Category: Computers

  • Intel Panther Lake Notebooks Delayed Until 2026

    Intel Panther Lake Notebooks Delayed Until 2026

    Key Takeaways

    1. Intel’s Panther Lake mobile system-on-chips (SoCs) release has been delayed until 2026 due to performance issues with the 18A semiconductor manufacturing process.
    2. Analyst Ming-Chi Kuo reports that mass production for Panther Lake has shifted from early September 2025 to late 2025.
    3. The delay could negatively impact Intel’s revenue, profits, and trust within the supply chain in the second half of 2025.
    4. The 18A manufacturing method uses RibbonFET transistors and PowerVia technology, but performance yields have been disappointing.
    5. Intel aims to compete with TSMC’s 2N process, but current results have not met expectations.

    A recent report from a well-known analyst indicates that the release of Intel’s Panther Lake mobile system-on-chips (SoCs) has been delayed until 2026. The delay is attributed to the underwhelming performance of Intel’s 18A semiconductor manufacturing process, which incorporates RibbonFET transistors and PowerVia technology. Panther Lake is expected to be the next advancement in Team Blue’s line of notebook and mobile processors, promising major performance enhancements over the existing Meteor Lake processors.

    Analyst Insights on Production Delays

    Market analyst Ming-Chi Kuo, who is recognized for his insights into Apple’s manufacturing supply chain, has provided new information from his latest review of Electronics Manufacturing Service (EMS), Original Design Manufacturing (ODM), and several brands. According to him, the mass production schedule for Intel’s Panther Lake (PTL) series has shifted from early September 2025 to the middle of the fourth quarter of 2025. Consequently, devices and notebooks powered by these Panther Lake chips might not reach consumers until 2026.

    Impact on Intel’s Revenue and Trust

    Initially, Intel had planned for production to begin in the second half of 2025, meaning this delay still falls within that timeframe. However, the inability to launch new products utilizing this new hardware could negatively affect Intel’s revenue, profits, and overall trust within the supply chain for the second half of 2025, as noted by the analyst.

    Intel is facing delays in the production of PTL chips largely due to disappointing performance yields from its 18A manufacturing method. This method employs RibbonFET technology, a Gate-all-around (GAA) transistor that aims to enhance both density and performance. It also incorporates PowerVia, which is a backside-power delivery structure designed to boost cell utilization by 5 to 10% and improve ISO-power performance by as much as 4%, as stated by Intel. With this approach, Intel hopes to rival TSMC’s 2N process, but so far, the results have not met expectations, at least for the time being.

    Source:
    Link

    Tags: , ,
  • Encouraging Local Use of Open-Source RISC-V Chips in China

    Encouraging Local Use of Open-Source RISC-V Chips in China

    Key Takeaways

    1. The XiangShan project, initiated by China’s Academy of Sciences, aims to launch an open-source chip by the end of 2023.
    2. Chinese officials are developing policy guidance to promote the use of RISC-V chips, with documentation being worked on by eight government agencies.
    3. Major Chinese companies are increasingly adopting RISC-V architecture due to its cost-effectiveness and geopolitical neutrality.
    4. The chip market is dominated by American companies like Intel and AMD, which use proprietary technologies.
    5. The largest providers of RISC-V intellectual property in China include Alibaba-owned XuanTie and Nuclei System Technology, with growing demand expected for these chips.

    Back in 2019, the XiangShan project was started by China’s Academy of Sciences, aiming to introduce an open-source chip of the same name by the end of this year. A recent update has shown consistent progress, and insiders who know about local laws have reported that Chinese officials are developing policy guidance to promote the usage of RISC-V chips. Although many specifics are still vague, it appears that the draft could be wrapped up this month.

    Policy Development Details

    As reported by Reuters, two unnamed sources discussed the topic, revealing that eight government agencies are currently working on the documentation. These agencies include the Cyberspace Administration, the Ministry of Industry and Information Technology, the Ministry of Science and Technology, along with the National Intellectual Property Administration. Unfortunately, these four departments have not provided any comments about the ongoing policy discussions, but we will continue monitoring this situation closely.

    Industry Context

    The chip market is mainly controlled by American firms like Intel and AMD, both using proprietary technologies. In contrast, the open-source RISC-V chips have a geopolitically neutral stance. Furthermore, Chinese businesses have been increasingly focusing on this architecture due to its cost-effectiveness. The largest for-profit providers of RISC-V intellectual property in China are Alibaba-owned XuanTie and a startup named Nuclei System Technology. Because RISC-V chips generally require less computing power compared to alternative solutions, applications based on DeepSeek could drive higher demand for these chips both in China and internationally.

    Source:
    Link

    Tags: , ,
  • Minisforum BD790i: Mobile AMD X3D Chips for Desktop Use

    Minisforum BD790i: Mobile AMD X3D Chips for Desktop Use

    Key Takeaways

    1. Mobile AMD X3D APU: The BD790i X3D features the Ryzen 9 7945HX3D, a powerful mobile processor optimized for desktop use.

    2. Unique Cooling Solution: Unlike typical mini PC motherboards, it has a robust heatsink and supports a 12 cm active fan for improved cooling.

    3. Enhanced Thermal Management: The motherboard effectively manages heat with dedicated cooling for VRM, memory slots, and M.2 SSDs, making it suitable for NAS setups.

    4. Robust Expansion Options: It includes a full-sized PCIe 5.0 x16 slot for a discrete GPU, along with various connectivity options like HDMI 2.1, DisplayPort 1.4, and USB 3.2.

    5. Pre-order and Pricing: The BD790i X3D is available for pre-order at $599, with a $50 discount, and is expected to ship by mid-March.

    The Minisforum MoDT lineup has welcomed a fresh member: the BD790i X3D. As the name suggests, this model brings the mobile AMD X3D APU into the desktop realm, starting with the Ryzen 9 7945HX3D. If you’re not already acquainted with this platform, it’s essentially a desktop board that utilizes mobile processors.

    Unique Cooling Solution

    In contrast to standard mobile motherboards commonly found in mini PCs or laptops, the MoDT range from Minisforum does not come with a built-in heat spreader. Instead, they have combined the mobile chip with a more robust heatsink. The cooling arrangement on the new BD790i X3D even supports a 12 cm active fan, although it remains unclear if third-party coolers can also work with the motherboard.

    Enhanced Thermal Management

    The cooler that comes installed is also responsible for managing the heat produced by the VRM and memory slots. Moreover, there’s a dedicated fan and heatsink for the two M.2 slots, which makes this motherboard a great choice for a NAS setup that can truly benefit from PCIe 5.0 SSDs.

    The Ryzen 9 7945HX3D, which is soldered onto the board, ranks among the quickest mobile gaming processors currently on the market, thanks to its 3D V-Cache technology. It also includes the Radeon 610M, but since this RDNA 2 integrated GPU only has 2 compute units, it is best suited for basic rendering tasks.

    Robust Expansion Options

    On the plus side, the Minsiforum BD790i X3D features a full-sized PCIe 5.0 x16 slot that allows users to add a discrete GPU for enhanced gaming performance (PowerColor Fighter AMD Radeon RX 7600 currently priced at $249.99 on Amazon). The motherboard also boasts a solid variety of connectivity options, including one HDMI 2.1, one DisplayPort 1.4, one USB 3.2 Gen 2 Type-C, one 2.5G Ethernet, and two USB 3.2 Gen1 Type-A ports. For wireless features, it includes built-in Bluetooth 5.3 and WiFi 6E.

    Minisforum has started accepting pre-orders for the new BD790i X3D motherboard, with introductory pricing set at $599, which offers a $50 discount off the standard price. The pre-ordered products are anticipated to begin shipping in the middle of March.

    Source:
    Link

    Minisforum BD790i: Mobile AMD X3D Chips for Desktop Use
    Tags: , ,
  • Raspberry Pi Compute Module 4: New Durable Upgrades Available

    Raspberry Pi Compute Module 4: New Durable Upgrades Available

    Key Takeaways

    1. The Raspberry Pi Compute Module 4 is popular in both consumer and industrial sectors, with various real-world applications showcased on the Raspberry Pi website.
    2. The newly released extended temperature range version operates from -40°C to +85°C, addressing challenges in outdoor and demanding industrial environments.
    3. Upgraded components, including SDRAM and eMMC from Samsung, enhance the performance of the extended temperature range Compute Module 4.
    4. Pricing for the extended temperature range module starts at $50, higher than the $30 standard module, with options reaching up to $80 for maximum specifications.
    5. The new Compute Module 4 is designed for specialized applications, offering innovative solutions for makers and developers.

    Since it was introduced, the Raspberry Pi Compute Module 4 has emerged as a powerhouse in the single-board computer (SBC) market, utilized in both consumer and industrial sectors. The Raspberry Pi website is filled with user stories showcasing how this SBC has integrated into various applications, such as being part of an industrial computer with Revolution Pi, an energy management system through EpiSensor, or even functioning as a point-of-sale solution with KwickPOS. Nevertheless, certain projects may struggle to conform to the current operating temperature range of -20°C (-4°F) to +85°C (185°F), particularly when deployed outdoors or in demanding industrial environments. Thankfully, the newly released extended temperature range Compute Module 4 addresses this concern.

    New Temperature Range

    The extended temperature range Compute Module 4 offers a broader operational range of -40°C (-40°F) to +85°C (185°F), designed specifically to satisfy the needs of the expanding industrial applications for the SBC. Alongside ruggedized onboard components, this new Compute Module 4 incorporates upgraded SDRAM and eMMC components from Samsung that fulfill the enhanced temperature requirements of the SBC. However, it’s important to note that this new offering comes with a higher price and minimum order stipulations.

    Pricing Details

    At present, the base model of the extended temperature range Compute Module 4 is priced at $50 compared to the $30 for the standard temperature range module. Both versions include 1 GB of RAM but lack wireless networking or eMMC storage. If you want to max out the specifications of the new Compute Module 4, it will cost you $80, as opposed to $65 for the standard version, providing 4 GB of RAM, wireless connectivity, and 16 GB of eMMC storage. Notably, the standard temperature range modules have a few higher-spec options that are not yet available for the new model.

    Unique Applications

    Although the new Compute Module 4 is somewhat specialized, it is bound to find its niche in various innovative applications. Interested makers can discover additional information regarding the new Compute Module 4 and options for purchasing in the resources provided below.

    Source:
    Link

    Tags: , ,
  • Beelink Launches ME Mini PC Series for NAS Market

    Beelink Launches ME Mini PC Series for NAS Market

    Key Takeaways

    1. Beelink is entering the NAS market with the new ME series, starting with the ME mini NAS system.
    2. The ME mini features a compact design, measuring 99×99.2×98.3 mm, and includes an integrated power supply for easy setup.
    3. It offers six M.2 slots for SSDs, allowing a maximum storage capacity of 24 TB.
    4. The NAS will use an x86 CPU and includes two 2.5 GbE LAN ports along with an efficient cooling system.
    5. No pricing or release date has been announced, and additional Pro and Max models are mentioned without further details.

    Beelink has revealed a new product series called the ME series. This signifies the company’s foray into the NAS market, and the ME mini is set to be one of the initial NAS systems launched within this new mini PC range. Not much information has been provided regarding this first product in the series.

    Compact Design

    In their official announcement, Beelink highlighted that the ME mini will have a compact size, measuring 99×99.2×98.3 mm. Despite its small dimensions, this NAS system will come equipped with an integrated power supply, allowing users to power the device using just a single cable.

    Storage Capacity

    Naturally, the petite size means the ME mini won’t accommodate a 3.5-inch drive, which is common in many NAS systems. Nevertheless, it features six M.2 slots, each capable of housing a 4 TB SSD (currently, a 2 TB Samsung 990 EVO Plus costs $129.99 on Amazon). This configuration allows the system to offer a maximum storage capacity of 24 TB.

    The exact processor that will be used in the NAS hasn’t been disclosed, but Beelink confirmed it will be an x86 CPU. Furthermore, the announcement included information about two 2.5 GbE LAN ports and an efficient cooling system designed to maintain optimal temperatures for the internal storage drives.

    Pricing and Availability

    There is currently no information regarding the pricing, and Beelink has not revealed when the ME mini will be released. The announcement also refers to a Pro and Max model, but it does not provide further details about these variants.

    Source:
    Link

    Beelink Launches ME Mini PC Series for NAS Market

     

    Tags: , ,
  • Zen 6 Medusa Halo iGPU: 20% More CUs, 50% Wider Bus

    Zen 6 Medusa Halo iGPU: 20% More CUs, 50% Wider Bus

    Key Takeaways

    1. The Ryzen AI Max+ 395 in the Strix Halo APU features 16 Zen 5 cores and the powerful Radeon 8060S iGPU, making it the fastest x86 iGPU available today.
    2. AMD plans to release the Zen 6-based Medusa Halo APU next year, which is expected to offer significant CPU and GPU performance improvements.
    3. Medusa Halo may include up to 24 Zen 6 cores and a 50% increase in CPU performance compared to Strix Halo.
    4. The iGPU in Medusa Halo is expected to have 48 Compute Units (CUs) and a 384-bit wide bus, potentially improving performance by 30% to 50%.
    5. While exciting, the information about Zen 6 products is still speculative and should be treated with caution until more details are confirmed.

    After a lot of waiting, the first reviews of AMD’s Strix Halo came out last month. The Ryzen AI Max+ 395, which is the quickest Strix Halo APU, really impressed us with its excellent CPU abilities, featuring 16 Zen 5 cores, and the super-fast iGPU performance powered by a 40 CU Radeon 8060S. In fact, the Radeon 8060S is the fastest x86 iGPU available today and can compete with an RTX 4070 laptop GPU that has a TDP of 65-75 W.

    Performance Highlights

    So, Strix Halo is a clear victory when it comes to pure performance. Nonetheless, AMD looks to be preparing to surpass Strix Halo next year with their Zen 6-based Medusa Halo, an APU that promises to deliver extraordinary boosts in both CPU and GPU performance.

    According to Moore’s Law Is Dead, AMD is set to release the Medusa Halo APU next year featuring up to 24 Zen 6 cores thanks to two 12-core CCDs. We previously mentioned that AMD plans to use this 12-core CCD in both desktop and mobile processors. This means that the desktop Zen 6 Medusa Ridge, mobile Medusa Point, and workstation Medusa Halo will utilize either a single or multiple 12-core CCDs.

    Upcoming Enhancements

    With a 24-core Zen 6 CPU, MLID anticipates that Medusa Halo will achieve up to 50% better CPU performance compared to Strix Halo.

    What’s even more exciting is the news about Medusa Halo’s UDNA iGPU. MLID has reported that AMD will be increasing the Compute Units (CUs) from 40 to 48, which is a 20% increase. Some Medusa Halo SKUs might also feature a 384-bit wide bus, making it 50% wider than the 256-bit bus on Strix Halo. This increase in CU count and additional bandwidth should lead to a significant improvement in iGPU performance; MLID predicts the uplift could be between 30% to 50%.

    Performance Comparisons

    To give some context to this iGPU performance, a 30% increase on top of the Radeon 8060S would mean the Medusa Halo’s iGPU could match the desktop RTX 4060 Ti. If it reaches a 50% increase, Medusa Halo would easily surpass the desktop RTX 3070 Ti, based on our 3DMark Time Spy Graphics results.

    That being said, it’s still too early to make any definite claims about the specs and performance of the Zen 6 products. So, while the information from MLID is thrilling, it’s wise to take this leak with a grain of salt.

    Source:
    Link

    Zen 6 Medusa Halo iGPU: 20% More CUs, 50% Wider Bus
    Tags: , ,
  • Lenovo Yoga 7 Laptops: 2.8K OLED Display & Ryzen AI Processors

    Lenovo Yoga 7 Laptops: 2.8K OLED Display & Ryzen AI Processors

    Key Takeaways

    1. Powerful Processors: The Yoga 7 laptops feature AMD Ryzen AI 300 series processors with a 50 TOPS NPU for enhanced AI performance.

    2. High-Quality Display: Both models come with a 2.8K PureSight OLED touch display, offering peak brightness of 1,100 nits and a 120Hz refresh rate for stunning visuals.

    3. Versatile Design: The laptops have a 360-degree hinge, allowing users to switch between laptop, tablet, and tent modes easily.

    4. Robust Specs: The 16-inch model supports up to 32GB LPDDR5X RAM and 1TB PCIe Gen 4 storage, suitable for demanding tasks like graphic design and video editing.

    5. Connectivity and Battery Life: Equipped with Wi-Fi 7, Bluetooth 5.4, and a 70Whr battery, these laptops promise all-day productivity and versatile connectivity options.

    Lenovo has unveiled its new Yoga 7 2-in-1 laptops during MWC 2025, featuring strong AMD Ryzen AI processors, bright 2.8K OLED screens, and the well-known 360-degree hinge. Available in 14-inch and 16-inch sizes, these laptops are aimed at creative professionals and tech enthusiasts looking for top-notch performance.

    Impressive Specs and Display

    The 16-inch Yoga 7 2-in-1 laptop utilizes the AMD Ryzen AI 300 series processors, which include a powerful 50 TOPS NPU (Neural Processing Unit) for enhanced AI functionality. Lenovo’s AI Core also boosts performance and power management, allowing for smooth multitasking while keeping energy efficiency in check. With a maximum of 32GB LPDDR5X RAM and 1TB PCIe Gen 4 storage, this device can easily manage demanding tasks like graphic design and video editing.

    Stunning Visuals and Versatility

    One of the standout features of the Yoga 7 series is the 2.8K PureSight OLED touch display, present in both models. This display can reach a peak brightness of 1,100 nits, has a 120Hz refresh rate, and supports 100% of sRGB, P3, and Adobe RGB color ranges, providing bright and precise visuals. Whether you’re drawing with the optional Yoga Pen or watching high-definition videos, these laptops promise an excellent visual experience.

    The 16-inch model has a weight of 1.79 kg (3.94 lbs) and a thickness of 15.85mm, which is not particularly remarkable. Both models come equipped with the signature 360-degree hinge, enabling users to easily switch between laptop, tablet, and tent modes.

    Connectivity and Battery Life

    Connectivity options include Wi-Fi 7, Bluetooth 5.4, USB-C, HDMI 2.1, and a microSD card slot, while a 70Whr battery guarantees all-day productivity.

    The prices for these laptops have not been announced yet. Lenovo has mentioned that they will be competitively priced. We will provide additional details as soon as we have them.

    Source:
    Link

    Tags: , ,
  • Galaxy Book 5 Series Pre-Reservations Now Open in India

    Galaxy Book 5 Series Pre-Reservations Now Open in India

    Key Takeaways

    1. Samsung launched the Galaxy Book 5 series, including Galaxy Book 5 360, Galaxy Book 5 Pro, and Galaxy Book 5 Pro 360, at CES 2025, with pre-reservations now open in India.

    2. Pre-reservation offers include early access benefits valued at Rs 5,000 and are available until March 10 through various platforms.

    3. The Galaxy Book 5 Pro features a WQXGA+ AMOLED touch display, Intel Core Ultra 7 processor, and options for 16GB or 32GB RAM, with SSD storage options up to 1TB.

    4. The Galaxy Book 5 360 is a 2-in-1 hybrid device with a 15.6-inch FHD AMOLED screen, Intel processors, and multiple connectivity options, including Thunderbolt 4.

    5. The Galaxy Book 5 Pro 360 is designed for creative professionals, featuring a 16-inch WQXGA+ AMOLED touchscreen, support for S Pen, and high-end specs for multitasking.

    At the CES 2025 event held in January, Samsung introduced the Galaxy AI and Co-Pilot integrated Galaxy Book 5 line of laptops. These high-end notebooks are set to launch in India later this month. Currently, the company has begun accepting pre-reservations for both models.

    Pre-reservations for Galaxy Book 5 series in India

    Starting today, customers can pre-reserve the Galaxy Book 5 360, Galaxy Book 5 Pro, and Galaxy Book 5 Pro 360 at no charge through Samsung.com, Samsung India Smart Cafés, select authorized retail stores, and various online platforms. Those who make a pre-reservation will receive early access benefits valued at Rs 5,000. These offers are valid until March 10.

    Specs of Galaxy Book 5 Pro (14-inch and 16-inch)

    The Galaxy Book 5 Pro comes in both 14-inch and 16-inch sizes, each with a WQXGA+ (2880×1800) AMOLED touch display, boasting 120% DCI-P3 color volume and 48-120Hz VRR for fluid visuals. The 14-inch version measures 12.30″ x 8.81″ x 0.46″ and weighs 2.71 lbs, while the 16-inch model is 13.99″ x 9.86″ x 0.49″ and weighs 3.44 lbs. Both run on Windows 11 Home and are equipped with the Intel Core Ultra 7 processor (Intel EVO), featuring Intel AI Boost NPU and Intel Arc graphics.

    The Galaxy Book 5 Pro offers memory choices of 16GB or 32GB RAM, along with storage options of 256GB, 512GB, or 1TB SSD. It supports Wi-Fi 7 and Bluetooth 5.4, and includes a 2MP FHD camera with Staggered HDR. The audio experience is enhanced by quad speakers (Dolby Atmos) and high-quality dual microphones. It also features a backlit Pro Keyboard and is powered by either a 76.1Wh battery (16-inch) or a 63.1Wh battery (14-inch) with 65W USB-C charging. Connectivity options include two Thunderbolt 4 ports, one USB-A, a microSD slot, HDMI 2.1, and a headphone jack. It’s uncertain if both models will be launched in India.

    Specifications for Galaxy Book 5 360 and Galaxy Book 5 Pro 360

    The Galaxy Book 5 360 is a versatile 2-in-1 laptop-tablet hybrid with a 15.6-inch FHD AMOLED touch display (1920×1080), offering 120% DCI-P3 color volume and a refresh rate of 60Hz. It is sized at 13.99″ x 8.98″ x 0.54″ and weighs 3.22 lbs. Operating on Windows 11 Home, it features either an Intel Core Ultra 7 or Ultra 5 processor, Intel Arc graphics, and Intel AI Boost NPU.

    Memory configurations provide 16GB RAM with storage options of either 256GB or 512GB SSD. It supports Wi-Fi 7 and Bluetooth 5.4 and comes with a 2-megapixel FHD camera, dual microphones, and stereo speakers (Dolby Atmos). The device includes a Pro Keyboard with a numeric keypad and backlighting, a 68.1Wh battery with 65W USB-C charging, and various connectivity options, including two Thunderbolt 4 ports, one USB-A, a microSD slot, HDMI 2.1, and a headphone jack.

    The Samsung Galaxy Book 5 Pro 360 is another high-end 2-in-1 device, featuring a 16-inch WQXGA+ AMOLED touchscreen (2880 x 1800) with an anti-reflective coating and support for the S Pen, making it perfect for creative professionals and multitaskers. It is powered by the Intel Core Ultra 7 256V processor and Intel Arc 140V GPU (8GB), with Windows 11 Home, 16GB LPDDR5X RAM, and a 1TB SSD for seamless multitasking and adequate storage. Connectivity includes Wi-Fi 7, Bluetooth v5.4, Thunderbolt 4 ports, HDMI 2.1, and a microSD card reader. Additionally, it features quad speakers with Dolby Atmos, a 2-megapixel webcam, and a backlit Pro keyboard with a numeric keypad. The 76Wh battery supports 65W USB Type-C fast charging, and the device has a weight of 3.73 lbs.

    Galaxy Book 5 Series Pre-Reservations Now Open in IndiaGalaxy Book 5 Series Pre-Reservations Now Open in IndiaGalaxy Book 5 Series Pre-Reservations Now Open in India
    Tags: , ,
  • Asus ExpertCenter PN54: Stylish Mini PC with Ryzen AI 7 and 64GB RAM

    Asus ExpertCenter PN54: Stylish Mini PC with Ryzen AI 7 and 64GB RAM

    Key Takeaways

    1. The Asus ExpertCenter PN54 mini PC features powerful internals with Ryzen AI 5 340 or Ryzen AI 7 350 APUs, providing strong performance for moderate to demanding tasks.
    2. Users can expand the mini PC’s memory with up to 64 GB of DDR5 RAM and have up to 2 TB of SSD storage through dual SODIMM and dual M.2 slots.
    3. The mini PC lacks dedicated graphics capabilities but includes integrated AMD Radeon GPUs, suitable for basic tasks but not for modern AAA gaming.
    4. It offers a wide variety of ports, including multiple USB 3.2, DisplayPort, HDMI, Ethernet, and supports Bluetooth 5.4 and WiFi 7 for connectivity.
    5. The design of the ExpertCenter PN54 is compact, measuring just 13 x 13 x 3.4 cm, making it a sleek addition to any workspace.

    A new mini PC from Asus has arrived, named the ExpertCenter PN54. This system comes with impressive internal components and a great variety of ports, all wrapped up in a sleek design measuring just 13 x 13 x 3.4 cm. As of now, there are no details regarding its price or availability, but it’s reasonable to assume the PN54 mini PC will be on the pricier side, given its strong internal specs.

    Powerful Internals

    At the core of the Asus ExpertCenter PN54 mini PC lies either the Ryzen AI 5 340 or the Ryzen AI 7 350 APU, featuring six and eight cores, respectively. Because of this, the Ryzen 7 version shows about a 25% advantage over the Ryzen 5 model in synthetic tests. Users can pair these systems with up to 64 GB of DDR5 RAM and can have up to 2 TB of SSD storage available through dual SODIMM and dual M.2 2280 slots. Both APUs offer substantial computing power, making them capable of handling most moderate to demanding tasks with ease.

    Limited Graphics Capabilities

    Like many mini PCs, the ExpertCenter PN54 does not have space for dedicated graphics cards. However, it does come with the AMD Radeon 860M (8 EUs, 3.1 TFLOPS) and Radeon 840M (4 EUs, 1.5 TFLOPS) integrated GPUs, which are decent but not enough for playing modern AAA games. As previously mentioned, this mini PC features an impressive selection of ports that includes three USB 3.2 Gen 2 Type-A, two DisplayPort 1.4, HDMI 2.1, USB 2.0, dual USB 3.2 Gen 2 Type-A, USB 4, an audio jack, and up to two 2.5G Ethernet ports. For wireless connectivity, it supports Bluetooth 5.4 and WiFi 7. Additionally, a fingerprint reader is included for enhanced security.

    Source:
    Link

    Asus ExpertCenter PN54: Stylish Mini PC with Ryzen AI 7 and 64GB RAM
    Tags: , ,
  • Apple Teases M4 MacBook Air Launch Coming This Week

    Apple Teases M4 MacBook Air Launch Coming This Week

    Key Takeaways

    1. The new MacBook Air is set to feature the Apple M4 chip.
    2. Tim Cook hinted at the launch with the phrase “There’s something in the air.”
    3. Expect 13-inch and 15-inch MacBook Air models with upgraded RAM to 16 GB.
    4. Additional upgrades beyond the M4 chip and RAM are limited.
    5. No specific date for the announcement was provided, leaving some uncertainty.

    Now that the Apple M4 chip has had some time to develop, it’s ready to make an appearance in a new laptop: the MacBook Air. Recently, Mark Gurman predicted that Apple would unveil its latest laptops this week, and it seems like Tim Cook has confirmed this.

    Exciting Teaser

    In a recent post on X, Tim shared a not-so-subtle hint stating, “There’s something in the air,” suggesting that this relates to the M4 MacBook Air or possibly a new iPad Air. Since the iPad Air isn’t expected for a while, we can anticipate the launch of new 13-inch and 15-inch MacBook Air models shortly.

    Expected Upgrades

    Besides the M4 chip, a boost in RAM, and some Apple Intelligence features, there don’t seem to be many other upgrades for this generation of MacBook Air. However, you can relax knowing Apple won’t be offering a laptop with just 8 GB of RAM anymore as 16 GB has become standard, even for the previous generation models.

    Date Uncertainty

    Sadly, Tim did not provide a specific date for the announcement. This is a bit strange since the teaser for the iPhone 16e included a clear date. Perhaps more details will come later, or you might need to stay alert for a quietly announced press release on Apple’s site.

    Source:
    Link

    Tags: , ,