Tag: Qualcomm

  • Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

    Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

    Qualcomm is on the brink of introducing the Snapdragon 7+ Gen 3 processor, promising a remarkable leap in performance compared to its predecessor. Digital Chat Station, a well-known tech leaker, has unveiled crucial information regarding the upcoming chip, shedding light on its impressive clock speeds and architecture.

    Snapdragon 7+ Gen 3 Specifications (Leaked)

    The forthcoming chip, known as SM7675, is set to feature a Cortex-X4 prime core clocked at an astounding 2.9GHz. This boost in frequency, up from the previously reported 2.8GHz, signifies Qualcomm’s commitment to pushing the boundaries within the mid-range segment.

    This notable clock speed aligns with the prime core of the flagship Snapdragon 8 Gen 3, hinting that the 7+ Gen 3 could potentially deliver performance levels akin to high-end processors. Additionally, the chip’s architecture is reported to mirror that of the Snapdragon 8 Gen 3, with a “1+4+3” core configuration. The four A720 middle cores are anticipated to operate at 2.6GHz, while the three A520 efficient cores are likely to be clocked at 1.9GHz. The GPU will be equipped with an Adreno 732 GPU, promising improved graphics performance.

    OnePlus Ace 3V and Snapdragon 7+ Gen 3

    Earlier rumors had hinted that the OnePlus Ace 3V might be equipped with the SM7675 chip, potentially making it the first device to showcase the capabilities of the Snapdragon 7+ Gen 3. The Ace 3V is also expected to feature a flat OLED 1.5K 8T LTPO display with a 120Hz refresh rate, 16GB of RAM, a 5500mAh battery, and support for 100W fast charging, positioning it as a competitive player in the mid-range market.

    Qualcomm introduced the Snapdragon 7 Gen 3 processor last year, falling short in terms of power compared to its predecessor, the Snapdragon 7+ Gen 2. The latter featured a “1+3+4” architecture, incorporating a high-performance ARM Cortex-X2 core (up to 2.91 GHz), three mid-range ARM Cortex-A710 cores (up to 2.49 GHz), and four efficient ARM Cortex-A510 cores (up to 1.8 GHz).

    Future Possibilities with Snapdragon Chips

    The leaked information suggests that the SM7675 may not be the only chip based on this architecture. Speculations point towards another chip, codenamed SM8635, potentially being a variant with different frequencies based on the SM7675 architecture. These revelations align with earlier statements from Ice Universe, a prominent tech leaker, who indicated that Qualcomm might launch these chips by March 2024. Both chips, internally dubbed “Cliffs” at Qualcomm, are rumored to inherit the architecture of the Snapdragon 8 Gen 3, expanding the range of options available to manufacturers.

    Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

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  • Qualcomm Reveals 5G Future: Snapdragon X80 Modem & FastConnect 7900 at MWC 2024

    Qualcomm Reveals 5G Future: Snapdragon X80 Modem & FastConnect 7900 at MWC 2024

    The heart of technology is beating at the MWC 2024 held in Barcelona. Many companies from around the world are showcasing their latest products and services at this fair. As Gizmochina, we are closely following the event and bringing you updates. One of the companies making a presence at MWC is Qualcomm. The company announced the Snapdragon X80 5G modem, FastConnect 7900, and much more at the event. Here are the details…

    Qualcomm Unveils Snapdragon X80 5G Modem, FastConnect 7900 and More

    At the MWC 2024, Qualcomm has introduced the next generation 5G modem and connectivity systems that will further advance the mobile world. Standout innovations among these include the Snapdragon X80 5G Modem-RF System and the FastConnect 7900 Mobile Connectivity System.

    Snapdragon X80 5G Modem: Pushing Boundaries

    The Snapdragon X80 modem pushes the boundaries of 5G speeds with capabilities for up to 10 Gbps download and 3.5 Gbps upload. It also incorporates 5G Advanced support for greater network capacity, reliability, and reduced latency. AI-powered optimizations further enhance its performance and power efficiency. This modem system is intended for use in a wide array of devices such as smartphones, mobile broadband devices, computers, XR devices, automobiles, industrial IoT, and fixed wireless access points.

    FastConnect 7900: Integrating Technologies

    The FastConnect 7900 Mobile Connectivity System stands out as the first chip to integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies. Its Wi-Fi 7 support enables data speeds up to 5.8 Gbps for a faster, and more seamless wireless experience. Enhanced Bluetooth 5.4 and UWB capabilities improve precision for location-based services and proximity communications. This system’s low-power design contributes to longer battery life for devices.

    Additionally, Qualcomm introduced the Qualcomm AI Hub designed to drive next-generation AI-based connectivity experiences. The AI Hub can work seamlessly with the Snapdragon X80 modem, FastConnect 7900 system, as well as other Qualcomm platforms.

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  • Qualcomm Snapdragon X Elite Chip Appears on Geekbench

    Qualcomm Snapdragon X Elite Chip Appears on Geekbench

    Recently, a new Qualcomm chip, identified as model number Qualcomm ZH-WXX and thought to be the Snapdragon X Elite, made an appearance on the Geekbench benchmarking platform. This chip showcased impressive performance metrics with a single-core score of 2574 and a multi-core score of 12562. It was tested on a device operating on Microsoft Windows 11, equipped with a 12-core CPU at 4.01 GHz, and 32GB of RAM.

    In October 2023, Qualcomm introduced the Snapdragon X Elite, which features the custom-designed Qualcomm Oryon CPU. The chip is built on a TSMC’s 4nm process node, featuring 12 cores and 64-bit architecture. It boasts a base clock speed of 3.8GHz, with the capability to reach up to 4.3GHz in dual-core turbo frequency.

    Performance Boost with Snapdragon X Elite

    The company positions this CPU as a trailblazer in mobile computing, claiming it delivers up to twice the CPU performance of its competitors. It achieves this heightened level of performance at peak power while consuming only a third of the energy.

    AI Processing Capabilities of Snapdragon X Elite

    The standout feature of the Snapdragon X Elite is its AI processing capabilities. It is said to be 4.5 times faster in AI processing compared to its rivals, capable of handling complex AI models with over 13 billion parameters directly on the device. This capability enables a smoother user experience, enhancing multitasking and offering intuitive features like AI-powered assistants and advanced video conferencing tools.

    Market Impact and Future Expectations

    The company has made strong claims about the X Elite’s performance, stating it surpasses the Apple M2 Max and Intel Core i7-1355U in single-threaded performance metrics. According to Qualcomm, the X Elite not only outperforms the M2 Max in single-threaded tasks but also achieves peak performance with 30% lower power consumption. In multi-core tasks, it’s said to be 50% faster than the M2.

    Major PC manufacturers such as Dell, Acer, Honor, HP, Lenovo, Samsung, and ASUS are anticipated to release laptops featuring the Snapdragon X Elite starting in mid-2024. Even Xiaomi is reportedly preparing to unveil a new slim laptop, likely from the Redmi G Pro 2024 series, featuring this chip.

    Qualcomm Snapdragon X Elite Chip Appears on Geekbench
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  • Samsung, Google Early Users in Qualcomm’s Snapdragon XR2+ Gen 2 Platform

    Samsung, Google Early Users in Qualcomm’s Snapdragon XR2+ Gen 2 Platform

    Qualcomm Unveils Snapdragon XR2+ Gen 2 Platform Enhancing VR Experience

    One year post the initial collaboration announcement involving Qualcomm, Samsung, and Google within the XR realm, the long-awaited Snapdragon XR2+ Gen 2 platform has been revealed. This updated chipset, which supersedes the XR2 Gen 2 present in the Meta Quest 3, delivers notable enhancements in graphics processing, potentially rivaling the performance prowess of Apple’s forthcoming Vision Pro headset.

    Augmented Resolution and Refresh Rate

    The standout attribute of the XR2+ Gen 2 lies in its support for an impressive 4.3K resolution per eye coupled with a 90fps refresh rate. This marks a substantial upgrade from the XR2 Gen 2’s 3K resolution, promising users a crisper and more engaging virtual reality (VR) encounter.

    Enhanced Tracking Capabilities

    Beyond the enhanced visual encounter, the XR2+ Gen 2 flaunts improved tracking capabilities. With the ability to accommodate up to 12 cameras and robust on-device AI, VR headsets leveraging this platform will proficiently track user movements and surroundings. This advancement should facilitate more seamless navigation and interaction within virtual environments.

    Amplified Processing Capability

    Qualcomm has also made notable progress in terms of processing power with the XR2+ Gen 2. The platform showcases a 15% escalation in GPU frequency and a 20% rise in CPU frequency in comparison to its forerunner. This performance boost equips the chipset to adeptly manage even the most demanding VR applications.

    Collaboration with Goertek for Reference Design

    To hasten VR headset development, Qualcomm has partnered with Goertek to craft a fresh reference design. This pre-configured platform is available in two variants – one powered by the XR2 Gen 2 for a 3K resolution adventure and another fueled by the XR2+ Gen 2 for the full 4K immersion.

    Expansion of Strategic Partnerships

    Qualcomm has affirmed that the novel Snapdragon XR2+ Gen 2 chip will find utility in the forthcoming XR innovations from Samsung and Google. Furthermore, the corporation has engaged with at least five other hardware manufacturers, including HTC, to advocate for its latest platform. With Samsung’s Unpacked event drawing near, thrilling VR revelations may be on the horizon as they gear up to rival Apple’s hotly anticipated Vision Pro headset.

    In summary, Qualcomm’s Snapdragon XR2+ Gen 2 platform ushers in significant progress in resolution, refresh rate, tracking capabilities, and processing potency for VR headsets. With collaborative alliances in place to bolster its integration, the landscape is primed for a new chapter of immersive virtual reality escapades.

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  • Qualcomm, MediaTek Choose TSMC Over Samsung for 3nm Tech

    Qualcomm, MediaTek Choose TSMC Over Samsung for 3nm Tech

    TSMC Preferred by Leading Chip Manufacturers

    Prominent chip manufacturers including Nvidia, Qualcomm, MediaTek, and various others have opted for TSMC to produce their upcoming top-tier chipsets. These cutting-edge chipsets will be developed using TSMC’s sophisticated 3nm process technology.

    TSMC Chosen Over Samsung by Qualcomm and MediaTek

    Initially, Qualcomm was rumored to be considering 3nm chip supplies from both Samsung and TSMC for the Qualcomm Snapdragon 8 Gen 4 SoC. However, according to a new report from China Times, industry behemoths MediaTek and Qualcomm have opted to partner with TSMC for its second-generation 3nm process (N3E). This process is slated for the production of the Dimensity 9400 and Snapdragon 8 Gen 4 chipsets.

    Apple’s Dependence on TSMC

    Apple, a key client for TSMC, is set to leverage its 3nm process line for the forthcoming M series and A series chipsets. Presently, Apple is utilizing TSMC’s first-generation 3nm process (N3B) in the A17 Pro processor, which energizes the iPhone 15 Pro series. However, Samsung Foundry is still seeking significant clients for its 3nm chip manufacturing technology.

    Shifting Landscape of Chipset Manufacture

    Historically, companies like Qualcomm, MediaTek, Apple, and Nvidia have turned to Samsung Foundry for their chipset requirements, albeit not always for flagship processors. With Samsung’s introduction of advanced 3nm process technology, it aimed to attract orders from these companies. Nonetheless, the transition to TSMC appears to be progressing slower than expected.

    In essence, leading chip manufacturers such as Nvidia, Qualcomm, MediaTek, and Apple are choosing TSMC for the production of their upcoming top-tier chipsets. While Samsung Foundry was initially anticipated to be a strong contender, it has not yet secured major clients for its 3nm chip manufacturing capabilities. TSMC’s advanced 3nm process technology is emerging as the preferred option among these industry giants.

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  • Discover the Future: Oppo Reno 11, Honor 100, and More

    Discover the Future: Oppo Reno 11, Honor 100, and More

    Red Magic 6S Pro

    The upcoming debut from Red Magic is slated to be the Red Magic 6S Pro. This smartphone designed for gaming enthusiasts is expected to be equipped with Qualcomm’s most recent Snapdragon 888 Plus chipset. Reports suggest it will boast a high-refresh-rate screen and a generous battery capacity, catering to extended gaming sessions. Full details on pricing and specifications are set to be disclosed at the unveiling event.

    Honor 50A

    Following closely is the Honor 50A, a mid-range smartphone likely to run on MediaTek’s Dimensity 900 chipset. Speculations point to a triple-camera configuration and a vivid display as key features. The Honor 50A is anticipated to present an enticing price tag, appealing to those on a budget.

    Oppo Reno7

    Rounding up the lineup is the Oppo Reno7, anticipated to be furnished with Qualcomm’s Snapdragon 778G chipset, promising a blend of performance and energy efficiency. The Oppo Reno7 is rumored to showcase an elegant design and a versatile camera setup. Detailed pricing and specifications will be disclosed during the product launch.

    Conclusion

    Excitement is building among smartphone enthusiasts with the impending revelations from Red Magic, Honor, and Oppo. Whether you are a gaming fanatic, a cost-conscious consumer, or someone seeking a comprehensive smartphone experience, these upcoming releases are likely to cater to your requirements. Keep an eye out for further updates and official announcements during the launch events scheduled for November 23 in China.

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  • Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days

    Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days

    Qualcomm and MediaTek are set to release their latest flagship processors, the Snapdragon 8 Gen 3 and Dimensity 9300. However, recent leaks suggest that both companies are also preparing to announce sub-flagship chipsets, namely the Snapdragon 7 Gen 3 and Dimensity 8300.

    Snapdragon 7 Gen 3 and Dimensity 8300 Launch Timeframe

    According to tipster WHY LAB, both chipsets will be launched within the next two weeks. The Snapdragon 7 Gen 3 chip is expected to debut first, followed by the Dimensity 8300 chip.

    Snapdragon 7 Gen 3 Chipset

    It is speculated that the Honor 100, which is scheduled to be unveiled in China on November 23, will be the first phone to feature the Snapdragon 7 Gen 3 chip. Other smartphones, such as the Vivo S18, Vivo V30, and OnePlus Ace 3 (global name: OnePlus Nord 4), are also expected to be powered by this chipset.

    The Snapdragon 7 Gen 3 is equipped with a high-performance core running at 2.63GHz, three performance cores operating at 2.40GHz, and four efficiency cores clocked at 1.80GHz. Additionally, it features an Adreno 720 GPU.

    Dimensity 8300 Chipset

    On the other hand, the Dimensity 8300 chipset is likely to be featured in the upcoming Redmi K70e. The K70 series, which includes the K70 and K70 Pro, is expected to be launched in China by the end of this month.

    The Dimensity 8300 is speculated to include one Cortex-X3 super-large core clocked at 2.8GHz, accompanied by three Cortex-A715 performance cores running at 2.4GHz, and four Cortex-A510 efficiency cores operating at 1.6GHz. In terms of graphics, it integrates a G520 MC6 GPU with a frequency of 850MHz.

    Manufacturing and Performance

    Both the Snapdragon 7 Gen 3 and Dimensity 8300 chipsets are said to be manufactured on TSMC's 4nm process. This means that these chips will offer top-notch performance and better power efficiency on sub-flagship phones.

    In conclusion, Qualcomm and MediaTek are gearing up to launch their sub-flagship chipsets, the Snapdragon 7 Gen 3 and Dimensity 8300. These chipsets are expected to bring improved performance and power efficiency to upcoming smartphones from various brands.

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  • Qualcomm Snapdragon 7 Gen3: Emphasizing Quality Rather Than Competing with Flagship Devices

    Qualcomm Snapdragon 7 Gen3: Emphasizing Quality Rather Than Competing with Flagship Devices

    What to Expect from the New Mid-Range Snapdragon 7 Gen3

    Qualcomm is gearing up to launch its Snapdragon 7 Gen3 chip, which has been built on the TSMC 4nm process. However, leaked specifications suggest that this new chip might not outperform its predecessor, the Snapdragon 7+ Gen2.

    Specifications Comparison

    The Snapdragon 7 Gen3 features a 1+3+4 architecture, similar to its predecessor. Its CPU consists of 1×2.63GHz big core, 3×2.4GHz, and 4×1.8GHz cores, all powered by an Arm Cortex-A715 with an integrated Adreno 720 GPU.

    On the other hand, the Snapdragon 7+ Gen2 boasts a CPU with 1×2.91GHz big core, 3×2.49GHz, and 4×1.8GHz cores, along with an integrated Adreno 725 GPU. It is evident that the Snapdragon 7 Gen3's specifications are slightly downgraded in terms of performance compared to the Snapdragon 7+ Gen2.

    Strategic Decision for Efficiency and Cost-Effectiveness

    The Snapdragon 7+ Gen2 has only been adopted in a few models, such as the Redmi Note 12 Turbo and the Realme GT Neo5 SE, primarily due to its higher cost. As a result, not many consumers have experienced its capabilities.

    Qualcomm seems to have made a strategic decision with the Snapdragon 7 Gen3 to focus on efficiency and cost-effectiveness. This chip is positioned as a mid-range processor, rather than a sub-flagship model, making it a more accessible choice for smartphone manufacturers.

    The Advantage of the TSMC 4nm Process

    Despite its seemingly lower specifications, the Snapdragon 7 Gen3 has the advantage of being built on the advanced TSMC 4nm process. This is expected to result in improved energy efficiency and overall performance, even if it doesn't match the raw power of the Snapdragon 7+ Gen2.

    Widening Market Reach

    Manufacturers like Xiaomi, vivo, and others in Europe are expected to adopt the Snapdragon 7 Gen3 in their upcoming devices. With its cost-effective approach, this processor could find a broader market reach, making it a pivotal component in the next generation of smartphones.

    Conclusion

    In conclusion, while the Snapdragon 7 Gen3 may not surpass its predecessor in terms of performance, it is set to deliver a well-balanced blend of efficiency and cost-effectiveness. It will be interesting to see how it fares against the competition and whether it becomes the chip of choice for mid-range smartphones in the coming year.

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  • Partnership between Qualcomm and Iridium dissolved, ending satellite connectivity for smartphones

    Partnership between Qualcomm and Iridium dissolved, ending satellite connectivity for smartphones

    Qualcomm and Iridium Communications have recently announced the end of their partnership to bring satellite services to smartphones. This decision was made due to the lack of adoption of the technology by smartphone manufacturers.

    The partnership between Qualcomm and Iridium was announced earlier this year, and the two companies successfully developed and demonstrated the technology. However, smartphone manufacturers showed hesitancy in adopting the technology as it was proprietary to Qualcomm and Iridium.

    A spokesperson from Qualcomm stated, “Smartphone OEMs have indicated a preference towards standards-based solutions for satellite connectivity in mobile devices. We expect to continue to collaborate with Iridium on standards-based solutions while discontinuing efforts on the proprietary solution that was introduced earlier this year.”

    Iridium CEO Matt Desch expressed disappointment in the partnership not immediately yielding results, but he believes that the industry is moving towards increased satellite connectivity in consumer devices. He mentioned that major mobile network operators and device manufacturers, led by Apple, still plan to provide expanded coverage and new satellite-based features to their customers.

    Desch also stated, “Our global coverage and regulatory certainty make us well suited to be a key player in this emerging market.”

    With the termination of the agreements with Qualcomm, Iridium can now directly re-engage with smartphone OEMs, other chipmakers, and smartphone operating system developers that the company had been collaborating with previously.

    Iridium also plans to pursue new relationships with “smart device OEMs” for both existing and future service plans.

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