Category: Computers

  • China Mobile Achieves Milestone with Hollow-Core Fiber Test

    China Mobile Achieves Milestone with Hollow-Core Fiber Test

    China Mobile has made a notable advancement in optical network technology by successfully launching the first 800G hollow-core fiber transmission test network. This pioneering experiment, conducted in Shenzhen-Dongguan, Guangdong, highlights the capabilities of this cutting-edge technology.

    Collaborating with domestic manufacturers of optical fiber, cable, and equipment, the test aimed to assess the performance of anti-resonant hollow-core fiber under practical conditions. The evaluation included simulating various challenges such as pulling, squeezing, water vapor exposure, and outdoor welding.

    The results were remarkable on a 20-kilometer link. Key technical metrics, such as hollow-to-hollow core fiber welding loss (0.05 dB), hollow-to-solid core connection loss (less than 0.3 dB), and optical cable loss after laying (0.6 dB/km), achieved "world-class levels."

    Hollow-core fiber (HCF) leverages a unique air light-guiding mechanism, allowing light to travel through air instead of conventional glass. This innovative technology has the potential to surpass the limitations of solid-core fiber, providing substantial benefits for backbone and data center transmission.

    Extended Performance Verification

    China Mobile's experiment went beyond basic performance tests. Using a single-wavelength 800Gbps wide-spectrum optical transmission system, they successfully executed a 20km single-core fiber bidirectional 128Tb/s ultra-large capacity transmission test. This accomplishment indicates the feasibility of deploying anti-resonant hollow-core fiber in complex network settings.

    Another crucial aspect of the test was constructing the first hybrid optical cable comprising both anti-resonant hollow-core and solid-core fibers. This cable met essential mechanical property standards for stretching, flattening, bending, impact, and torsion.

    Overcoming Unexpected Challenges

    The experiment encountered an unexpected hurdle when Typhoon Malis hit Shenzhen and Dongguan during the laying phase. Despite these severe weather conditions, China Mobile, along with domestic industry partners, conducted the first-ever test of anti-resonant hollow-core fiber cable technology in a complex pipeline network environment. This led to the completion of a hollow-core optical cable for a typical financial dedicated line route within the Greater Bay Area, potentially reducing optical link transmission delay by 30%.

    Although the test results are encouraging, China Mobile recognizes the need for further improvements. Their future efforts will focus on reducing hollow-core fiber loss and refining fiber structure design to enable mass production. Additionally, they plan to adopt a collaborative R&D model for ultra-800G transmission systems and fiber design, accelerating the advancement of anti-resonant hollow-core fibers and their related optical communication systems.

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  • Minisforum UM880 Pro Mini PC: Ryzen 7 8845HS, 64GB DDR5 RAM

    Minisforum UM880 Pro Mini PC: Ryzen 7 8845HS, 64GB DDR5 RAM

    Minisforum has introduced the UM880 Pro mini PC to the Chinese market, with prices starting at 2498 yuan ($344). This compact device is designed for environments with limited space but high performance needs. Let’s delve into its main specifications.

    Minisforum UM880 Pro Specifications

    The UM880 Pro is powered by the AMD Ryzen 7 8845HS processor, which is built on a 4nm process using Zen 4 architecture. This results in an 8-core, 16-thread setup with a base clock speed of 3.8GHz and a maximum boost clock of 5.1GHz. The mini PC can support up to 64GB of DDR5 5600 dual-channel memory and dual M.2 PCIe 4.0 x4 solid-state drives.

    Minisforum asserts that the UM880 Pro offers significant performance gains over its predecessor. The AMD Ryzen 7 8845HS processor delivers a 20% improvement over the R7 6800H, while the integrated AMD Radeon 780M graphics card, based on RDNA 3 architecture, provides a 20% boost over the Radeon 680M.

    Advanced Cooling and Connectivity

    The UM880 Pro is equipped with Minisforum’s Cold Wave 2.2 cooling system. This advanced architecture ensures stable performance even under heavy use, while maintaining low noise levels. In performance mode, the cooling system can handle up to 70W.

    For connectivity, the UM880 Pro includes a variety of ports. Both the front and back panels feature a 2A1C USB port layout, all supporting PD charging (65-100W). It also offers dual HDMI 2.1 and DP 1.4 ports, allowing for the connection of up to four displays simultaneously.

    Enhanced Graphics and Networking

    Additionally, the UM880 Pro has two USB4 ports and an OCulink interface for connecting an external graphics card expansion dock, further enhancing its graphical capabilities. Networking is supported by dual 2.5G Ethernet ports, providing a flexible and fast network setup.

    The mini PC has dimensions of 130 x 127 x 66.6mm and supports VESA wall mounting for adaptable placement options. It also supports Wi-Fi 6E and Bluetooth 5.2 for wireless connectivity.

    Minisforum UM880 Pro Mini PC: Ryzen 7 8845HS, 64GB DDR5 RAM
    Minisforum UM880 Pro Mini PC: Ryzen 7 8845HS, 64GB DDR5 RAM
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  • Qualcomm Launches Adreno X1 GPU for Next-Gen Arm Laptops

    Qualcomm Launches Adreno X1 GPU for Next-Gen Arm Laptops

    Qualcomm has provided more insight into the Adreno X1 GPU, the graphics processor integrated into their forthcoming Snapdragon X Elite/Plus chips. These processors will power Windows on Arm laptops set to launch next week.

    Future Generations and Branding

    The Adreno X1 marks the first custom-designed GPU for Windows on Arm systems from Qualcomm. The “X1” label identifies the initial generation, with future versions likely adopting similar naming conventions, such as Adreno X2 or X3.

    Technical Specifications

    The top-tier configuration of the Adreno X1, named “X1-85,” features up to 6 shader cores and 1536 FP32 ALUs (Arithmetic Logic Units). This setup allows for the processing of 96 texture units per cycle and delivers a peak performance of up to 4.6 TFLOPS (trillion floating-point operations per second). Additionally, it can handle an impressive 72 million pixels of data per second.

    The Adreno X1 supports popular graphics APIs, including DirectX 12.1 (Shader Model 6.7), DirectX 11, Vulkan 1.3, and OpenCL 3.0. This wide compatibility ensures that developers can utilize the Adreno X1’s features across various applications.

    Performance Comparisons and User Control

    Qualcomm compares the Adreno X1-85 to Intel’s Core Ultra 7 155H mobile processor, which has 8 Xe cores. They assert that the Adreno X1-85 can equal or even exceed Intel’s GPU performance in several games at 1080p resolution. However, detailed information about game settings and testing platforms has not been provided.

    Moreover, Qualcomm is introducing the “Adreno Control Panel,” an application dedicated to managing game optimization and driver updates. This focus on user control and continuous enhancement indicates Qualcomm’s dedication to improving the Adreno X1’s performance over time, with updates promised at least once a month.

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  • Acer Launches Go AI: Slim Laptop with Ryzen Power

    Acer Launches Go AI: Slim Laptop with Ryzen Power

    Acer has recently unveiled its eagerly awaited Go AI thin and light notebook series, featuring robust AMD Ryzen processors and a host of impressive features. The series is available in both 14-inch and 16-inch display variants, each powered by the AMD Ryzen 7 8845H processor. This high-performance processor is complemented by 16GB of LPDDR5 6400 dual-channel memory and a 1TB PCIe Gen 4 SSD, ensuring smooth and responsive operation.

    Display and Keyboard

    The 16-inch model includes a dedicated numeric keypad for enhanced productivity. Both display sizes offer a WUXGA (1920×1200) resolution, 100% sRGB high color gamut, and DC dimming to provide a comfortable viewing experience. The screen-to-body ratio is an impressive 89%, maximizing screen space, while the 180-degree hinge adds to the device's flexibility. The Go AI series also features a three-level backlit keyboard, making typing comfortable in various lighting conditions.

    Security and Build

    Security is addressed with a physical anti-peeping camera, offering users peace of mind. The chassis is built with a durable A/D double-sided metal design, resulting in a sturdy yet lightweight feel.

    Portability and Battery Life

    The 14-inch Go AI weighs 1.4kg, while the 16-inch model weighs 1.7kg, making both models highly portable. They are 17.9mm thick and come equipped with a large-capacity 58Wh battery, offering up to 10 hours of battery life for the 14-inch model and 12 hours for the 16-inch model. Fast charging is facilitated by the included 100W gallium nitride Type-C charger.

    Connectivity and Pricing

    Connectivity options are comprehensive, with two full-function Type-C ports, two USB-A ports, an HDMI 2.0 port, an RJ45 wired network port, a microSD card reader, and support for Wi-Fi 6 wireless networks. With a starting price of 3,999 yuan (approximately $590 USD), the Go AI series is poised to be a strong contender in the thin and light laptop market.

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  • G.SKILL Launches Stylish Trident Z5 Royal DDR5 Memory

    G.SKILL Launches Stylish Trident Z5 Royal DDR5 Memory

    G.SKILL has unveiled its top-tier DDR5 memory series, the Trident Z5 Royal, which combines high performance with a distinct aesthetic appeal. The Trident Z5 Royal integrates the sleek design of the Trident Z5 series with a "Royal Diamond" light guide strip. Available in both gold and silver variants, this series allows users to add a touch of sophistication to their setups.

    Unique Heat Sink Design

    The RAM features a robust aluminum alloy heat sink that has undergone an electroplating process. This not only enhances the module's functionality but also gives it a unique and attractive appearance, making it both effective and visually appealing.

    Performance Capabilities

    Equipped with support for Intel's XMP 3.0 memory overclocking technology, the Trident Z5 Royal memory excels in performance. Users can easily enable XMP in the BIOS when using a motherboard and CPU certified on the Qualified Vendor List (QVL), unlocking the memory's rated overclocking speed and pushing performance limits.

    At present, G.SKILL has released a single memory kit on JD.com. This kit includes a 64GB capacity (2 x 32GB modules) and starts with a specification of 6400MT/s with 32-39-39-102 timings. The initial price for this kit is 2149 yuan.

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  • IQUNIX MG65 Low-Profile Mechanical Keyboard Released at $96

    IQUNIX MG65 Low-Profile Mechanical Keyboard Released at $96

    IQUNIX’s latest MG65 series keyboards are currently on pre-sale in China, available in two models: Regular and Pro. The Regular model is priced at 699 CNY, which is roughly $96, while the Pro model costs 899 CNY, about $124. Both models are offered in two colors: Mist White and Night Black.

    Design and Build

    The IQUNIX MG65 series showcases a sleek, ultra-thin design complemented by a durable aluminum alloy shell. The keycaps are coated to resist dust and grime, contributing to the keyboard’s longevity. Remarkably, the MG65 maintains a minimal thickness of just 11mm.

    IQUNIX MG65 Low-Profile Mechanical Keyboard Released at
    IQUNIX MG65 Low-Profile Mechanical Keyboard Released at
    IQUNIX MG65 Low-Profile Mechanical Keyboard Released at
    IQUNIX MG65 Low-Profile Mechanical Keyboard Released at

    Weight and Specifications

    The Regular MG65 weighs 900 grams, while the MG65 Pro comes in at 1030 grams, making these keyboards relatively heavy for their low-profile design. The MG65 series is equipped with PBT keycaps and features a total of 68 keys. Both models include a built-in battery with a capacity of 3000 mAh and 3.7V.

    Connectivity and Charging

    The keyboards can be charged via a USB Type-C port. They also support multiple modes of connectivity: Bluetooth mode, 2.4 GHz wireless usage, and wired mode. The Bluetooth interface is version 5.1, ensuring stable and efficient wireless performance.

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  • Honor MagicBook Pro 16 with Intel Core Ultra 5, 165Hz Display

    Honor MagicBook Pro 16 with Intel Core Ultra 5, 165Hz Display

    Alongside the global introduction of the Honor 200 Series smartphones, the brand also unveiled a new laptop. This new addition is the Honor MagicBook Pro 16, which first appeared at MWC in February and was subsequently launched in China the following month. This laptop combines a sleek design with robust specifications. Continue reading to discover its features.

    Honor MagicBook Pro 16 specifications and features

    The Honor MagicBook Pro 16 showcases a full-metal design enhanced with advanced 3D colouring spray technology. It is lightweight at 1.79 kg and has a thickness of 19.9mm.

    Regarding the display, the MagicBook Pro 16 boasts a 16-inch screen with a resolution of 3,072 x 1,920 pixels and a 165Hz refresh rate. The display features slim bezels of just 2.36mm, resulting in a 93 percent screen-to-body ratio. It also supports 100 percent DCI-P3 colour gamut, HDR 400, 500 nits peak brightness, and dynamic dimming technology. For audio, the device includes six speakers—four subwoofers and two tweeters—and is noted as the first Windows laptop with Spatial audio.

    Performance and Battery

    Powered by the Intel Core Ultra 5 processor, the Honor MagicBook Pro 16 includes an integrated Intel Arc GPU. The laptop features an efficient heat dissipation system and offers two operational modes: a 65W high-powered mode that maximizes the processor’s capabilities, and a 50W smart mode for a balanced performance. It is equipped with a 75Whr battery, which is claimed to provide up to 12 hours of usage on a full charge.

    Software and Availability

    The Honor MagicBook Pro 16 operates on Windows OS with MagicRing, facilitating easy transfer and synchronization of tasks and notifications across devices. The laptop also incorporates several AI-powered features.

    Pricing for the Honor MagicBook Pro 16 starts at EUR 1,299.99 in France. It is available in White and Purple and will be launched in select markets with prices varying by region.

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  • ASUS ExpertBook P5 AI Notebook Debuts at Computex 2024

    ASUS ExpertBook P5 AI Notebook Debuts at Computex 2024

    Taiwanese tech powerhouse ASUS has unveiled the ExpertBook P5 notebook PC. This AI-driven device is being marketed as the next-generation AI computer designed to boost business efficiency and security, while also setting new standards in productivity. The ExpertBook P5 is part of an array of innovative models presented at Computex 2024.

    Designed for Professionals

    The ASUS ExpertBook P5 belongs to the Expert P series, tailored for professionals. It combines advanced AI capabilities with a sturdy and meticulously engineered design. As a flagship model, it underscores the brand's commitment to integrating state-of-the-art technology with sustainability, emphasizing new standards for future AI workstations.

    Cutting-Edge Technology and Sustainability

    ASUS claims the ExpertBook P5 is aimed at small office workers, ambitious prosumers, and entrepreneurial individuals. It features the latest advanced technologies and pays homage to ASUS's humble beginnings.

    Founded around 35 years ago as a modest startup, ASUS understands the importance of providing professionals with top-tier technology to foster their growth and success. The ExpertBook P5 is powered by Intel Core Ultra Processors (codenamed Lunar Lake), delivering a scalable and seamless experience tailored to professional needs.

    AI-Driven Features and Robust Security

    The ExpertBook P5 includes intelligent AI-driven features that streamline workflow, simplifying complex tasks significantly. These AI applications encompass AI meetings, AI assistants, and AI creativity tools. Superior audio and video quality is ensured through AI-voiceprint technology, which eliminates background noise and isolates the user's voice for enhanced clarity.

    The notebook supports real-time co-editing and generative meeting notes for smooth teamwork. Its meeting transcript feature supports multiple languages, ensuring clear communication during meetings. The AI computer is fortified with the Windows 11 Secured-core PC framework, BIOS compliant with NIST-155 standards, and optional TPM 2.0. It boasts military-grade durability, an advanced cooling system, reinforced hinges, and is rated as drop-resistant.

    Launch and Availability

    The ASUS ExpertBook P5 is set to launch later this year (Q3) and will be accompanied by a three-year warranty. Detailed availability and pricing information will be announced later.

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  • Feimao Unveils U20 5G Portable Wi-Fi Hotspot and Mobile Hard Drive

    Feimao Unveils U20 5G Portable Wi-Fi Hotspot and Mobile Hard Drive

    Feimao is rolling out the U20, a fresh 5G portable Wi-Fi hotspot in China, with a starting price of 399 yuan. This device comes packed with features aimed at offering basic convenience.

    Network Support and 5G Connectivity

    The U20 is equipped with 5G connectivity, thanks to a homegrown 8-core chip. It supports networks from China Mobile, China Unicom, and China Telecom through a separately sold Feimao 5G clone card. The Feimao Butler App provides easy network switching for optimal coverage. Feimao claims to be the first to offer a “true 5G three network” solution in the industry.

    Connectivity and Storage

    The U20 allows you to share your internet connection effortlessly, supporting up to 10 devices at once, making it ideal for group trips or shared workspaces. Additionally, the U20 features 20GB of built-in storage, turning it into a mobile hard drive. For more storage, the microSD card slot allows expansion up to 2TB, ensuring plenty of space for file storage and transfer.

    Network Compatibility and Speed

    The U20 provides full access to 5G networks and supports all major frequency bands in China. It offers peak download speeds of 1.6Gbps and upload speeds of 225Mbps. It operates in both SA (standalone) and NSA (non-standalone) network environments, along with Sub-6GHz frequencies, which ensures broader compatibility and improved stability.

    Design and Power Supply

    Feimao has designed the U20 with user convenience in mind. It features a USB 3.0-C port for high-speed wired connections and multiple power supply options, ensuring you always have Wi-Fi access. The motto they follow is: “Wi-Fi wherever there is electricity.” The U20 supports USB 3.0/2.0 compatibility, requiring a 5V=2.0A power supply.

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  • TSMC to Receive $380M ASML High-NA EUV Lithography Machines

    TSMC to Receive $380M ASML High-NA EUV Lithography Machines

    ASML (Advanced Semiconductor Materials Lithography) is a Dutch company that specializes in the design and manufacturing of lithography machines for the semiconductor sector. These machines play a crucial role in the chip-making process.

    Access to ASML’s state-of-the-art lithography technology has significantly contributed to TSMC’s (Taiwan Semiconductor Manufacturing Company) success as a leading contract chip manufacturer, serving major industry players like NVIDIA and Qualcomm.

    High-NA Lithography Technology

    ASML’s latest announcement reveals that it will ship its most advanced lithography machine, valued at US$ 380 million (~2.753 billion yuan), to TSMC within this year. ASML’s Chief Financial Officer, Roger Dassen, disclosed during a recent conference call that both TSMC and Intel, their two biggest clients, will receive the high numerical aperture (high-NA) extreme ultraviolet (EUV) lithography technology by 2024.

    ASML has already delivered the world’s first commercial high-NA EUV lithography machine to Intel, with the initial unit being sent to an Oregon factory in late December. The exact timing for TSMC to receive this advanced tool remains unspecified.

    The high-NA lithography technology is anticipated to shrink transistor sizes by 66%. This reduction enables chip manufacturers to pack more transistors into the same silicon area, enhancing power efficiency and sustained performance.

    Technical Advancements

    The high-NA EUV system achieves a numerical aperture of 0.55, improving accuracy and allowing for more intricate silicon patterning compared to previous EUV systems with a 0.33 numerical aperture lens. The new machine is also 30% larger than its predecessors, which already required three Boeing 747s for transportation.

    Regarding TSMC, the development of their 2nm nodes is reportedly on track. The company plans to start developing the N3X and N2 processes in Q2 2025, with mass production of N2P and A16 slated for Q2 2026. The 2nm process will incorporate Gate-all-around FETs (GAAFET).

    TSMC predicts that its 2nm process will offer a 10% to 15% performance boost and reduce power consumption by 25% to 30%.

    TSMC to Receive 0M ASML High-NA EUV Lithography Machines
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