Tag: Intel

  • Intel Launches Free Game with Spring Bundle: Dying Light Deal

    Intel Launches Free Game with Spring Bundle: Dying Light Deal

    Key Takeaways

    1. Intel is partnering with Techland to offer a new game bundle, excluding Civilization 7, which adds value for gamers and content creators.
    2. The bundle is valued at $160, but the price for Dying Light: The Beast is not yet set and is not available on major PC platforms.
    3. Collaboration with Techland includes optimizing the game for Intel’s x86 platform and supporting GPU-specific features like XeSS 2 technologies.
    4. Intel aims to attract gamers by providing better value, including performance-boosting chipset driver updates and price cuts on its 14th generation Intel Core CPUs.
    5. The bundle is available at selected retailers until July 31, 2025, covering a range of Intel’s 14th generation CPU options.

    Intel is teaming up with the developer Techland, known for Dying Light, to provide a new game bundle that keeps Civilization 7 from its earlier package. This collaboration also brings great value for streamers and content creators, featuring extended trials for software like Canvid, VEGAS Pro 365, and XSplit Premium Suite.

    Bundle Pricing and Value

    Intel lists the bundle’s value at $160 but hasn’t set a price for Dying Light: The Beast, which is still not available on major PC gaming platforms like Steam and the Epic Games Store. This suggests that Intel might be offering even more value to gamers and users than before.

    Collaboration with Techland

    Part of Intel’s partnership involves close work with the developers to make sure the game is optimized for its x86 platform. They are also supporting their GPU-specific XeSS 2 features, which include XeSS Super Resolution (XeSS-SR), XeSS Frame Generation (XeSS-FG), and Xe Low Latency (XeLL). These technologies compete with Nvidia’s DLSS, Frame Generation, and Reflex, along with AMD’s Radeon anti-lag and FSR alternatives. However, adoption rates by developers remain lower, even with Intel’s Battlemage CPU series making a mark in the growing mid-range and entry-level GPU market by 2025.

    Intel’s Strategy for Gamers

    It’s no secret that Intel faces challenges in attracting gamers with its current and past generation Intel Core Series CPUs, especially compared to AMD’s specialized X3D CPUs. Nonetheless, Intel is making strides in a different area: providing better value for its users. This includes updates to its chipset drivers that can reportedly boost performance by up to 10%, along with significant price cuts on its 14th generation Intel Core series CPUs aimed at gamers and productivity users.

    Availability of the Bundle

    The bundle is currently available at select retailers, such as Newegg and Best Buy in the US, and it spans a wide range of CPU options. This includes Intel’s entry-level 14th generation Core i5 CPUs up to its high-end Core Ultra 9 Series 2 offerings, as well as laptop chips from the same generation.

    Note: This offer is live now and will continue until July 31, 2025, giving users about three months to take advantage of one of Intel’s more aggressive CPU bundles recently.

    What’s Coming Next

    Intel and Techland are collaborating on Dying Light: The Beast, which is the latest in the Dying Light series. As the exclusive CPU partner, Intel has been working closely with Techland to enhance the Dying Light: The Beast experience for PC gamers in anticipation of the game’s release this summer.

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  • Intel Launches Ultra-Thin Cooling Solution for 1000W Chips

    Intel Launches Ultra-Thin Cooling Solution for 1000W Chips

    Key Takeaways

    1. Intel has introduced an experimental liquid cooling solution capable of handling up to 1,000 watts of heat from next-gen chips.
    2. The innovative cooling system is integrated at the package level, using a compact water block with copper microchannels for efficient heat transfer.
    3. Prototypes for LGA and BGA processors show 15-20% improved thermal performance over standard liquid coolers.
    4. The cooling technology utilizes solder or liquid metal thermal interface material for better contact, allowing for more compact system designs.
    5. While not yet available commercially, this cooling method addresses rising demands from AI workloads and high-performance computing, indicating a potential shift in CPU thermal design.

    As the power and heat generated by chips keep increasing, especially in server processors and AI accelerators, companies are always looking for better ways to manage heat. Intel has taken a unique route to tackle this challenge by revealing an experimental liquid cooling solution at its Foundry Direct Connect event, which can handle up to 1,000 watts of heat from the next-gen chips.

    Innovative Cooling Approach

    The main concept of this package-level water cooling is to enhance heat transfer by placing the cooling system as near to the heat source as possible. Unlike typical cooling systems that are installed on top of processors, Intel’s method integrates the cooling directly at the package level. Instead of using a regular heat spreader, Intel’s solution includes a specially crafted compact water block that has precisely designed copper microchannels guiding the coolant across the CPU package. This idea is somewhat similar to direct-die cooling, which eliminates the heat spreader entirely to reduce thermal resistance.

    Prototype Development

    Intel has created prototypes for both LGA and BGA processors and has showcased this with Intel’s Core Ultra and Xeon server processors. The company asserts that this solution provides 15-20% improved thermal performance compared to standard liquid coolers used on delidded dies. The cooling system is said to employ solder or liquid metal thermal interface material, which ensures better contact. Furthermore, the very slim design of these cooling blocks may allow for more compact system designs, even while managing significantly greater power loads.

    Future Implications

    Although standard consumer CPUs don’t yet reach the 1,000-watt mark, this technology looks ahead to rising demands from AI workloads, high-performance computing, and professional uses. Intel has reportedly worked on this technology for years, with some research tracing back to 2005.

    Intel has not disclosed when or if this cooling method will be available for commercial products, but the demonstration hints at a major potential change in CPU thermal design. As chips continue to grow in power consumption and package density, direct cooling solutions might become vital for high-performance computing.

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    Intel Launches Ultra-Thin Cooling Solution for 1000W ChipsIntel Launches Ultra-Thin Cooling Solution for 1000W ChipsIntel Launches Ultra-Thin Cooling Solution for 1000W ChipsIntel Launches Ultra-Thin Cooling Solution for 1000W Chips

     

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  • Intel’s Lunar Lake AI PCs Struggle Sales Compared to Raptor Lake

    Intel’s Lunar Lake AI PCs Struggle Sales Compared to Raptor Lake

    Key Takeaways

    1. AI Trend Race: Since ChatGPT’s launch in late 2022, companies are rushing to leverage AI for marketing, with Microsoft promoting AI in its Windows laptops through initiatives like “CoPilot+ PC.”

    2. Chip Development: Intel and AMD are focusing on creating specialized “AI PC” chips for laptops, with Intel releasing its Core Ultra 100 and 200 APUs, while AMD has included “AI” in the names of its latest mobile chips.

    3. Consumer Preferences: Intel has seen a shift in consumer demand, favoring older Raptor Lake laptops over newer AI-focused models, leading to a shortage in production capacity for those older models.

    4. Marketing Challenges: The marketing strategies for Intel and AMD’s new processors have been ineffective, lacking engaging use cases that highlight their strengths, such as battery life and gaming capabilities.

    5. Future Insights: AMD’s upcoming earnings call will reveal whether its Ryzen AI-based laptops are performing better in the market compared to Intel’s recent offerings.

    Since ChatGPT’s launch in late 2022, a new race in AI has begun, prompting firms of all sizes to cash in on the “AI” trend. Microsoft also wanted in on the action, aiming to promote its Windows laptops through AI marketing. Last year, they rolled out the “CoPilot+ PC” initiative to certify laptops that achieve a certain level of machine learning performance.

    Chip Makers in the AI Game

    Both Intel and AMD, the leading manufacturers of Windows PC chips, have been developing “AI PC” chips tailored for laptops. Intel kicked off its AI PC journey with the Core Ultra 100 Meteor Lake APUs in 2023, which was followed by the Core Ultra 200 Lunar Lake APUs last year. AMD, not to be outdone, went a step further by incorporating “AI” into the names of their newest mobile APUs.

    Consumer Preferences Shift

    However, it appears that Intel’s pursuit of the AI PC trend hasn’t yielded the expected results. Intel has disclosed that buyers are leaning towards older Raptor Lake mobile laptops instead of the newer Meteor Lake/Lunar Lake models. In their recent Q1 2025 earnings call, Intel mentioned that the rising interest in older Raptor Lake and Alder Lake laptops has led to a shortage in their Intel 7 process capacity. This increased demand for the 13th-generation Raptor Lake laptops is largely attributed to their lower price point. The company stated that laptop manufacturers are “hedging their bets” due to “macroeconomic concerns and tariffs.”

    Marketing Missteps

    Taking cost factors into account, it’s worth questioning whether the Meteor Lake and Lunar Lake laptops were effectively marketed to the public. Over the last couple of years, Intel and AMD have branded their products as ready for the AI era, highlighting larger NPUs and more advanced iGPUs. Yet, without engaging use cases, the whole AI PC narrative appears to have unraveled.

    As noted by Hardware Canucks on X, things could have turned out differently if the latest Intel and AMD processors had been marketed based on their true strengths. For example, laptops featuring Intel’s Lunar Lake APUs, such as the latest Vivobook S 14, can finally claim battery life comparable to that of Apple MacBooks.

    In addition, with the recent Arc and Radeon iGPUs, users can enjoy modern gaming on sleek, lightweight devices. These significant selling points haven’t been effectively utilized by Intel, AMD, and Microsoft, overshadowed by the AI PC jargon.

    AMD is set to hold its earnings call next, and as Tom’s Hardware highlights, it will be fascinating to see if the Ryzen AI-based laptops are mirroring Intel’s path or performing better compared to AMD’s previous generation chips.

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  • Intel to Cut Over 20,000 Jobs to Reduce Bureaucracy

    Intel to Cut Over 20,000 Jobs to Reduce Bureaucracy

    Key Takeaways

    1. Intel plans to lay off over 20% of its workforce, about 20,000 employees, to simplify management and reduce red tape.
    2. The new CEO, Lip-Bu Tan, aims to restore an engineering-focused culture and rejuvenate the company’s engineering talent.
    3. The layoffs are expected to be announced alongside Intel’s first-quarter financial results on April 24.
    4. Intel’s current employee count stands at approximately 108,900 after previous layoffs in August 2024.
    5. The company faces challenges in maintaining market share against competitors like Nvidia and AMD, and its return to previous sales levels may take years.

    Intel appears to be gearing up for a significant overhaul that might not bode well for its workforce. A recent report indicates that the company plans to let go of over 20% of its employees in an effort to simplify management and cut down on red tape. Changes have been underway at Intel ever since new CEO Lip-Bu Tan took the helm last month. The announcement regarding the layoffs is anticipated this week.

    Rebuilding Engineering Culture

    According to a Bloomberg report, which references a source privy to the situation, this bold strategy aims to restore an engineering-focused environment at Intel. This aligns with Tan’s view that the company must rejuvenate its engineering talent that has diminished over time. Tan believes Intel should modify its manufacturing techniques to better meet customer demands. This approach seemingly involves laying off more than 20% of the workforce, which translates to around 20,000 employees worldwide.

    Current Employee Count

    By the close of 2024, Intel was reported to have 108,900 employees, following a previous wave of layoffs in August 2024. The new round of job cuts is expected to be disclosed on Thursday, April 24, coinciding with the release of first-quarter financial results.

    Market Challenges

    Intel has been facing difficulties in maintaining its market share against rivals such as Nvidia and AMD. Tan was appointed to tackle these challenges, and according to the report, his strategy includes creating more attractive products by divesting non-essential assets. Additionally, analysts have suggested that Intel may struggle to return to its former sales heights. If it manages to do so, it might take many years to achieve that goal.

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  • Intel Sells 51% Stake in Altera for $4.46 Billion Deal

    Intel Sells 51% Stake in Altera for $4.46 Billion Deal

    Key Takeaways

    1. Intel is selling its FPGA unit, Altera, to Silver Lake for $4.46 billion, significantly less than its original investment of $17 billion in 2015.
    2. The deal will provide Intel with $3.4 billion in cash and is aimed at improving the company’s focus and financial health.
    3. Altera’s CEO, Sandra Rivera, will resign, and Raghib Hussain from Marvell Technology Inc. will become the new CEO.
    4. Altera is a leading supplier of programmable chips, including FPGAs and SoCs, with applications across various industries.
    5. The transaction is expected to close in the latter half of 2025, after which Altera will operate as an independent entity.

    Intel is set to hand over its FPGA unit, Altera, to the private equity firm Silver Lake for a sum of $4.46 billion. This transaction values Altera at $8.75 billion, which is almost 50% less than the $17 billion Intel invested in 2015.

    Cash Flow and Strategic Focus

    As reported by Bloomberg, Intel will gain $3.4 billion in cash from this deal. Intel’s CEO, Lip-Bu Tan, expressed that this decision will “sharpen” the company’s focus, decrease its cost structure, and enhance its financial standing.

    Leadership Changes

    With this transition, Altera’s CEO, Sandra Rivera, will resign, and Raghib Hussain, who is the president of products and technologies at Marvell Technology Inc., will take over her role.

    Kenneth Hao, who is the chairman and managing partner at Silver Lake, mentioned that this investment represents “a once-in-a-generation opportunity to invest in a scale leader in advanced semiconductors.”

    Altera’s Market Position

    Altera is recognized as a top supplier of programmable chips, such as Field-programmable Gate Arrays (FPGA) and System-on-a-chip (SoC) components. These chips can be adapted for a wide range of uses, including data centers, communication systems, industrial automation, and much more.

    The agreement is expected to finalize in the latter half of 2025. After the transaction is complete, Intel will detach Altera’s financial data from its own, allowing Altera to function as a completely independent entity.

    “Altera is in a strong position to capitalize on its current momentum and create groundbreaking FPGA-based solutions that are influencing the future of computing driven by AI,” said Hussain. “I deeply appreciate the contributions Sandra has made and the team she has assembled as we embark on Altera’s new growth journey.”

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  • Intel Launches IPO Program to Enhance Arrow Lake CPU Sales

    Intel Launches IPO Program to Enhance Arrow Lake CPU Sales

    Key Takeaways

    1. Intel has launched the IPO (Intel Performance Optimizations) initiative in China to improve the performance of its Arrow Lake processors.

    2. The IPO program is being implemented in pre-assembled systems from Chinese companies, aiming for better performance without compromising stability or warranty.

    3. IPO optimizes CPU settings such as core clock rates and RAM speeds, achieving notable performance boosts, like a 10% increase in FPS for gaming.

    4. The initiative follows underwhelming performance from Arrow Lake processors, with Intel working on firmware updates to address these issues.

    5. There are plans for potential global rollout of similar optimization features, which could enhance Arrow Lake systems against competitors like AMD’s Ryzen 9000 series.

    Intel has subtly introduced a new performance boost initiative known as IPO (Intel Performance Optimizations) in China, aiming to enhance the performance of its lagging Arrow Lake processors.

    Program Deployment

    Details shared by hardware insider UNIKO’s Hardware on X (previously known as Twitter) indicate that the IPO initiative is being implemented in pre-assembled systems from Chinese companies like Maxsun. The IPO’s aim is to strike a balance between using components at their default speeds and manual overclocking, thus delivering improved performance while maintaining stability and warranty protections.

    How IPO Works

    The IPO framework functions by utilizing optimized profiles that adjust various CPU settings, which include P-cores, E-cores, ring-bus frequencies, NGU and D2D interconnections, plus power limits (PL1 and PL2), along with RAM speeds and timings. For instance, in a case from Maxsun, this technology achieved a 200 MHz boost in core clock rates and increased RAM speeds from DDR5-8000 to DDR5-8400. This change reportedly led to a 10% enhancement in FPS during gaming sessions.

    Future Prospects

    The rollout of IPO profiles follows the disappointing launch performance of Arrow Lake, where some chips underperformed compared to their earlier versions in certain situations. Intel has been striving to correct these issues through firmware and microcode updates since December, although testing has revealed inconsistent outcomes from these updates.

    Global Implications

    There are speculations that Intel may introduce similar “opt-in” BIOS settings for Arrow Lake processors worldwide in the future, suggesting that the current IPO program could be a test run for a larger feature set. If this initiative proves successful and widely embraced, it could enhance the appeal of Arrow Lake systems—particularly pre-built ones—against competitors like AMD’s Ryzen 9000 series.

    At this time, the IPO initiative is limited to the Chinese market. Vendors like Maxsun are marketing PCs that come with this optimization, with warranty services reportedly managed by the retailer. Information about global launch plans is still limited as Intel works to improve Arrow Lake’s performance further.

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  • Intel Xe2 Battlemage GPUs Face Tough Competition from Nvidia

    Intel Xe2 Battlemage GPUs Face Tough Competition from Nvidia

    Key Takeaways

    1. Intel’s Arc Battlemage B580 and B570 GPUs received positive reviews for their performance and competitive pricing.
    2. Anticipation for the Arc B770 GPU was high among gamers looking for affordable high-end options.
    3. Recent reports indicate that the development of the Arc B770 GPU may have been completely cancelled.
    4. The B770 was expected to feature 16 GB of VRAM and up to 32 Intel Xe2 GPU cores, aiming to compete with high-end Nvidia GPUs.
    5. There are rumors of a potential 24 GB Intel Battlemage card targeted at creative professionals, despite the cancellation of the B770.

    Intel’s Arc Battlemage B580 and B570 GPUs made a notable impact when they were released not long ago. Our review of the B580 showcased its impressive performance at a price that is much more appealing than what AMD and Nvidia have offered up till now. This positive reception heightened anticipation for the upcoming Battlemage B770 GPU, especially for gamers seeking high-end PC gaming options without breaking the bank.

    Rumors of Cancellation

    However, recent reports suggest that Intel’s Arc B770 GPU may have been completely cancelled. According to frequent hardware insider, @jaykihn0 on X, when questioned about the Battlemage G31, the leaker stated that it has been “dead” since the third quarter of 2024. This indicates that the development of the high-end Intel GPU was halted in late 2024, at least for consumer purposes. Previous reports hinted that the B770 was already “doomed” even before its planned launch.

    Specifications and Implications

    The Arc B770 was expected to feature 16 GB of VRAM and could have included as many as 32 Intel Xe2 GPU cores. If these leaks are accurate, it would mean that Intel is entirely bypassing the high-end GPU sector in 2025. Nonetheless, there are rumors of a 24 GB Intel Battlemage card that might be aimed at creative professionals.

    Prior leaks suggested that the Intel Arc B770 could have competed with the Nvidia GeForce RTX 4080, positioning it against the newer Nvidia GeForce RTX 5070 Ti in the high-end market.

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  • Kirin X90 Processor Leak: Huawei’s Upcoming PC Chip Details

    Kirin X90 Processor Leak: Huawei’s Upcoming PC Chip Details

    Key Takeaways

    1. Huawei’s HiSilicon division is developing a new processor to compete with Intel in the PC market.
    2. The new processor may use older 5nm or 7nm manufacturing processes but could still challenge Intel’s M3 chip.
    3. The chip is expected to feature a similar instruction set to ARM, akin to Apple’s M series chips.
    4. It will integrate DRAM technology, similar to advancements made by Apple and Intel.
    5. The processor, likely named Kirin X90, is expected to launch by the end of March 2025.

    As Intel continues to face various challenges, it appears that its products will encounter a fresh wave of competition from in-house chipsets developed by Huawei’s HiSilicon division.

    New Processor for PCs

    The new processor is rumored to be aimed at either desktop or laptop computers and is expected to feature a generic instruction set similar to ARM, which serves as the foundation for Apple’s growing M series chips. This could mean some interesting developments in the PC market.

    Production Technology and Competition

    While the upcoming HiSilicon offering may have to utilize older 5-nanometer (nm) or even 7nm manufacturing processes, it has reportedly posed a challenge to the M3 based on prior leaks. This indicates that even with older technology, it could still be competitive.

    Integration and Launch Timeline

    Additionally, it is believed that the new chip will incorporate DRAM, mirroring the advancements seen in modern chips from both Apple and Intel. Interestingly, it has been identified as a “CPU” in a recent leak, which features an official Chinese safety certification for such components, alongside certifications from other manufacturers like Longxin and Shentai Information Technology.

    The insider information also hints that it will be officially launched as the Kirin X90, potentially by the end of March 2025, according to Digital Chat Station on Weibo.

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    Kirin X90 Processor Leak: Huawei's Upcoming PC Chip Details

     

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  • 42-Core Intel CPU Architecture Makes a Comeback for Desktops

    42-Core Intel CPU Architecture Makes a Comeback for Desktops

    Key Takeaways

    1. Intel has a history of canceling CPU designs, including the Royal Core project and Arrow Lake-S refresh.
    2. New information suggests that the Intel Arrow Lake Refresh for both desktops and mobile devices has been revived.
    3. The Arrow Lake-S Refresh will use the same interface as current Core Ultra 200 processors, allowing existing LGA 1851 motherboard users to upgrade without new hardware.
    4. Leaks indicate that the Arrow Lake-S Refresh could feature up to 42 cores, potentially improving multi-core performance by 30-50%.
    5. Readers should be cautious about the validity of the leaked information, as it is over 1.5 years old.

    Intel has a history of canceling CPU designs, as suggested by various leaks. Just last year, many reports indicated that the company had scrapped Jim Keller’s Royal Core project and the upcoming Arrow Lake-S refresh. With the supposed cancellation of the Arrow Lake Refresh, it seemed like Intel wouldn’t have a counter to AMD’s Zen 5X3D and possibly even Zen 6 until the arrival of Nova Lake.

    Intel’s Arrow Lake Refresh Resurfaces

    However, new information suggests that the Intel Arrow Lake Refresh is back in action. According to a post by Golden Pig Upgrade Pack on Weibo, both the Intel Arrow Lake-S Refresh for desktops and the Arrow Lake-HX Refresh for mobile devices have supposedly been revived. The ARL-S Refresh will maintain the same interface as the current Core Ultra 200 desktop processors. This means that users with an LGA 1851 motherboard won’t have to invest in a new one.

    Moreover, the leaker has mentioned that AI PCs “are getting bigger and stronger.” Since this is a machine translation, we may be missing some context, but it appears that both Arrow Lake S and Arrow Lake HX Refresh will feature more powerful NPUs and possibly additional cores.

    Speculations on Performance

    Unfortunately, there is a lack of current information regarding the specifications of the Arrow Lake-S Refresh and Arrow Lake-HX Refresh processors. Nonetheless, some hardware details were revealed in a leak from Moore’s Law Is Dead in 2023. According to MLID, the Arrow Lake-S Refresh could include up to 42 cores, combining 8 Lion Cove P-cores, 32 Symont E-cores, and 2 LP E-cores. As the ARL-R is expected to launch without hyperthreading, this top SKU will be restricted to 42 threads.

    This high core count is likely to lead to a significant improvement in multi-core performance, with MLID estimating a 30-50% boost. However, the increase in single-core performance is projected to be only a modest single-digit percentage.

    Caution on Information Validity

    That being said, it’s uncertain how much of this leak remains valid, as it is over 1.5 years old. Therefore, readers should consider this information with a large grain of salt.

    In conclusion, the revival of Arrow Lake-S Refresh and Arrow Lake-HX Refresh brings good news for Intel enthusiasts who have been waiting for something to cheer about in recent months. AMD has been leading the desktop CPU market without significant competition from Intel. Team Red has just introduced its latest Ryzen 9 9950X3D and Ryzen 9 9900X3D, which are designed for productivity while also delivering top-tier gaming performance.

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    42-Core Intel CPU Architecture Makes a Comeback for Desktops
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  • Intel Partners with TSMC for Long-Term Strategy Amid 18A Yield Issues

    Intel Partners with TSMC for Long-Term Strategy Amid 18A Yield Issues

    Key Takeaways

    1. Intel is delaying the production of its Panther Lake mobile processors due to low yields from its 18A semiconductor manufacturing process.
    2. The company has formed a long-term alliance with TSMC to outsource wafer production, moving away from its goal to eliminate outsourcing.
    3. TSMC’s manufacturing process for 3nm and 2nm technologies is more efficient than Intel’s current in-house capabilities.
    4. The delay in Panther Lake production may push shipments to 2026, missing potential sales opportunities in late 2025.
    5. Intel’s new strategy suggests a recognition of the advantages of partnering with TSMC for future production.

    It has been recently reported that Intel is possibly delaying the production of its next-generation Panther Lake mobile processors due to disappointing yields from its own 18A semiconductor manufacturing process. In the latest Intel earnings call, the company revealed a long-term alliance with TSMC to outsource the wafers needed for making its processors. This call featured a discussion between Intel’s John Pitzer and Morgan Stanley’s Joe Moore, as transcribed by Seeking Alpha.

    Challenges with In-House Production

    Intel has faced difficulties in successfully bringing semiconductor manufacturing in-house, as the 18A process developed by Intel Foundry has not achieved satisfactory yields. Conversely, TSMC boasts a more seasoned and efficient manufacturing process for 3nm and 2nm technologies. During the earnings call, Intel’s Corporate Vice President of Investor Relations mentioned that the company has been outsourcing around 30% of its wafers, largely to TSMC, for some time. However, not long ago, Intel aimed to reduce this number to zero.

    New Direction for Partnership

    Currently, it seems Intel has adopted a new approach that includes a prolonged partnership with TSMC. Pitzer reportedly commented, “We think it’s always good to have at least some of our wafers with TSMC. They’re a great supplier. It creates a good competition between them and Intel Foundry.”

    The announcement of this strategy comes soon after industry analyst Ming Chi Kuo indicated that production of Intel’s Panther Lake mobile processors has been postponed due to the underperformance of the 18A process. This delay means that the company will likely not be able to ship Panther Lake notebooks until 2026, causing them to miss potential sales in the fourth quarter of 2025. This will negatively impact the revenue, profits, and trust in the supply chain for the latter half of 2025.

    Implications for Future Production

    This strategic shift may indicate that Intel has acknowledged the benefits of a longer-term collaboration with TSMC. Still, it remains uncertain how this will influence the Panther Lake processors, which were expected to be the first mobile SoCs developed using the 18A process.

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