve up to 50 TOPS in AI performance, earning top marks in ETHZ v6 AI benchmarks, especially in Generative AI tasks. The AI acceleration also contributes to better power efficiency by redistributing workloads from the CPU and GPU.

    Connectivity and Multimedia Support

    When it comes to connectivity, the Kompanio Ultra 910 is optimized for rapid wireless connections, offering support for Wi-Fi 7 with speeds reaching up to 7.3Gbps and Bluetooth 6.0 featuring a dual Bluetooth engine for superior signal range and stability.

    In terms of multimedia, the processor can manage up to three 4K displays at once—one on the device and two external. It supports 4K 10-bit video encoding and decoding in formats such as HEVC, AVC, VP9, and AV1, ensuring seamless video playback and streaming. Additionally, the dedicated Hi-Fi Audio DSPs improve sound quality and enable low-power keyword detection, making it perfect for applications that rely on voice assistance.

    MediaTek Kompanio Ultra 910: AI Processor for Chromebooks Launch
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  • Expectations for MediaTek Dimensity 9400e Performance and Features

    Expectations for MediaTek Dimensity 9400e Performance and Features

    Key Takeaways

    1. MediaTek is rebranding its upcoming chip from Dimensity 9350 to Dimensity 9400e, positioning it closer to flagship offerings.
    2. The Dimensity 9400e is expected to outperform the Dimensity 9300+ with enhanced clock speeds and an all-big-core CPU strategy.
    3. The chip will likely retain the Immortalis-G720 GPU and see improvements in AI performance through optimized architecture.
    4. Manufacturing on TSMC’s 4nm process could enhance efficiency, power management, and thermal performance.
    5. The Dimensity 9400e is expected to power mid-premium smartphones like the OnePlus Ace 5V and Realme devices, intensifying competition in the sub-flagship market.

    MediaTek is gearing up for a strategic shift in the competitive sub-flagship market, taking cues from Qualcomm. Initially anticipated to be released as the Dimensity 9350, this chip is now likely set to debut as the Dimensity 9400e. This rebranding indicates that MediaTek aims to position this new model closer to its flagship offerings rather than merely adding another option to the mid-high tier Dimensity 9300 range.

    Performance Expectations

    Leaked information from reliable Chinese source Digital Chat Station suggests that the Dimensity 9400e will provide real performance improvements, not just a marketing gimmick. It’s rumored to be deserving of the label “9300++,” hinting at its capability to exceed the already enhanced Dimensity 9300+.

    Core Configuration

    At the core of the Dimensity 9400e, it’s believed to feature the same configuration as the 9300 and 9300+: one Cortex-X4 prime core, three Cortex-X4 performance cores, and four Cortex-A720 cores. This totals eight performance-oriented cores without any efficiency cores—showcasing MediaTek’s commitment to its all-big-core CPU strategy, first introduced with the 9300.

    What sets this version apart? Enhanced clock speeds. The 9400e is expected to push these frequencies beyond those of the 9300+, which already had the prime Cortex-X4 clocked at 3.4GHz. This change could result in noticeable improvements in burst performance and multitasking capabilities. Anticipate benchmark results that may surpass those of the Snapdragon 8s Gen 3 and potentially challenge Qualcomm’s upcoming 8s Gen 4, which also aims for the sub-flagship market.

    Graphics and AI Advancements

    There’s currently no official word regarding changes to the GPU; however, the Dimensity 9400e is likely to keep the Immortalis-G720 GPU, which has shown strong performance in the 9300 series, particularly with its 46% better ray tracing support. Incremental boosts in AI performance can also be expected, likely owing to optimized tuning of MediaTek’s APU 790 and enhancements in its “NeuroPilot” architecture.

    Efficiency and Manufacturing

    Efficiency is another important aspect of this chip. The Dimensity 9400e might be manufactured using TSMC’s 4nm process node, similar to its predecessors. While specifics remain vague, any improvements in power management or thermal performance could have a significant impact—especially for a chip that emphasizes high performance across all cores.

    Future Devices

    The Dimensity 9400e is poised to power a variety of performance-oriented mid-premium Android smartphones expected to launch later this year. Leading this lineup might be the OnePlus Ace 5V, a device rumored to feature an impressive 7,000mAh battery and a flat 1.5K display. This model is likely the successor to the Ace 3V, which was rebranded as the Nord 4 for international markets. It’s reasonable to assume that the Ace 5V could eventually make its way outside of China as the Nord 5.

    Realme is also reportedly looking to adopt the 9400e, making this chip a formidable player in the upper-midrange segment where performance and value meet.

    MediaTek’s Competitive Strategy

    MediaTek’s choice to rename the 9350 to Dimensity 9400e mirrors Qualcomm’s rebranding approach with the Snapdragon 8s Gen 4 (previously known as the 8s Elite). Both companies are merging the lines between flagship and sub-flagship categories, providing near-top-tier performance in devices that don’t necessarily come with hefty price tags.

    This strategy is a wise one. With the Dimensity 9400e, MediaTek could sustain the positive momentum from its successful 9300 series and demonstrate that it can compete in the high-performance arena alongside Qualcomm. Furthermore, this sets the stage for a more crowded and competitive premium mid-range smartphone market in 2025.

    No official date for the launch has been disclosed yet, but if the leaks hold true, MediaTek is close to making an announcement. If the expected performance and efficiency improvements come to fruition, the Dimensity 9400e could emerge as the sub-flagship chip to watch this year.

    Additionally, MediaTek is scheduled to unveil the Dimensity 9400+ on April 11th, which has already appeared in various benchmark listings.

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  • MediaTek Dimensity 9400+ Launching in New Oppo Find Flagship

    MediaTek Dimensity 9400+ Launching in New Oppo Find Flagship

    Key Takeaways

    1. Oppo is set to launch the Find X8s and Find X8s Plus, featuring MediaTek’s new Dimensity 9400+ chipset.
    2. The Dimensity 9400+ is specifically named for the first time in this teaser, ahead of its official announcement at the Dimensity Developer Conference on April 11, 2025.
    3. The new chipset will have faster ARM Cortex-X925 and Cortex-X4 CPU cores compared to the original Dimensity 9400.
    4. The Dimensity 9400+ is a follow-up to the Dimensity 9300+ and will launch about six months after the Dimensity 9400.
    5. Oppo’s focus on the new chipset indicates potential advancements in performance for the Find X8s series, making it an anticipated launch.

    Oppo has revealed an important detail regarding the Find X8s series, which will include both the Find X8s and the larger Find X8s Plus. Earlier this week, the company hinted at some initial information about the smaller version. Now, it has confirmed that the series will be powered by MediaTek’s upcoming flagship chipset.

    Details About the Chipset

    As shown in the image below, the chipset being discussed is the Dimensity 9400+. Interestingly, this is the first time Oppo has mentioned the new chipset by name; before this, MediaTek only suggested that it would showcase something new at its upcoming Dimensity Developer Conference (MDDC 2025) set for April 11.

    Release Timeline

    The Dimensity 9400+ is expected to launch roughly six months after the introduction of the Dimensity 9400. Technically, it serves as the successor to the Dimensity 9300+, which powers devices like the Xiaomi 14T Pro and the Galaxy Tab S10 Ultra (currently priced at $1,044.99 on Amazon). According to a recent Geekbench listing, the Dimensity 9400+ is anticipated to offer the Find X8s and Find X8s Plus improved ARM Cortex-X925 and Cortex-X4 CPU cores compared to the standard Dimensity 9400. However, full details regarding the differences between the Dimensity 9400 and the Dimensity 9400+ are still not available at this time.

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    MediaTek Dimensity 9400+ Launching in New Oppo Find Flagship

     

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  • Moto G56 5G Surfaces on Geekbench with New MediaTek Chip

    Moto G56 5G Surfaces on Geekbench with New MediaTek Chip

    Key Takeaways

    1. The Moto G56 5G is expected to feature an octa-core processor with two high-performance cores at 2.6GHz and six efficiency cores at 2.0GHz.
    2. The device may utilize a MediaTek chipset, potentially resembling the Dimensity 7025, but could have a different or new processor.
    3. The phone is benchmarked with 8GB of RAM and Android 15, achieving a single-core score of 1039 and multi-core score of 2396.
    4. Available color options for the Moto G56 5G include Black, Blue, and Dill (Light Green), with the 8GB + 256GB variant priced around €250 (approximately ₹23,675).
    5. The phone has appeared on Geekbench for the first time, indicating a possible official launch in the coming months, following the previous model’s release schedule.

    Motorola is possibly getting ready to update its mid-range G series phones, and one of the models, the Moto G56 5G, has recently shown up on Geekbench, offering important info about its chipset.

    Chipset Insights

    TheTechOutlook was the first to notice the Geekbench listing, which shows that the phone is equipped with an octa-core processor. This processor includes two high-performance cores running at 2.6GHz and six efficiency cores operating at 2.0GHz. The GPU is identified as IMG BXM-8-256, indicating that it may utilize a MediaTek chipset.

    Potential Specifications

    This combination of CPU and GPU closely matches the Dimensity 7025, although the Dimensity 7025 features a prime core with a lower clock speed of 2.2GHz. Hence, it’s possible that the Moto G56 5G could be powered by a different or even a new processor entirely.

    The device was benchmarked with 8GB of RAM and Android 15, achieving a single-core score of 1039 and a multi-core score of 2396. Apart from these figures, the Geekbench listing doesn’t provide much additional information.

    Color Options and Pricing

    Earlier leaks indicate that the Moto G56 5G will be available in Black, Blue, and Dill (Light Green) hues. The pricing details have also emerged ahead of the specifications. The 8GB + 256GB variant is anticipated to retail for €250 (approximately ₹23,675).

    This marks the first time the phone has appeared on any benchmark or certification platform. Therefore, we may need to wait a few more months before it officially launches. The previous model was unveiled last September, so the G56 5G could follow a similar schedule.

    While Motorola hasn’t confirmed any details yet, based on past experiences, it’s likely that more leaks will surface as the launch date approaches.

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