Hyundai to Develop In-House Chips for Its Cars Like Apple

Key Takeaways

1. Hyundai Mobis aims for at least 10% of its semiconductor chips to be made internally by 2030 to reduce reliance on external suppliers.
2. The company already has experience, having developed 16 system semiconductors and producing around 20 million units annually.
3. Hyundai Mobis is taking a hybrid approach, combining in-house design with collaborations with major South Korean semiconductor companies.
4. Upcoming projects include a multi-functional body-control chip by 2026 and a smart LED solution developed with various partners.
5. Future plans include manufacturing power management ICs and launching silicon IGBT by 2026, enhancing supply chain resilience and supporting South Korea’s semiconductor industry.

Hyundai Mobis, which is the auto parts branch of Hyundai Motor Group focused on connected vehicles, self-driving tech, and electric systems, is increasing its focus on semiconductor design to enhance its independence. A source close to the situation revealed that the firm aims for a minimum of 10% of the chips used within Hyundai Motor Group to be made internally by the year 2030. This goal comes in light of the global automotive semiconductor shortage that occurred between 2021 and 2023.

Building on Existing Foundations

Hyundai Mobis isn’t beginning from ground zero. The company has already collaborated on the development of 16 system semiconductors with various partners and produces around 20 million units each year. Additionally, it runs six production lines that manufacture seven different power module models. In the upcoming two to three years, Hyundai Mobis intends to launch ten new chips. CEO Lee Gyu-suk emphasized the importance of having a long-term plan to lessen reliance on outside suppliers.

Collaborative Innovation

Hyundai Mobis is adopting a hybrid approach that mixes in-house design with collaboration throughout South Korea’s semiconductor industry. The firm has announced partnerships with Samsung Foundry, LX Semicon, Cadence, Synopsys, and ADT to work on a network SoC that it has designed and will validate itself. Upcoming projects include a body-control chip, which will incorporate five functions and is expected to be ready by 2026, developed alongside Dongwoon Anatech, DB Hitek, and ASE Korea, plus a smart LED solution co-created with Global Technology, SK Key Foundry, and Dongbu LED.

Future Prospects

Looking forward, Hyundai Mobis plans to start manufacturing power management ICs together with its partners and is aiming for a silicon IGBT (Si-IGBT) launch in 2026. The company asserts that this strategy will not only enhance the resilience of Hyundai Motor Group’s supply chain but also contribute to the growth of South Korea’s automotive and semiconductor sectors.

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