Qualcomm and MediaTek are set to release their latest flagship processors, the Snapdragon 8 Gen 3 and Dimensity 9300. However, recent leaks suggest that both companies are also preparing to announce sub-flagship chipsets, namely the Snapdragon 7 Gen 3 and Dimensity 8300.
Snapdragon 7 Gen 3 and Dimensity 8300 Launch Timeframe
According to tipster WHY LAB, both chipsets will be launched within the next two weeks. The Snapdragon 7 Gen 3 chip is expected to debut first, followed by the Dimensity 8300 chip.
Snapdragon 7 Gen 3 Chipset
It is speculated that the Honor 100, which is scheduled to be unveiled in China on November 23, will be the first phone to feature the Snapdragon 7 Gen 3 chip. Other smartphones, such as the Vivo S18, Vivo V30, and OnePlus Ace 3 (global name: OnePlus Nord 4), are also expected to be powered by this chipset.
The Snapdragon 7 Gen 3 is equipped with a high-performance core running at 2.63GHz, three performance cores operating at 2.40GHz, and four efficiency cores clocked at 1.80GHz. Additionally, it features an Adreno 720 GPU.
Dimensity 8300 Chipset
On the other hand, the Dimensity 8300 chipset is likely to be featured in the upcoming Redmi K70e. The K70 series, which includes the K70 and K70 Pro, is expected to be launched in China by the end of this month.
The Dimensity 8300 is speculated to include one Cortex-X3 super-large core clocked at 2.8GHz, accompanied by three Cortex-A715 performance cores running at 2.4GHz, and four Cortex-A510 efficiency cores operating at 1.6GHz. In terms of graphics, it integrates a G520 MC6 GPU with a frequency of 850MHz.
Manufacturing and Performance
Both the Snapdragon 7 Gen 3 and Dimensity 8300 chipsets are said to be manufactured on TSMC's 4nm process. This means that these chips will offer top-notch performance and better power efficiency on sub-flagship phones.
In conclusion, Qualcomm and MediaTek are gearing up to launch their sub-flagship chipsets, the Snapdragon 7 Gen 3 and Dimensity 8300. These chipsets are expected to bring improved performance and power efficiency to upcoming smartphones from various brands.
