Samsung Considers 3D Chiplets for Exynos Mobile APs
Samsung Electronics is reportedly considering the application of 3D chiplet technology to its Exynos mobile application processors (APs). According to a company official familiar with the matter, Samsung believes that there are significant benefits to be gained from this technology.
The Advantages of Chiplets
Chiplets are a next-generation packaging technology that involves manufacturing semiconductors with different functions and vertically connecting them into a single chip. This approach offers several advantages over the traditional monolithic method.
One key benefit of chiplets is improved yield. In the case of a problem occurring in a specific circuit on a monolithic chip, the entire chip must be discarded. However, with chiplets, only the affected component needs to be replaced.
Another advantage is increased design efficiency. When a change needs to be made to a particular circuit on a monolithic chip, the entire design must be redone. With chiplets, only the specific circuit that needs to be changed requires redesign.
Gaining a Competitive Edge
The move to chiplets is driven by Samsung's desire to gain a competitive edge in the mobile AP market. Currently, Qualcomm holds the largest market share, followed by Apple and MediaTek. Samsung's Exynos APs have struggled to gain traction, leading the company to use Qualcomm's Snapdragon 8 Gen 2 chip in its flagship Galaxy S23 smartphone series.
By implementing 3D chiplets, Samsung aims to differentiate its Exynos APs. Vertical stacking of chips through 3D packaging can reduce overall package size, increase bandwidth, and improve power efficiency. These advantages could make Exynos APs more competitive with offerings from Qualcomm and Apple.
Chiplet Technology Across the Industry
Samsung is not alone in exploring chiplet technology. Other major players in the industry, such as NVIDIA, AMD, and Intel, are also incorporating chiplets into the development of system semiconductors for high-performance computing (HPC).
In conclusion, Samsung's consideration of 3D chiplets for its Exynos mobile APs reflects the company's pursuit of improved performance and competitiveness in the market. With the potential benefits that chiplet technology offers, Samsung aims to enhance its position in the mobile AP industry and provide users with more efficient and powerful devices.
