Tag: Dimensity 9400

  • MediaTek Dimensity 9400 Launch: Boosting AI and Gaming Power

    MediaTek Dimensity 9400 Launch: Boosting AI and Gaming Power

    MediaTek has introduced its new top-tier chipset, the Dimensity 9400, which aims to provide unmatched performance and efficiency for future smartphones. This chipset marks a major improvement over the Dimensity 9300, bringing better CPU performance, enhanced AI functions, and upgraded gaming capabilities.

    Innovative CPU Design and Energy Efficiency

    The Dimensity 9400 features MediaTek’s second-generation All Big Core architecture. It includes a strong Arm Cortex-X925 core that runs at speeds exceeding 3.62GHz, alongside three Cortex-X4 cores and four Cortex-A720 cores. This setup achieves 35% improvement in single-core performance and 28% boost in multi-core performance when compared to the Dimensity 9300. Manufactured using TSMC’s advanced 3nm process, the Dimensity 9400 is up to 40% more efficient in power use, leading to a longer-lasting battery life.

    Superior AI Features

    One of the highlighted aspects of the Dimensity 9400 is its 8th Generation NPU, which brings pioneering advancements in generative AI capabilities. It is the first mobile chipset that allows on-device LoRA training and high-quality video generation directly on the device. MediaTek’s new Dimensity Agentic AI Engine (DAE) upgrades standard AI applications into more advanced agentic AI applications, achieving 80% faster performance in large language model (LLM) prompts while being 35% more efficient in power consumption.

    Outstanding Gaming Experience

    The Dimensity 9400 ensures a captivating gaming experience thanks to its 12-core Arm Immortalis-G925 GPU, which provides up to 40% faster ray tracing performance than its predecessor. It also supports opacity micromaps (OMM) for realistic visual effects and delivers a 41% increase in peak performance while saving up to 44% in power. Moreover, the HyperEngine technology, developed together with Arm, offers superb resolution and impressive image quality.

    Advanced Multimedia and Camera Capabilities

    This chipset comes with the MediaTek Imagiq 1090, which supports HDR video recording across the full zoom range. The Smooth Zoom feature makes it easier to capture moving subjects and cuts down power usage by as much as 14% during 4K60 video recording. It can handle a maximum camera sensor of 320MP and allows for 8K60 video capture.

    Connectivity and Extra Features

    The Dimensity 9400 includes a new 3GPP Release-17 5G modem with 4CC-CA, providing performance of up to 7Gbps in sub-6GHz bands. It also incorporates a fresh 4nm Wi-Fi/Bluetooth combo chip with data rates of 7.3Gbps and Wi-Fi 7 tri-band MLO support. The MediaTek Xtra RangeTM 3.0 feature enhances Wi-Fi coverage by up to 30 meters. This chipset supports 5G/4G Dual SIM Dual Active and tri-fold smartphones, allowing companies to create unique device designs.

    Launch Timeline

    Smartphones powered by the MediaTek Dimensity 9400 are set to be released in Q4 2024. The Vivo X200, X200 Pro, and X200 Pro Mini will be the first devices with the Dimensity 9400, launching on October 14 in China. Additionally, the Find X8 series, expected to be unveiled on October 24 in China, will also utilize the D9400 chipset.

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  • Vivo X200 Pro Mini Leaked Video: Compact Powerhouse Preview

    Vivo X200 Pro Mini Leaked Video: Compact Powerhouse Preview

    Vivo is gearing up to showcase its new X200 series in China on October 14th. This series is set to include three models: the X200, X200 Pro, and a smaller version called the X200 Pro Mini. A recent hands-on video shared on Weibo gives us a glimpse of how this upcoming compact flagship might feel when held.

    Size and Display Features

    The X200 Pro Mini, living up to its ‘Pro’ title, is designed to be a flagship smartphone, albeit in a smaller form. While its 6.3-inch screen might not seem small to those who remember phones with screens under 4 inches, it definitely offers a more manageable size compared to the larger 6.8-inch display of the X200 Pro. Many will find this size fits better in hand for everyday use.

    Powerful Performance

    Under the hood, the Pro Mini will be equipped with the new Dimensity 9400 flagship SoC, which recent leaks suggest is a powerful chipset. Additionally, Vivo has included a hefty 5,700 mAh battery in the X200 Pro Mini, which should ease any worries about battery longevity that often come with smaller smartphones.

    Impressive Camera Setup

    For those passionate about photography, the camera specs are rumored to be quite remarkable too. The primary camera is likely to utilize Sony’s LYT-818 sensor, complemented by Samsung’s ISOCELL JN1 sensor for the ultrawide shots, and an IMX882 sensor for telephoto shots featuring five-axis OIS. However, how well the Vivo X200 Pro Mini’s camera performs in real-world scenarios is yet to be determined. With the launch on October 14th approaching, we won’t have to wait long to find out.

    ExperienceMore shared via Weibo.

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  • Snapdragon 8 Gen 4 and Dimensity 9400 Prices Rise 20%

    Snapdragon 8 Gen 4 and Dimensity 9400 Prices Rise 20%

    A recent leak from the trusted tech source Digital Chat Station (DCS) indicates that the upcoming flagship processors from Qualcomm and MediaTek may be priced higher than anticipated.

    Reasons for Price Increase

    This increase is attributed to TSMC’s costly N3E manufacturing process, which will be utilized in both Qualcomm’s Snapdragon 8 Gen 4 (or 8 Elite, depending on the final name) and MediaTek’s Dimensity 9400. The leak suggests a price rise of approximately 20% compared to earlier models.

    Projected Costs for Snapdragon 8 Gen 4 and Dimensity 9400

    Due to this price increase, the Dimensity 9400 is expected to be priced around $155, while the Snapdragon 8 Gen 4 could cost about $190. Although chip makers usually keep their pricing private, a 20% rise implies that last year’s flagship Dimensity 9300 should have been priced at approximately $124, and the Snapdragon 8 Gen 3 would be around $152.

    Previous Predictions and Market Trends

    This is not the first indication of escalating costs for upcoming chips. In June, industry analyst Min-Chu Kuo forecasted an even larger increase, suggesting a hike of 25-30%, which is higher than DCS’s estimate. Additionally, tipster Ice Universe has indicated a 20.68% price increase for the Snapdragon 8 Gen 4, which aligns more closely with DCS’s projections. Regardless of the exact figures, several reports confirm that both flagship SoCs will experience a price rise this year.

    If manufacturers are indeed facing higher costs for these essential components, it’s likely that they will pass these expenses onto consumers. Consequently, consumers should prepare for pricier flagship phones from various brands this year and into 2025.

    Innovations Justifying the Costs

    As for whether the increased pricing is warranted, the Snapdragon 8 Gen 4 is set to introduce significant advancements this year. This new SoC will be Qualcomm’s first to feature in-house Oryon cores, and initial benchmarks indicate a considerable performance enhancement.

    On the other hand, MediaTek’s Dimensity 9400 will utilize ARM’s most powerful Cortex-X925 core, achieving the highest AnTuTu benchmark score ever recorded for an Android device recently.

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  • Vivo X200 Pro Satellite Edition Hits 3M AnTuTu Score Record

    Vivo X200 Pro Satellite Edition Hits 3M AnTuTu Score Record

    Yesterday, the new Oppo Find X8 Pro Satellite Communication Version smartphone achieved record-breaking scores on AnTuTu benchmarks, powered by the Dimensity 9400 chipset, with an impressive score of 2,880,550. However, the Vivo X200 Pro Satellite Communication Version has now entered AnTuTu’s database and surpassed the Find X8 Pro, becoming the first phone to exceed 3 million points.

    Vivo X200 Pro Satellite Communication Version Breaks Records

    The Vivo X200 Pro Satellite Communication Version has been highlighted by Vivo Product Manager Han Boxiao, who shared a screenshot showcasing its AnTuTu performance. This smartphone, also utilizing the Dimensity 9400 SoC, scored an extraordinary 3,007,853 points, making it the first device in the market to cross the 3 million points threshold on AnTuTu.

    Specifically, this remarkable score comes from the 16GB+1TB version of the X200 Pro Satellite Communication Version. The breakdown of its performance reveals scores of 652,381 points in the CPU test, 1,322,761 points in the GPU test, 521,453 points in the memory test, and 511,258 points in the UX test. These results showcase the device’s top-tier performance across all categories, establishing a new standard for flagship smartphones.

    Upcoming Launch and Specifications

    The Dimensity 9400 is set to launch on October 9 in China, with the X200, X200 Pro, X200 Pro Mini, and X200 Pro Satellite Communication Version being the first devices to use this new chipset. Reports indicate that the chipset, manufactured using TSMC’s 3nm process, includes one 3.63GHz Cortex-X925 ultra-core, three 2.8GHz Cortex-X4 cores, and four 2.1GHz Cortex-A7 series cores. The Cortex-X925 core alone provides a 36 percent boost in performance and a 41 percent enhancement in AI capabilities compared to its predecessor.

    In terms of graphics, the Dimensity 9400 is equipped with the Mali-G925-Immortalis MC12, which features hardware-level ray tracing technology. This upgrade results in a 20 percent increase in ray tracing performance, a 37 percent improvement in overall graphics performance, a 52 percent enhancement in processing complex data, and a 34 percent rise in AI and machine learning tasks, all while achieving a 30 percent reduction in power consumption.

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  • Oppo Find X8: Lighter Than Expected Features and Specs

    Oppo Find X8: Lighter Than Expected Features and Specs

    Many upcoming flagship phones featuring the Snapdragon 8 Gen 4 and Dimensity 9400 will have significantly larger batteries compared to earlier models. While this change suggests better battery life, there are concerns about the overall weight and handling of these new devices.

    Battery Upgrade and Weight Concerns

    The Oppo Find X8 is rumored to come equipped with a 5700 mAh battery, a notable increase from the 5000 mAh battery found in its predecessor. Social media users have expressed worries that the weight of the new model might exceed 200g. Recently, the product manager for the Oppo Find X8 series confirmed through an image that the phone will weigh less than 200 grams, despite having a bigger battery.

    The manager highlighted that the Oppo Find N2 was among the first devices to implement weight reduction techniques. Oppo is reportedly employing similar methods to make the Find X8 series lighter. Although he focused on the base model, it is anticipated that both the Find X8 Pro and Find X8 Ultra will also be lighter than expected.

    Innovative Battery Technology

    So, how is this achieved? Oppo is utilizing high-density silicon anode batteries for the Find X8 series. This technology is similar to what has been used in the production of ultra-thin batteries for devices like the Honor Magic V3. It has been noted that Oppo’s new battery technology provides a higher energy density of 763Wh/L, which is superior to conventional graphite batteries. For context, the Oppo Find X7 weighs 202 g with its 5000 mAh battery.

    Enhanced Performance Expectations

    On the performance front, both the Oppo Find X8 and Find X8 Pro will be powered by the Dimensity 9400 chipset, which is set to be officially unveiled on October 9. This chipset is rumored to deliver significantly better graphics performance compared to its predecessor, the Snapdragon 8 Gen 3, and the A18 Pro used in the iPhone 16 Pro models. Therefore, with the larger battery, users can look forward to a notable enhancement in gaming performance when compared to the Oppo Find X7.

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  • MediaTek Dimensity 9400 vs Apple M4: GFXBench Performance Showdown

    MediaTek Dimensity 9400 vs Apple M4: GFXBench Performance Showdown

    If the recent Geekbench listings are any indication, MediaTek’s Dimensity 9400 is currently at the bottom in terms of CPU performance. Both the Snapdragon 8 Gen 4 and Apple A18/A18 Pro significantly outperform it. However, MediaTek might have an advantage in GPU performance. A recent leak from Digital Chat Station suggests that its Arm Immortalis-G925 GPU surpasses even Apple’s top models.

    Impressive GPU Performance

    The Dimensity 9400 is reported to achieve a score of 134 FPS in GFXBench’s Aztec benchmark (1440p, offscreen, Vulkan). In comparison, its predecessor, the Dimensity 9300, managed only 83 FPS in the same test, showcasing a remarkable 61% improvement in performance. Even the 10-core GPU of the Apple M4 could not exceed 110 FPS in this benchmark. This suggests that the Dimensity 9400 could become a formidable option for gamers.

    Concerns About Thermal Management

    It’s important to note that the benchmark was likely run on a pre-production unit with an almost unlimited power supply. The Dimensity 9300 faced issues with overheating, and the Dimensity 9400 might encounter similar problems unless MediaTek addresses these thermal challenges. While MediaTek appears to have outperformed Apple, it still faces competition from the Qualcomm Snapdragon 8 Gen 4 and the Exynos 2500, both rumored to feature powerful GPUs as well.

    Digital Chat Station shared this information on Weibo.

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  • Oppo Find X8 Pro Satellite Edition Tops Dimensity 9400 Scores

    Oppo Find X8 Pro Satellite Edition Tops Dimensity 9400 Scores

    After introducing the standard Find X8, Oppo appears to be preparing to launch a new device known as the Find X8 Pro Satellite Edition. This device has recently shown up in the Geekbench benchmark, showcasing the new Dimensity 9400 chipset.

    Performance Insights

    The model identified as PKC110 has been associated with the Find X8 Pro Satellite Edition in various reports. In performance tests, it achieved a score of 3010 in single-core and 8686 in multi-core categories. While this represents the highest single-core score for the Dimensity 9400 to date, it still lags behind the Snapdragon 8 Gen 4, which powered the upcoming OnePlus 13. That device reached scores of 3236 in single-core and 10049 in multi-core tests earlier this month. It’s possible that Oppo is still fine-tuning the SoC to boost performance, so improved scores may emerge when the device is officially launched.

    Chipset Specifications

    The Dimensity 9400 chip features a configuration that includes one Cortex-X925 core running at 3.63GHz, three Cortex-X4 cores clocked at 2.8GHz, and four Cortex-A7 series cores operating at 2.1GHz. For graphics processing, the chipset uses the Mali-G925-Immortalis MC12 GPU.

    Anticipated Features

    The Oppo Find X8 Pro Satellite Edition is expected to expand on the features of the Find X8 Pro, adding satellite connectivity. Reports suggest it will have a mildly curved display with a resolution of 1.5K. The rear is likely to showcase a circular quad-camera setup, which may include two periscope telephoto lenses, along with a main and an ultrawide camera.

    The device is anticipated to be powered by a robust 5,800mAh battery that supports 50W wireless charging and 80W wired charging. Additional features may include an IP69-rated body, an alert slider, and a dedicated camera control button. The phone is expected to operate on ColorOS 15 based on Android 15.

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  • Snapdragon 8 Gen 4 & Dimensity 9400 Outperform Apple A18 Pro in Geekbench Test

    Snapdragon 8 Gen 4 & Dimensity 9400 Outperform Apple A18 Pro in Geekbench Test

    As the iPhone 16 series launch approaches, discussions are intensifying around Apple’s A18 Pro chip set to power the new devices. Initial reports highlighted the significant enhancement in single-core performance offered by the A18 Pro. However, recent insights shared by tipster @negativeonehero on X suggest that the multi-core performance of Apple’s upcoming A18 Pro shows only a modest 10% improvement. This advancement appears to lag behind two competing next-generation Android flagships – the Snapdragon 8 Gen 4 and Dimensity 9400.

    Performance Discrepancy in Multi-Core Scores

    The A18 Pro achieved a score of approximately 8200 in the Geekbench multi-core test, falling notably short when compared to the Snapdragon 8 Gen 4 and Dimensity 9400, which scored 10628 and 11739 points respectively. These substantial performance differentials, exceeding 2000 points, indicate a potential edge for the next wave of Android flagships over the iPhone 16 Pro models.

    Single-Core Performance Insights

    Conversely, the Snapdragon 8 Gen 4 excelled in single-core performance, reaching an impressive 3500 points, slightly surpassing the A18 Pro’s 3300 points. This jump, compared to the Snapdragon 8 Gen 3’s 2200 points in Geekbench single-core, signifies a substantial enhancement in performance. Moreover, the Dimensity 9400 promises nearly a 20% boost in both single-core and multi-core scores in contrast to its predecessor, the Dimensity 9300.

    Future Developments and Speculation

    While these chips are still in the developmental phase and slated for release towards the end of 2024, there remains ample opportunity for Apple, Qualcomm, and MediaTek to refine and optimize their offerings. Industry experts speculate that Apple may have deliberately limited multi-core performance to prioritize battery efficiency, a crucial consideration in modern smartphones.

    Snapdragon 8 Gen 4 & Dimensity 9400 Outperform Apple A18 Pro in Geekbench Test
    Snapdragon 8 Gen 4 & Dimensity 9400 Outperform Apple A18 Pro in Geekbench Test
    Snapdragon 8 Gen 4 & Dimensity 9400 Outperform Apple A18 Pro in Geekbench Test
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  • MediaTek Dimensity 9400: Specs & Performance Details Leaked

    MediaTek Dimensity 9400: Specs & Performance Details Leaked

    MediaTek is gearing up to enter the competitive flagship chip market with the upcoming Dimensity 9400, aiming to bring significant performance enhancements over its predecessor, the Dimensity 9300. This move could potentially challenge Qualcomm’s dominance in the high-end segment as MediaTek prepares for the launch of the chipset in the fourth quarter of this year.

    Dimensity 9400 Specifications and Performance Boosts

    Renowned tipster Digital Chat Station has revealed intriguing details about the Dimensity 9400 chipset. According to reports, the chipset has achieved impressive benchmark scores, with a single-core score of 2700 on Geekbench 6, showing a notable 19.3% increase over the Dimensity 9300. Additionally, the multi-core score reaches 9800, indicating a significant 24.7% improvement. The GPU, featuring the Immortalis G9xx series, is anticipated to deliver enhanced performance, with a framerate of 110fps in the GFXBench Aztec Ruins test at 1440p resolution, an 11.1% improvement from the previous generation’s performance.

    Advanced Architecture and Manufacturing Process

    Leaked information suggests that MediaTek will stick with ARM’s CPU and GPU architectures for the Dimensity 9400. The chipset is set to benefit from TSMC’s advanced 3nm manufacturing process, promising a 32% increase in power efficiency. The CPU configuration is expected to include one Cortex-X5 prime core, three Cortex-X4 prime cores, and four Cortex-A720 performance cores, a step up from the Dimensity 9300’s setup, which was based on a 4nm process.

    Enhanced Features and Competition

    Alongside improved architecture, the Dimensity 9400 is projected to support cutting-edge memory and AI processing technologies. The chipset will be compatible with LPDDR5T RAM, essential for boosting on-device AI capabilities and potentially outperforming the Dimensity 9300’s capabilities with its 33 billion parameter large language model.

    Despite these advancements, MediaTek’s Dimensity 9400 still faces tough competition, especially from Qualcomm’s upcoming Snapdragon 8 Gen 4. Initial Geekbench comparisons indicate that while the Dimensity 9400 shows significant performance improvements, it may not entirely outpace its competitors in terms of benchmarks.

    Concerns have been raised regarding the power consumption and performance of the Cortex-X5 core at various clock speeds. MediaTek is expected to address these concerns to strike the right balance between power efficiency and performance, ensuring that the Dimensity 9400 reaches its full potential.

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    MediaTek Dimensity 9400: Specs & Performance Details Leaked

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  • Impressive AI and Performance Gains Revealed in MediaTek Dimensity 9400 Specs

    Impressive AI and Performance Gains Revealed in MediaTek Dimensity 9400 Specs

    Taiwanese chipmaker MediaTek recently held a ceremony to commemorate the beginning of construction for a new office building near the Hsinchu High-speed Railway station. The 22-story building is projected to house 3,000 employees by 2027.

    MediaTek’s CEO Teases Upcoming Dimensity 9400 Chip

    During the event, CEO Cai Lixing hinted at the forthcoming Dimensity 9400 chip, which is anticipated to be released in the fourth quarter of 2024. While not explicitly mentioned, Cai highlighted that the new System on a Chip (SoC) will feature enhanced AI capabilities, positioning it as a competitor to other high-end smartphone processors.

    Leak Reveals Potential Upgrades for Dimensity 9400

    Although specific details about the Dimensity 9400’s performance remain undisclosed, a report by China Times has shed some light on what can be expected from the chip.

    According to the leak, the Dimensity 9400 is set to benefit from TSMC’s 3nm process, a shift from the Dimensity 9300’s 4nm process. This transition is expected to deliver improved performance and power efficiency.

    MediaTek Sticks with Arm’s CPU Designs

    In contrast to Qualcomm, which is transitioning to its custom Oryon CPU cores, MediaTek is likely to continue utilizing Arm’s CPU designs. The Dimensity 9400 is anticipated to feature the Cortex-X5 as its main core, alongside three Cortex-X4 and four Cortex-A720 performance cores.

    Enhanced Processing Capabilities and Faster Image Creation

    The leaked details also suggest that the Dimensity 9400 will be capable of processing 12 to 15 tokens per second using a specific model called Llama 2 from Meta. This represents a significant improvement in processing speed compared to its predecessor.

    Furthermore, the Dimensity 9400 is expected to outperform the Dimensity 9300 in image creation using Stable Diffusion 1.5, completing the task in just 3 seconds instead of 3.5 seconds.

    A Promising Future for Dimensity 9400

    With these enhancements, the Dimensity 9400, and its successor, the APU 790, have the potential to deliver processing speeds that are 20-50% faster for tokens and up to 16.7% faster for image creation.

    However, it is important to note that these details are still preliminary and subject to change. Therefore, it is advisable to approach this information with caution.

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