Tag: MediaTek

  • TECNO and MediaTek Partner for Next AI Revolution

    TECNO and MediaTek Partner for Next AI Revolution

    TECNO and MediaTek have come together to start a new AI lab, aiming to boost innovation in artificial intelligence (AI) technology. This initiative was officially launched in Shenzhen on September 19, 2024, with the goal of enhancing AI applications for smart devices and enriching mobile experiences, especially in emerging markets.

    Key Figures at the Launch Event

    The launch event featured several notable attendees, including Mr. Shi Tuanwei, General Manager of the TECNO TEX AI Center; Ms. Liu Longzhi, Global Head of PR at TECNO; Dr. Lu Zhongli, Deputy General Manager of MediaTek’s Computing and AI Technology Business Unit; and Mr. Li Shaoding, Associate Director of MediaTek’s Wireless Product Software Development Department.

    The main aim of this partnership is to advance AI technology through collaborative efforts, specifically focusing on AI solutions for smart devices like smartphones. The lab plans to deliver improved AI experiences that make smart devices more effective and beneficial in daily life, particularly in rapidly growing markets.

    Focus Areas of the AI Laboratory

    The TECNO and MediaTek AI Laboratory will prioritize several key innovation areas, including:

    • Large Language Models (LLMs) – Utilizing advanced AI models to enhance communication and data comprehension.
    • Intelligent Agents and AI Assistants – Creating smart assistants that help users manage tasks efficiently.
    • AI Imaging on Mobile Devices – Enhancing mobile photography and video capabilities with AI-driven improvements.
    • Generative AI Solutions – Developing AI solutions that can function directly on devices (edge deployment), ensuring quicker and more efficient AI services.

    These advancements are expected to popularize AI technology in emerging markets, offering users improved services and smarter mobile applications.

    TECNO’s Vision in the Collaboration

    TECNO has extensive experience catering to users in emerging markets. Their involvement in this collaboration is crucial to ensure that AI innovations are not only state-of-the-art but also practical for everyday use. TECNO’s vision revolves around deeply integrating AI into users’ lives with useful and user-friendly applications.

    TECNO is particularly focused on AI-powered products like their smart assistant, Ella. Ella helps users with daily tasks such as writing, translation, searching, schedule management, and photo editing. A notable feature of Ella is its deep connection with localized language recognition, making it especially valuable in areas with limited global language support.

    In addition to their AI vision, TECNO is also innovating in areas like large models, AI-generated content (AIGC) for imaging, and AI voice assistants that cater to minority languages. These innovations aim to make AI more accessible and useful for a wider range of users.

    MediaTek’s Role in the AI Laboratory

    MediaTek, a leader in chip design and computing platforms, plays an important role in enabling efficient AI operations on mobile devices. Their mobile computing platform is tailored to run AI algorithms that power various applications, from intelligent agents to generative AI solutions.

    MediaTek’s contributions to this partnership will focus on several key areas, including:

    • Generative AI – Developing AI that can autonomously generate content or perform tasks.
    • Multimodal AI – Enhancing AI’s ability to process and understand a variety of data types, including images, text, and audio.
    • Agent Intelligence – Creating intelligent agents that can assist users with complex tasks.

    During the launch event, leaders from both TECNO and MediaTek highlighted the significance of this collaboration for the future of AI technology. Mr. Shi Tuanwei from TECNO remarked, “AI technology will lead technological development over the next 20 years. This partnership will enhance the AI application experience, ushering in a new generation of AI smartphones.” Dr. Lu Zhongli from MediaTek added, “Generative AI, multimodal, and agent intelligence are the future trends in AI. This joint effort will revolutionize the terminal application ecosystem through edge AI technology.”

    Significance of the Collaboration

    The formation of this joint AI laboratory represents a key moment in the smartphone industry. By embedding AI into smart devices, TECNO and MediaTek aim to speed up the development of AI-enabled smartphones and make these technologies more accessible to users in emerging markets.

    This collaboration is poised to drive AI innovation and influence the future of smart devices, boosting productivity, creativity, and convenience for users worldwide. As AI becomes more integrated into daily technology, users can anticipate more intelligent, efficient, and personalized mobile experiences.

    Tags: , ,
  • Huawei Sues MediaTek for Patent Infringement Over Chip Technology

    Huawei Sues MediaTek for Patent Infringement Over Chip Technology

    Huawei, the Chinese technology conglomerate, has initiated a patent infringement lawsuit against MediaTek, a prominent chip manufacturer, in a Chinese local court. The lawsuit alleges that MediaTek's technologies infringe upon Huawei's network communication patents, which encompass 5G, 4G, and possibly 3G.

    MediaTek acknowledged the lawsuit in a statement released this morning, recognizing Huawei's accusations of patent infringement. Nevertheless, MediaTek minimized the impact, mentioning that it is presently navigating the judicial process and chose not to provide additional comments.

    MediaTek's Role and Impact

    As a leading chipmaker, MediaTek supplies components to significant smartphone and tablet manufacturers, such as Samsung, Amazon, Oppo, Sony, Vivo, and Xiaomi. MediaTek was also a crucial supplier for Huawei's smartphone division until stricter US export controls were enforced in 2020.

    Sources close to the case indicate that Huawei's lawsuit against MediaTek is mainly driven by the desire to secure licensing fees to support its ongoing research and development (R&D) endeavors. Such lawsuits also enable Huawei to diversify its revenue streams, particularly after US sanctions heavily affected its previously dominant smartphone business.

    Huawei's Patent Portfolio and Licensing Efforts

    Huawei holds an extensive collection of standard-essential patents (SEPs) crucial for wireless communication technologies, including around 20% of the world's 5G-related patents.

    Since 2021, in response to intensified US restrictions, Huawei has increased its patent licensing activities. The company has obtained licensing and cross-licensing agreements with major European automakers, including Volkswagen, Mercedes-Benz, Audi, BMW, and Porsche.

    Additionally, in 2023, Huawei signed 5G technology agreements with Oppo and Samsung. The previous year, Huawei sought licensing fees from several Japanese companies, claiming that their technologies infringed its patents.

    Revenue from Patent Royalties

    In 2022, Huawei reported $560 million in revenue from patent royalties, with approximately 200 companies holding licensing agreements with the tech giant, as reported by Nikkei Asia. With the lawsuit against MediaTek, Huawei seems committed to enhancing its revenue streams through assertive patent enforcement and licensing strategies.

    Tags: , ,
  • MediaTek Unveils Dimensity 7300 Series: Enhanced Gaming & AI Performance

    MediaTek Unveils Dimensity 7300 Series: Enhanced Gaming & AI Performance

    MediaTek has introduced two new mid-range chipsets – the Dimensity 7300 and Dimensity 7300X. Both chips are built on a 4nm process and claim to offer 25% lower power consumption on the performance cores compared to the Dimensity 7050.

    Technical Specifications

    The Dimensity 7300 series differs from the Dimensity 7050’s (2+6) core configuration by featuring 4 x Cortex-A78 cores clocked at 2.5GHz and 4 x Cortex-A55 cores clocked at 2.0GHz. Although these are the same cores used in the Dimensity 7050, there are significant improvements in performance and power efficiency.

    For graphics, the series uses the latest Arm Mali-G615 GPU, accompanied by MediaTek HyperEngine optimizations designed to enhance the gaming experience. MediaTek claims these chips offer a 20% higher FPS and 20% lower power consumption compared to competitors. The series also includes “smart resource optimization,” network optimization for games, and support for Bluetooth LE with Dual-Link True Wireless Stereo Audio.

    A notable difference between the two chips is that the Dimensity 7300X supports dual displays, making it suitable for more affordable foldable devices.

    Imaging Enhancements

    The Dimensity 7300 series also introduces imaging enhancements with the new MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP. Phones equipped with this series can support a 200MP main camera. With enhanced hardware engines, it offers precise noise reduction (MCNR), face detection (HWFD), and video HDR. Live focus photo performance and photo remastering are now 1.3X and 1.5X faster respectively compared to the Dimensity 7050.

    In simpler terms, the chip enables OEMs to offer better camera systems, but it depends on the smartphone manufacturers on how they utilize these added capabilities.

    AI Performance

    The series includes the MediaTek APU 655, boasting a 2x improvement in AI performance over the Dimensity 7050.

    MediaTek Unveils Dimensity 7300 Series: Enhanced Gaming & AI Performance

    Tags: , ,
  • ARM Reveals Cortex-X925 CPU and Immortalis G925 GPU

    ARM Reveals Cortex-X925 CPU and Immortalis G925 GPU

    Chip designer ARM recently revealed the Cortex-X925 CPU and Immortalis G925 GPU, signaling a notable advancement in mobile performance for high-end smartphones set to launch later this year.

    The new Cortex CPU has a huge 36% increase in single-core performance

    The Cortex-X925 CPU features an impressive 36% boost in single-core performance along with a 41% enhancement in AI-related tasks. Additionally, it introduces a new generation of Cortex-A microarchitectures designed for "small" cores, which promise improved performance and efficiency.

    Immortalis G925 GPU

    Living up to its name, the Immortalis G925 GPU offers a 37% increase in graphics performance, a 52% boost in ray tracing capabilities for intricate objects, and a 34% enhancement in AI workloads. Remarkably, this power surge is achieved while consuming 30% less energy.

    Future Integration and Launches

    ARM is facilitating quicker device rollouts by providing manufacturers with an "optimized layout" for easier integration of these new designs. Although specific brands haven’t been confirmed yet, smartphones featuring these cores are anticipated by the end of the year. MediaTek has already announced plans to integrate them into their upcoming Dimensity 9400 chipset, potentially setting a new benchmark in the smartphone industry.

    ARM Reveals Cortex-X925 CPU and Immortalis G925 GPU
    Tags: , ,
  • Nvidia and MediaTek to Develop ARM-based AI SoC, Rumors Suggest

    Nvidia and MediaTek to Develop ARM-based AI SoC, Rumors Suggest

    Nvidia and MediaTek's potential collaboration has stirred excitement in the tech world. A recent leak hints at a surprising partnership between these two giants, suggesting they are co-developing an ARM-based system-on-chip (SoC) tailored for artificial intelligence applications. But there's more! The whistleblower, XpeaGPU, has added another thrilling detail: Nvidia might be targeting the handheld gaming market with its own ARM-based SoC.

    The Upcoming Switch 2 May Feature an Enhanced Tegra CPU

    XpeaGPU reveals that MediaTek is working on a next-gen gaming handheld SoC that will incorporate Nvidia’s powerful graphics processing capabilities. This revelation has already caught the attention of several Chinese manufacturers, who have shown interest in the chip. XpeaGPU clarifies that this SoC is a distinct project, separate from other collaborations between the two companies.

    Nvidia has prior experience in the handheld gaming space. They previously entered the market with the Tegra SoC-powered Shield console. Interestingly, the widely popular Nintendo Switch also uses the same Nvidia chipset. Currently, AMD dominates the home console market, with their chips powering most handheld devices, including the Steam Deck.

    Rumors of a New Switch 2

    Speculation suggests that a potential Switch 2 might feature an upgraded Tegra SoC, offering graphics performance comparable to the GeForce RTX 2050. However, the real game-changer would be Nvidia developing an entirely new SoC specifically for handheld gaming.

    The most fascinating aspect of this rumor is Nvidia’s choice of partner. Instead of collaborating with the usual high-end SoC leader, Qualcomm, they have chosen MediaTek. This unexpected alliance has gamers and tech enthusiasts eagerly anticipating further developments and Nvidia’s potential comeback in the handheld gaming market.

    Tags: ,
  • MediaTek Introduces Dimensity 8250 5G SoC with APU 580

    MediaTek Introduces Dimensity 8250 5G SoC with APU 580

    MediaTek has introduced the Dimensity 8250, a novel chipset designed for premium mid-range smartphones, essentially an updated variant of the Dimensity 8200, focusing primarily on AI enhancements.

    The 4nm Dimensity 8250 chip features an octa-core CPU, with a standout high-performance Arm Cortex-A78 core running at 3.1GHz. It encompasses a Mali-G610 MC6 GPU for seamless visuals and an APU 580 for improved AI processing.

    Improved Performance and AI Capabilities

    The Dimensity 8250 showcases remarkable camera functionalities, accommodating high-resolution sensors up to 320MP and impressive 4K 60fps HDR video recording. It effortlessly supports high refresh rate displays, scaling up to 120Hz for WQHD+ resolutions and an astonishing 180Hz for Full HD+ displays.

    Enhanced Connectivity Features

    Connectivity is exceptional, featuring a fully integrated 5G modem that offers download speeds up to 4.7Gbps. It is compatible with the latest WiFi 6E standard and Bluetooth 5.3. Furthermore, the chipset is equipped with support for India’s NavIC navigation system in addition to global options such as GPS, BeiDou, Glonass, Galileo, and QZSS.

    Future Smartphone Integration

    Rumors suggest that the OPPO Reno 12 could be the initial smartphone to incorporate this potent Dimensity 8250 chipset. Anticipate seeing this chipset powering upcoming mid-range devices as well.

    Tags: , ,
  • MediaTek Dimensity 6300: Powering Next Wave of Affordable 5G Phones

    MediaTek Dimensity 6300: Powering Next Wave of Affordable 5G Phones

    MediaTek has entered the competitive mid-range market with the introduction of the Dimensity 6300, a new chipset designed to power upcoming affordable 5G smartphones.

    Specifications and Features

    The Dimensity 6300 is built on a 6nm process, representing a modest improvement from its predecessor, the Dimensity 6100+. MediaTek claims a 10% increase in CPU performance, attributed to two faster Cortex-A76 cores clocked at 2.4GHz, along with six Cortex-A55 cores running at 2GHz. Graphics processing is managed by a Mali-G57 MC2 GPU, a common choice in this segment.

    Enhanced Efficiency and Connectivity

    One notable feature is the integrated 5G modem that adheres to the 3GPP Release 16 standard. MediaTek boasts of enhanced power efficiency through their UltraSave 3.0+ technology, promising a 13% to 30% improvement in sub-6GHz 5G connections compared to competitors.

    Display and Camera Capabilities

    The Dimensity 6300 supports Full HD+ displays with a 120Hz refresh rate. Camera capabilities are mid-range, supporting up to 108MP sensors and dual 16MP configurations.Dimensity 6300 supports Full HD+ displays

    Connectivity and Storage Options

    Connectivity options include Bluetooth 5.2 and dual-band Wi-Fi 5 (a/b/g/n/ac), while storage is limited to UFS 2.2 and RAM is capped at LPDDR4x.

    The Realme C65 5G is set to be the first smartphone featuring the Dimensity 6300, scheduled for release later this month. MediaTek’s initiative is expected to prompt other manufacturers to follow suit, offering budget-friendly 5G connectivity solutions.

    While not groundbreaking, the Dimensity 6300 represents a significant step towards making 5G technology more accessible to a wider audience.

    MediaTek Dimensity 6300: Powering Next Wave of Affordable 5G Phones
    Tags: , ,
  • Samsung receives “special pricing” offer from MediaTek for its chips

    Samsung receives “special pricing” offer from MediaTek for its chips

    MediaTek is reportedly offering Samsung a discounted deal on its chips for use in budget-friendly phones, in an attempt to challenge Qualcomm’s dominance in the market. While it is unlikely that Samsung will use MediaTek chips in its premium Galaxy S series due to an existing agreement with Qualcomm, there are rumors that the Korean tech giant might consider using MediaTek processors in its more affordable smartphones.

    MediaTek’s Potential Win

    If this deal materializes, it would be a significant win for MediaTek, as Samsung is the world’s largest Android smartphone manufacturer. Reliable tipster Revegnus wrote on Twitter that MediaTek has offered special pricing exclusively for Samsung, suggesting that Samsung’s budget lineup may expand its use of MediaTek processors.

    Usage in Budget Smartphone Lineup

    These MediaTek processors are expected to be used in Samsung’s budget smartphone lineup, particularly in the entry-level models of the A, M, and F-series. However, recent sightings on benchmarking sites indicate that mid-range smartphones in the A and M-series might still use Exynos processors.

    Qualcomm’s Strong Position

    Currently, Qualcomm holds a strong position in the high-end smartphone market, while MediaTek has established dominance in the budget segment. If Samsung chooses to use MediaTek processors for its budget phones, Qualcomm will face a formidable challenge in outperforming MediaTek in this particular market.

    Potential Partnership Benefits

    A partnership with Samsung would not only increase MediaTek’s market share but would also open new doors for future collaborations with Samsung. However, it is important to note that this is just a rumor, and Samsung has not confirmed any plans to use MediaTek chips in its smartphones. Stay tuned for further updates on this matter.

    Tags: ,
  • Impressive AI and Performance Gains Revealed in MediaTek Dimensity 9400 Specs

    Impressive AI and Performance Gains Revealed in MediaTek Dimensity 9400 Specs

    Taiwanese chipmaker MediaTek recently held a ceremony to commemorate the beginning of construction for a new office building near the Hsinchu High-speed Railway station. The 22-story building is projected to house 3,000 employees by 2027.

    MediaTek’s CEO Teases Upcoming Dimensity 9400 Chip

    During the event, CEO Cai Lixing hinted at the forthcoming Dimensity 9400 chip, which is anticipated to be released in the fourth quarter of 2024. While not explicitly mentioned, Cai highlighted that the new System on a Chip (SoC) will feature enhanced AI capabilities, positioning it as a competitor to other high-end smartphone processors.

    Leak Reveals Potential Upgrades for Dimensity 9400

    Although specific details about the Dimensity 9400’s performance remain undisclosed, a report by China Times has shed some light on what can be expected from the chip.

    According to the leak, the Dimensity 9400 is set to benefit from TSMC’s 3nm process, a shift from the Dimensity 9300’s 4nm process. This transition is expected to deliver improved performance and power efficiency.

    MediaTek Sticks with Arm’s CPU Designs

    In contrast to Qualcomm, which is transitioning to its custom Oryon CPU cores, MediaTek is likely to continue utilizing Arm’s CPU designs. The Dimensity 9400 is anticipated to feature the Cortex-X5 as its main core, alongside three Cortex-X4 and four Cortex-A720 performance cores.

    Enhanced Processing Capabilities and Faster Image Creation

    The leaked details also suggest that the Dimensity 9400 will be capable of processing 12 to 15 tokens per second using a specific model called Llama 2 from Meta. This represents a significant improvement in processing speed compared to its predecessor.

    Furthermore, the Dimensity 9400 is expected to outperform the Dimensity 9300 in image creation using Stable Diffusion 1.5, completing the task in just 3 seconds instead of 3.5 seconds.

    A Promising Future for Dimensity 9400

    With these enhancements, the Dimensity 9400, and its successor, the APU 790, have the potential to deliver processing speeds that are 20-50% faster for tokens and up to 16.7% faster for image creation.

    However, it is important to note that these details are still preliminary and subject to change. Therefore, it is advisable to approach this information with caution.

    Tags: ,
  • Qualcomm, MediaTek Choose TSMC Over Samsung for 3nm Tech

    Qualcomm, MediaTek Choose TSMC Over Samsung for 3nm Tech

    TSMC Preferred by Leading Chip Manufacturers

    Prominent chip manufacturers including Nvidia, Qualcomm, MediaTek, and various others have opted for TSMC to produce their upcoming top-tier chipsets. These cutting-edge chipsets will be developed using TSMC’s sophisticated 3nm process technology.

    TSMC Chosen Over Samsung by Qualcomm and MediaTek

    Initially, Qualcomm was rumored to be considering 3nm chip supplies from both Samsung and TSMC for the Qualcomm Snapdragon 8 Gen 4 SoC. However, according to a new report from China Times, industry behemoths MediaTek and Qualcomm have opted to partner with TSMC for its second-generation 3nm process (N3E). This process is slated for the production of the Dimensity 9400 and Snapdragon 8 Gen 4 chipsets.

    Apple’s Dependence on TSMC

    Apple, a key client for TSMC, is set to leverage its 3nm process line for the forthcoming M series and A series chipsets. Presently, Apple is utilizing TSMC’s first-generation 3nm process (N3B) in the A17 Pro processor, which energizes the iPhone 15 Pro series. However, Samsung Foundry is still seeking significant clients for its 3nm chip manufacturing technology.

    Shifting Landscape of Chipset Manufacture

    Historically, companies like Qualcomm, MediaTek, Apple, and Nvidia have turned to Samsung Foundry for their chipset requirements, albeit not always for flagship processors. With Samsung’s introduction of advanced 3nm process technology, it aimed to attract orders from these companies. Nonetheless, the transition to TSMC appears to be progressing slower than expected.

    In essence, leading chip manufacturers such as Nvidia, Qualcomm, MediaTek, and Apple are choosing TSMC for the production of their upcoming top-tier chipsets. While Samsung Foundry was initially anticipated to be a strong contender, it has not yet secured major clients for its 3nm chip manufacturing capabilities. TSMC’s advanced 3nm process technology is emerging as the preferred option among these industry giants.

    Tags: , , ,