Category: Computers

  • iMac M1 Hardware Defect: Apple Denies Free Repairs, Display Risks

    iMac M1 Hardware Defect: Apple Denies Free Repairs, Display Risks

    At this time, it remains uncertain just how extensive the hardware issue really is. Posts on forums can create a skewed view and may lead to an overestimation of the problems, since only those who are affected—possibly multiple times and on various platforms—tend to report their experiences, while countless iMacs might be functioning flawlessly.

    The Nature of the Problem

    The issue in question is quite intriguing because it is evidently a hardware flaw. The specific error involves continuous horizontal lines showing up on the display of the iMac M1, which greatly hampers both usability and the visual appeal of the screen. Users can quickly identify the source of the issue as it’s linked to the display, since those affected can still utilize an external monitor without any trouble. This indicates that the issue does not stem from a defect in the integrated GPU (iGPU).

    User Experiences and Apple’s Response

    In extensive conversations across different platforms, users who are affected share their stories. Apple’s response to the problem seems to vary from one case to another, but overall, customers find it to be quite unsatisfactory. As a general practice, Apple is currently denying repairs for devices that are out of warranty, as they haven’t acknowledged a widespread defect. One user on the Apple forum provided a fairly thorough account of the issue, mentioning thermal damage to a cable that hinders signal transmission. The likelihood of thermal damage increases with higher brightness settings on the display. Since the cable can’t be easily replaced, potential repairs could be much more expensive.

    Apple Community forum (1), Apple Community forum (2), Reddit

    Tags: , ,
  • DigiPort: HDMI Stick and Mini PC Combo Powered by Raspberry Pi

    DigiPort: HDMI Stick and Mini PC Combo Powered by Raspberry Pi

    Compact computer systems resembling HDMI sticks are gaining traction, particularly as low-cost media players for televisions. Among these, stick PCs allow users to run a full desktop operating system, enabling productivity tasks and the installation of personal software. One such device is the DigiPort, which is built upon the Raspberry Pi platform. It features a Raspberry Pi Module 4, housing a BCM2711 SoC that boasts four 1.5 GHz Cortex A72 cores. The device offers varying RAM options of 1, 2, 4, or 8 GB, and comes with eMMC storage options that range from none to 0, 8, 16, or 32 GB.

    Easy Connection and Versatility

    Connecting the DigiPort to a TV is a breeze, thanks to its HDMI interface. However, it requires power through a USB port. The device includes two USB 2.0 ports for adding a keyboard and mouse, while Bluetooth connectivity allows for hassle-free pairing of input devices. Additionally, it has a microSD card slot, providing an easy way to increase storage or set up a different operating system. There is an IR blaster integrated into the device, which enables the direct control of TVs and other compatible devices.

    Operating Systems and Availability

    As expected, the DigiPort supports a range of operating systems like Raspberry Pi OS, Android, and several Linux distributions. Currently, specific details about the dimensions of the stick PC remain unknown. However, during the Kickstarter campaign, it is anticipated that units will be shipped out by December 2024 to backers who pledge at least 62€. As is common with crowdfunding projects, potential supporters should be mindful of the inherent risks involved.

    Image 1
    Image 1
    Tags: , ,
  • Lunar 2-in-1 Foldable Keyboard & Mini PC with Powerful Specs

    Lunar 2-in-1 Foldable Keyboard & Mini PC with Powerful Specs

    The Lunar is a unique mini PC that takes the shape of a keyboard and is currently being supported through a Kickstarter project. This innovative device can be easily set up by unfolding it and connecting it to a monitor with a cable. It comes with a built-in touchpad, eliminating the need for a separate mouse.

    Compact Design and Connectivity

    When folded, the Lunar measures 153 x 110 x 30 millimeters and weighs under 800 grams. It provides video output through USB 4, USB 3.2 Type C, and USB 3.0 Type A ports. The device also has WiFi and Bluetooth capabilities. As per the manufacturer, users can utilize Lunar as a hotspot and retrieve data stored on it. Additionally, it can function only as a Bluetooth keyboard if desired.

    Impressive Specs

    Equipped with a 59.2 Wh battery, the Lunar promises a battery life ranging from 8 to 10 hours. The computing power comes from the AMD Ryzen 7 8840U chip, which is also found in gaming handhelds. Depending on the configuration chosen, users can get RAM of up to 32 GB and an SSD with a capacity of up to 1 TB.

    Pricing and Considerations

    Supporters on Kickstarter can get the Lunar starting at $579, with shipping planned for January 2025. It’s important for potential buyers to be cautious about the risks involved in such campaigns, which we believe are quite significant in this instance. For those who are interested in a foldable keyboard without the mini PC features, the iClever foldable keyboard available on Amazon may be a suitable alternative.

    Tags: , ,
  • Huawei Kirin ARM PC Chip Delay: New Release Set for Next Year

    Huawei Kirin ARM PC Chip Delay: New Release Set for Next Year

    There have been several updates regarding a potential Huawei Kirin PC chip, but the company itself hasn’t made any official announcements yet. An intriguing rumor from August suggested that this ARM-based chipset might have a unified architecture, much like Apple’s M series chips. Another report from April even hinted that it could compete with the Apple M3.

    Rumored Delays in Launch

    Despite speculation that Huawei would unveil the Kirin PC chip this year, there has been no confirmation from the firm. Recently, a tipster known as @BeijingDigitalMaster on Weibo indicated that the anticipated ARM-based chip has been pushed back to the first quarter of 2025. The reason for this delay wasn’t disclosed, but it likely relates to concerns over efficiency.

    Current Chip Technology

    Last year, Huawei achieved a significant milestone with the introduction of the 5G-enabled Kirin 9000S, but this chip, along with its successors, is produced using an older manufacturing technology. For context, the new Mate XT features the Kirin 9010, which is built on a 7 nm process. In contrast, the upcoming Snapdragon 8 Gen 4 and Dimensity 9400 are produced using a more advanced 3 nm node.

    On a related note, the Snapdragon X series for PCs is manufactured with a 4 nm process. As is commonly understood, power consumption is closely linked to the size of the transistors used. Thus, smaller transistors typically lead to improved efficiency. For example, Huawei’s current 7 nm Kirin chip is significantly less efficient than the latest Snapdragon 8 Gen 3 and Dimensity 9300.

    Future Prospects for Kirin

    Even if the rumored Kirin PC chip does indeed match the performance of the Apple M3, it will struggle to deliver superior battery life if it continues to be made using the 7 nm process. Reports have suggested that SMIC, the semiconductor company that Huawei partners with, is now capable of producing 5 nm chips. If this information is accurate, it’s possible that Huawei is waiting for a more favorable production yield before moving forward.

    Image 1
    Tags: , ,
  • Samsung’s New SSD Offers 14 GB/s Speed and Energy Efficiency

    Samsung’s New SSD Offers 14 GB/s Speed and Energy Efficiency

    Samsung has recently revealed that its Samsung PM9E1 SSD is now in mass production. This SSD comes in the M.2 format, which is currently the most favored design for flash storage among end users, and it connects through PCIe. The PM9E1 takes advantage of PCIe 5.0 with up to eight lanes, allowing it to achieve its maximum performance potential. The SSD offers a peak data rate of 14.5 GByte/s for read operations, while writing data can reach speeds of up to 13 GByte/s. These impressive numbers are likely for sequential data transfers, as such high rates are not typically seen in random file operations. In comparison, the Samsung 990 Pro, which has a storage capacity of 1 TB, is priced at around $100 and achieves speeds of approximately 7,000 MByte/s.

    Memory Controller and Data Transfer Rates

    In the PM9E1, a 5 nm memory controller and RAM are incorporated, which means that data transfer rates might decrease during extended data transfers. It is still uncertain how significant such high speeds are for average users; thus, it’s probable Samsung targets professional users with the PM9E1, particularly those needing ultra-fast storage for AI model applications. The PM9E1 will be offered in capacities of 512 GB, 1 TB, 2 TB, and 4 TB, enabling the storage of substantial amounts of data.

    Energy Efficiency and Security Features

    Samsung promotes enhanced energy efficiency, which is beneficial not just for setups with multiple storage devices but also for mobile devices. Additionally, security features have reportedly been strengthened with the implementation of the Security Protocol and Data Model (SPDM) v.1.2. While mass production has commenced, Samsung has yet to provide any specific details regarding the pricing or the expected release date of the PM9E1.

    Tags: , ,
  • USB4 2.0 Cables Launching in 2024: What to Expect

    USB4 2.0 Cables Launching in 2024: What to Expect

    Japanese company Elecom has revealed its first cables that comply with the newly introduced USB4 2.0 standard, which debuted in early September. These cables can reach speeds of up to 80 Gbit/s in both directions and support 8K/60Hz video signals through DisplayPort passthrough. For reference, the previous USB4 and Thunderbolt 4 standards only offer 40 Gbit/s maximum and can handle video transmission up to 4K/60Hz.

    Enhanced Power Delivery

    A key upgrade is in the power delivery capability, which now hits a maximum of 240 watts. This advancement means that power-hungry gadgets like gaming laptops and high-performance workstations can be powered effectively. However, it’s important to note that not all USB4 2.0 cables from Elecom will support this full power output. The manufacturer has announced cables rated for both 60 and 240 watts.

    Availability and Market Launch

    Elecom’s USB4 2.0 cables are expected to hit the market around mid-December 2024, but initially, they will only be sold in Japan. There’s no information yet on when they might be available in other regions.

    Currently, there are no motherboards available that support USB4 2.0 natively. To take full advantage of the new USB standard’s capabilities, users will need to install a USB4 2.0 controller as an expansion card in their PCs.

    Comparison with Thunderbolt 5

    Intel’s Thunderbolt 5 standard, which is already integrated into devices such as the Razer Blade 18 gaming laptop and Kensington’s SD5000T5 EQ docking station, also supports speeds of 80 Gbit/s. However, it features asymmetric bandwidth distribution, allowing up to 120 Gbit/s for demanding video tasks, making it particularly suitable for 8K streaming.

    Tags: , ,
  • Steam Deck Transforms into Handheld Hackintosh with macOS Sequoia

    Steam Deck Transforms into Handheld Hackintosh with macOS Sequoia

    Valve delivers the Steam Deck equipped with SteamOS, a Linux distribution based on Debian. This gaming handheld functions much like any standard PC, allowing it to support common operating systems. While Windows operates smoothly on the device, user @whatdahopper has made history by demonstrating macOS Sequoia running on the Steam Deck.

    A Collaborative Effort

    According to @whatdahopper, a team worked together to enable the Steam Deck to run Apple’s newest desktop OS. However, right now, installing macOS Sequoia on the device is not particularly useful. There’s currently no GPU acceleration available, but the team is optimistic that this will change once the iGPU kext (kernel extension) for AMD Van Gogh is released.

    Future Possibilities

    This release might come sooner than expected, as macOS already supports RDNA 2. Once that happens, the Steam Deck could transform into a legitimate portable Hackintosh. Nonetheless, it’s important to note that using Sequoia on the Steam Deck for gaming isn‘t advisable, given that the gaming library on macOS isn’t as robust as what you’ll find on Windows or Linux.

    In the end, with the right iGPU support on the Steam Deck, it might become a mobile substitute for a MacBook (the base 2023 MacBook Pro is currently priced at $1,299 on Amazon). However, @whatdahopper has pointed out that getting macOS Sequoia to run on this device is more challenging than simply installing Windows, which is something to keep in mind if you’re considering the Mac operating system for your gaming handheld.

    Tags: , ,
  • Can Samsung’s 2nm Technology Beat TSMC and Boost Semiconductors?

    Can Samsung’s 2nm Technology Beat TSMC and Boost Semiconductors?

    Samsung Semiconductor, known as the second-largest chipmaker in the world, is at a crucial point as it rushes to begin mass production of advanced 2nm chips. The outcome of this project could significantly impact its ability to rival the top company, TSMC, and reclaim some of its lost market share.

    The Stakes for Samsung Semiconductor

    Despite pouring in considerable funds, Samsung has not been able to reach TSMC’s level of profitability and scale. Currently, TSMC dominates the semiconductor foundry market with a substantial 62.3% market share, while Samsung only holds 11%. This gap has led to significant financial downturns for Samsung, highlighting the pressing need for a major technological advancement.

    Focus on 2nm Technology

    Samsung’s plan revolves around its 2nm and smaller manufacturing technologies. The company is making big investments in its production facilities, with intentions to add new production lines at its Hwaseong and Pyeongtaek locations. The target date for mass production of 2nm chips is set for 2025, with a further goal of achieving 1.4nm by 2027, which is in line with TSMC’s schedule.

    Challenges Ahead

    A critical element for Samsung’s success will be gaining significant clients for its 2nm technology. The company is in talks with Qualcomm, aiming to persuade the American semiconductor firm to select Samsung’s technology for its next-generation Snapdragon processors. If these partnerships can be established, it could greatly enhance Samsung’s foundry business and draw in additional clients.

    However, the path is not without obstacles. Samsung has faced difficulties before, including the postponed launch of its 3nm Exynos processor. Additionally, reports indicate that the upcoming Samsung Galaxy S25 series will utilize Qualcomm’s Snapdragon 8 Gen 4 globally, implying that Samsung might not have complete faith in its Exynos chips versus the Snapdragon option. Meanwhile, the Exynos 2500 is anticipated to power the Galaxy Z Fold 7 and Flip 7, which are expected to launch later in 2024.

    The triumph of Samsung’s 2nm technology could have significant consequences for the global semiconductor market. Should Samsung manage to narrow the gap with TSMC, it might incite heightened competition and potentially bring down prices for consumers. Furthermore, it could bolster South Korea’s status as a key player in the high-tech arena.

    Tags: , ,
  • TSMC’s 2nm Process Costs Over $30,000 Per Wafer

    TSMC’s 2nm Process Costs Over $30,000 Per Wafer

    The next major development for TSMC is its future N2 manufacturing process. As of early October, this technology is still under development, but an article from Commercial Times reveals potential costs associated with producing chips using this advanced method.

    Cost of N2 Technology

    The information suggests that creating a single 300-mm wafer with N2 technology will exceed $30,000. This is a significant amount, especially compared to past processes.

    In comparison, wafers made with N3 technology (commonly known as the 3nm process) are priced at around $18,500. Older technologies like N4 and N5 are even cheaper, costing about $15,000 each. This indicates that the expense of utilizing the upcoming N2 technology could be nearly double that of the N4 and N5 processes.

    Benefits of N2 Technology

    The increased costs might be largely justified by the various advantages the new technology promises to deliver. As reported by Tom’s Hardware, the 2nm process is expected to be highly efficient, boasting over 25% lower energy usage compared to N3E.

    It is important to mention that these figures are not officially provided by TSMC, so they should be viewed with caution. Additionally, pricing may fluctuate based on several factors, including order size and customer needs.

    Potential Early Adopters

    Apple is likely to be one of the first companies to adopt N2 technology. This includes the M5 series chips for devices like iPads, Mac minis, iMacs, and MacBooks, as well as the next A-series chips for iPhones. Other companies such as Qualcomm, Intel, AMD, Mediatek, and Nvidia may join later on in the process.

    Commercial Times (in Chinese) via Tom’s Hardware

    Tags: , ,
  • Corning Extreme ULE Glass: Unmatched Thermal Stability

    Corning Extreme ULE Glass: Unmatched Thermal Stability

    Corning has introduced a brand new ultra-low expansion (ULE) material designed to meet the demands of the upcoming low-NA and high-NA EUV lithography systems. This innovative Extreme ULE glass is expected to become the preferred choice for the next-generation photomasks and lithography mirrors in future fabrication tools.

    Exceptional Features

    The standout characteristic of Extreme ULE is its remarkably low thermal expansion, which ensures outstanding stability for photomask applications. Additionally, its flatness helps combat the annoying issue of "photomask waviness," reducing unwanted variations during chip production. Thanks to these qualities, advanced pellicles and photoresists can be employed to boost yields and enhance performance.

    Handling Heat

    EUV lithography systems utilize a plasma source to produce extremely intense EUV light, generating significant heat in the process. However, most of this heat remains contained within the source chamber, away from the photomask. The EUV light is directed towards the photomask using sophisticated lithography mirrors, which can be quite sensitive to temperature changes.

    Photomask Composition

    Photomasks are constructed from multilayer reflective materials that are highly efficient at reflecting EUV radiation. While they excel at reflecting light, they still absorb a small portion of the EUV energy, resulting in a slight increase in thermal load on the photomask.

    As EUV tools enhance their capabilities and process a greater number of wafers per hour (WPH), they introduce more powerful light sources. This leads to pellicles, photomasks, and photoresists being exposed to elevated levels of EUV radiation and heat. Corning’s Extreme ULE glass, an evolution of the traditional ULE family, offers remarkable thermal stability and uniformity—exactly what next-gen high-NA and upcoming low-NA EUV tools require.

    Future Innovations

    "As the needs of integrated chip manufacturing increase with the growth of artificial intelligence, the innovation in glass is crucial," stated Claude Echahamian, Vice President & General Manager, Corning Advanced Optics. "Extreme ULE Glass will enhance Corning’s essential role in the ongoing journey of Moore’s Law by facilitating higher-powered EUV manufacturing and improved yields."

    Tags: , ,