Tag: Liquid Cooling

  • Thermalright to Launch Liquid-Cooled AMD Strix Halo Mini PCs

    Thermalright to Launch Liquid-Cooled AMD Strix Halo Mini PCs

    Key Takeaways

    1. Thermalright began as an air cooler company and is expanding into mini PCs, maintaining a focus on cooling solutions.
    2. The upcoming mini PCs will start at around $2,000 and feature high-performance components, including an AMD Ryzen AI MAX+ 395 and 128 GB of unified RAM.
    3. Unique design features include CNC-ed parts, compact custom liquid cooling systems, and a front display showing temperature and system information.
    4. Performance testing shows that the liquid-cooled mini PC reached 89° C under load, indicating effective cooling within thermal limits.
    5. A prototype mini PC with a distinct red and black design is showcased, featuring innovative cooling and upgradeable components, though mass production is uncertain.

    Thermalright started by selling air coolers at reasonable prices and later moved into other areas. Right now, their main focus is still on air coolers, but they also offer AIOs, PC cases, and, as seen at Computex this year, they are trying to break into the mini PC market with compact, powerful systems that feature custom liquid cooling.

    Hands-On Experience

    The team from LinusTechTips (ShortCircuit) and Gamers Nexus had a chance to check out some of the new mini PCs at Thermalright’s booth. Stephen from Gamers Nexus mentioned that Thermalright plans to launch its first mini PCs at prices that are competitive with other brands like Minisforum. LTT pointed out a starting price of around $2,000 for a model with an AMD Ryzen AI MAX+ 395, equipped with 128 GB of unified RAM, allocating 96 GB for the CPU and 32 GB for the Radeon RX 8060S dGPU.

    Unique Features

    Some may think this pricing isn’t very competitive, but Thermalright is including special features. For instance, the chassis has CNC-ed parts, such as the removable bottom plate from one of the models shown in the LTT video. More importantly, these designs come with compact custom liquid coolers. Lastly, there’s a small front display that shows temperature and other useful information.

    Performance Insights

    Are these liquid-cooled options really efficient in such tiny form-factors? The model featured in the LTT video reached 89° C when all CPU cores were pushed to their limits for an extended period, indicating some thermal constraints. However, this isn’t too bad considering TJMax is 95° C, and it remains to be seen if fan noise is lower than with standard air cooling. To improve airflow and potentially lower temperatures, Thermalright offers a longer case that accommodates a larger liquid cooler.

    Compact Options

    There was also a smaller case shown at the booth, likely set to use lower-tier processors. Other specifications seen in the LTT video include a MediaTek Wi-Fi 7 card, dual M.2 slots for SSDs, and a front panel that features a full-size SD card reader, a USB4, and two USB-A 3.2 Gen 2 ports.

    Prototype Design

    In addition, Thermalright displayed a prototype mini PC with a striking red and black frame, reminiscent of Cyberpunk 2077. This model features an innovative liquid cooling system above a Ryzen 7 8845HS, plus easily accessible SSD and SO-DIMM slots for future upgrades. While it may not go into mass production, things could shift if there’s enough interest from fans.

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  • Intel Launches Ultra-Thin Cooling Solution for 1000W Chips

    Intel Launches Ultra-Thin Cooling Solution for 1000W Chips

    Key Takeaways

    1. Intel has introduced an experimental liquid cooling solution capable of handling up to 1,000 watts of heat from next-gen chips.
    2. The innovative cooling system is integrated at the package level, using a compact water block with copper microchannels for efficient heat transfer.
    3. Prototypes for LGA and BGA processors show 15-20% improved thermal performance over standard liquid coolers.
    4. The cooling technology utilizes solder or liquid metal thermal interface material for better contact, allowing for more compact system designs.
    5. While not yet available commercially, this cooling method addresses rising demands from AI workloads and high-performance computing, indicating a potential shift in CPU thermal design.

    As the power and heat generated by chips keep increasing, especially in server processors and AI accelerators, companies are always looking for better ways to manage heat. Intel has taken a unique route to tackle this challenge by revealing an experimental liquid cooling solution at its Foundry Direct Connect event, which can handle up to 1,000 watts of heat from the next-gen chips.

    Innovative Cooling Approach

    The main concept of this package-level water cooling is to enhance heat transfer by placing the cooling system as near to the heat source as possible. Unlike typical cooling systems that are installed on top of processors, Intel’s method integrates the cooling directly at the package level. Instead of using a regular heat spreader, Intel’s solution includes a specially crafted compact water block that has precisely designed copper microchannels guiding the coolant across the CPU package. This idea is somewhat similar to direct-die cooling, which eliminates the heat spreader entirely to reduce thermal resistance.

    Prototype Development

    Intel has created prototypes for both LGA and BGA processors and has showcased this with Intel’s Core Ultra and Xeon server processors. The company asserts that this solution provides 15-20% improved thermal performance compared to standard liquid coolers used on delidded dies. The cooling system is said to employ solder or liquid metal thermal interface material, which ensures better contact. Furthermore, the very slim design of these cooling blocks may allow for more compact system designs, even while managing significantly greater power loads.

    Future Implications

    Although standard consumer CPUs don’t yet reach the 1,000-watt mark, this technology looks ahead to rising demands from AI workloads, high-performance computing, and professional uses. Intel has reportedly worked on this technology for years, with some research tracing back to 2005.

    Intel has not disclosed when or if this cooling method will be available for commercial products, but the demonstration hints at a major potential change in CPU thermal design. As chips continue to grow in power consumption and package density, direct cooling solutions might become vital for high-performance computing.

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    Intel Launches Ultra-Thin Cooling Solution for 1000W ChipsIntel Launches Ultra-Thin Cooling Solution for 1000W ChipsIntel Launches Ultra-Thin Cooling Solution for 1000W ChipsIntel Launches Ultra-Thin Cooling Solution for 1000W Chips

     

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  • Liquid-Cooled Laptop Chassis for Desktop Components on Kickstarter

    Key Takeaways

    1. UHPILCL is developing a liquid-cooled laptop similar to Acer’s Predator 21X, featuring advanced technology and a sleek design.
    2. The laptop can house high-performance desktop components, including a full ITX motherboard and powerful CPUs like the Ryzen 7 9800X3D and Intel Core Ultra 9 285K.
    3. It includes a unique cooling system using distilled water, allowing for easy maintenance and alternative power source compatibility.
    4. The laptop can support a dual-computer setup with a battery-powered laptop for backup, sharing peripherals, but can’t operate both systems simultaneously.
    5. Pricing and funding details for the UHPILCL laptop are not yet disclosed, raising some skepticism about its feasibility despite its innovative design.

    Back in 2016, Acer introduced the Predator 21X, which featured a 21-inch display, a mechanical keyboard, a 7th-generation Intel desktop CPU, and dual GTX 1080 GPUs in SLI. With a hefty price of $9,000 and a weight of 9 kg, it didn’t really take off in the market, but that may have been Acer’s plan all along. Now, a company from Hong Kong called UHPILCL (Ultra High Performance Integration Liquid Cooled Laptop) is trying to create something similar using today’s tech. As the name suggests, this device packs a complete liquid cooling system into a chassis that is about 1.5 inches thick. There are two models available: the T1000, which weighs 4.8 kg, and the T1000 Super at 5.2 kg.

    Powerful Hardware Options

    Inside, you can install a full ITX motherboard with high-performance CPUs from Intel or AMD, like the Ryzen 7 9800X3D and the Core Ultra 9 285K. You can also integrate a full GeForce RTX 5090 dGPU that comes with 32 GB of VRAM, but this requires the T1000 Super version. Since the UHPILCL employs desktop components, it provides all the input/output and expansion capabilities that come with them.

    Portability and Features

    Naturally, the hardware and the cooling system do make it less portable, but the brand claims it is “easy to carry” in a bag designed for 17-inch laptops. The cooling system utilizes distilled water, meaning you can drain and refill it whenever needed. Moreover, if you ever forget the power cable, the manufacturer says you can use one from an electric kettle or microwave without any issues.

    Unique Dual-Computer Setup

    The UHPILCL has another interesting feature. It allows the inclusion of a battery-powered laptop for backup. Both machines can use the same keyboard, USB ports, storage, screen, and other peripherals. However, the exact method for this implementation is still unclear. This is an optional feature that must be added manually, and it’s important to note that both systems can’t operate at the same time due to compatibility reasons.

    At this stage, the company hasn’t disclosed any pricing details or funding targets on its Kickstarter page. It’s reasonable to be doubtful since this concept does seem a bit too good to be true. However, if it succeeds, it will likely be one of the most innovative laptop designs we’ve seen in recent times, especially as manufacturers are trying hard to reduce the thickness of their devices by a couple of millimeters.

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    Liquid-Cooled Laptop Chassis for Desktop Components on Kickstarter
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