Peladn HO5 Mini PC: AMD Zen 5 Ryzen AI 9 HX 470 & OCuLink

Key Takeaway

– New HO5 mini PC features AMD Ryzen AI 9 HX 470 with 12 cores, 24 threads, and Radeon 890M graphics
– Delivers up to 80 TOPS for on-device AI tasks and local LLM execution
– Includes 32GB DDR5 RAM, 1TB PCIe SSD, secondary M.2 Gen4 slot, and OCuLink port for external GPU
– Connectivity: WiFi 7, Bluetooth 5.4, dual 2.5GbE Ethernet, USB4
– Global release late June 2026 at $1,299 with IceBlast 2.0 cooling and customizable RGB


Peladn’s New Mini PC Unveiled

The firm Peladn has announced there new HO5 mini PC, which is featuring AMDs Ryzen AI 9 HX 470 processor. They have also recentley announced another new mini-PC with the name YO2. This H05 model is set to be released globally in late June 2026 and it will have a retail price of $1,299.

Recent Hardware Releases

This newest model follows a steady stream of hardware releases from the manufacturer that have happend over the past several months. Earlier this year, we reviewed a version of the Peladn HO5 mini-PC that was powered by AMDs Strix Point platform. In the months leading up to that event, Peladn released the WO-4 model, which was equiped with a slower AMD Ryzen APU processor.

Processor and Performance Specs

The new HO5 is underpin by the Ryzen AI 9 HX 470 chip, build on AMDs Zen 5 architecture. The processor boasts a total of 12 cores and 24 threads, plus an integrated Radeon 890M graphics solution which has 16 compute units. This hardware delivers a combined performance rating of up to 80 TOPS for AI tasks, allowing users to natively run big language models and localized productivity tools rather then relying on cloud services.

Memory and Storage Details

For the memory side, you get 32GBs of DDR5 RAM and a 1TB PCIe SSD storage drive. There is also a secondary M.2 Gen4 slot available for expanding the storage capacity. Peladn also included an OCuLink port on the chassis to complement the integrated Radeon 890M graphics, which enables connection to an external GPU dock for upgrading graphics performance to desktop-class levels when needed.

Connectivity and Cooling System

Physical connectivity on this device includes WiFi 7, Bluetooth 5.4, two 2.5GbE Ethernet ports, and USB4 interfaces. The internal components are cooled by the companys IceBlast 2.0 thermal system, which makes use of three copper heatpipes, a multi-blade fan, and a high-density heatsink. The chassis also features a geometric design accented by a customizable RGB lighting element thats located on the top panel.

External Graphics Support

This focus on external graphics support is following the companys recent launch of the Link S-3 eGPU dock, which comes with Thunderbolt 5 connectivity. By using the OCuLink port, users can connect to that dock or other compatible devices to boost the graphical capabilities significantly, making this mini PC much more versatile for demanding tasks like gaming or content creation work.

  • Processor: AMD Ryzen AI 9 HX 470 (Zen 5, 12 cores, 24 threads)
  • Graphics: Integrated Radeon 890M (16 compute units)
  • AI Performance: Up to 80 TOPS
  • Memory: 32GB DDR5 RAM
  • Storage: 1TB PCIe SSD + secondary M.2 Gen4 slot
  • Ports: OCuLink, USB4, dual 2.5GbE, WiFi 7, Bluetooth 5.4
  • Cooling: IceBlast 2.0 (copper heatpipes, multi-blade fan)
  • Price: $1,299
  • Release: Late June 2026
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