Google’s upcoming Pixel 9 series, as well as potentially the Pixel Fold 2, are anticipated to showcase the Tensor G4 chip, with reports pointing to Samsung Electronics Foundry as the likely producer. This collaboration between Google and Samsung on the Tensor G4 has been supported by a recent report from Financial News in Korea, citing industry insiders.
Samsung Collaboration on Tensor G4
The Tensor G4 chip is rumored to leverage Samsung's cutting-edge 4-nanometer technology in conjunction with FOWLP (Fan-out Wafer Level Packaging). The expected outcome is an enhancement in thermal management, power efficiency, and overall performance, addressing areas where the predecessor, Tensor G3, supposedly lagged behind its competitors.
Positive Reception and Industry Interest
Google’s decision to adopt Samsung Electronics’ 4nm process is influenced by the favorable reception of Samsung’s Exynos 2400 chip used in the Galaxy S24 series. This success has significantly boosted Samsung's credibility as a proficient semiconductor manufacturer. It appears that not only Google but also other prominent tech entities, including Open AI, TenStorrent, and Meta, are exploring alternatives to TSMC, as indicated by their interactions with Samsung Electronics.
Speculations on Tensor G4 Features
While details regarding the specifications of the Tensor G4 SoC remain scarce, an earlier leak hinted at the possibility of the chip incorporating a hardware-based ray-tracing GPU. This aligns with Samsung's history of integrating such technology into their Exynos processors across multiple generations. Rumors also suggest that Google is likely to maintain a 3-core architecture consisting of Cortex-X4, Cortex-A720, and Cortex-A520 cores. Although the precise core count is undisclosed, it is anticipated that the new chip will deliver enhanced performance. Stay tuned for further updates on the Tensor G4 SoC.