Category: Computers

  • Apple M4 Extreme SoC with 64-Core CPU and 160-Core GPU Canceled

    Apple M4 Extreme SoC with 64-Core CPU and 160-Core GPU Canceled

    Apple has recently unveiled the M4 series of SoCs, showcasing impressive capabilities. It has been four years since Apple introduced its Silicon, and the M-series ARM chips are now more advanced in terms of both power and efficiency. Currently, the ‘Ultra’ variant of the M SoCs stands out as the most powerful option, featuring two ‘Max’ dies. Although there are rumors about an M4 Ultra being in the works, those who hope for an even more powerful M4 Extreme may need to adjust their hopes.

    Delay on the M4 Extreme

    A report from The Information, highlighted by MacRumors, reveals that Apple has been looking into a high-performance ‘M4 Extreme’ SoC, which would combine the power of two M4 Ultra chips or four M4 Max chips. However, these plans have reportedly been put on hold by Apple. The report suggests that this decision was made to focus on creating a server chip based on Apple Silicon. Those familiar with the evolution of Apple Silicon might recall that a similar situation occurred with the rumored M2 Extreme, which likely contributed to the Mac Pro’s struggle to maintain its status as a leading workstation.

    The Potential Power of the M4 Extreme

    Should the M4 Extreme ever become a reality, it could feature an astonishing 64-core CPU and an integrated GPU boasting 160 cores. The die size would be extraordinarily large, and the number of transistors might surpass even that of server-grade equipment. With the M4 Extreme now seeming unlikely, it is uncertain if Apple will revisit this concept in the future. Nonetheless, a Mac Pro equipped with an M4 Extreme would undoubtedly be seen as a premier product, although developing and marketing it may not be practical. Ultimately, only time will tell what Apple decides.

    Source: Link

  • GPD Win Mini 2025: AMD Strix Point & M.2 2280 SSD Upgrades

    GPD Win Mini 2025: AMD Strix Point & M.2 2280 SSD Upgrades

    GPD is actively refreshing its range of products with AMD’s newest Ryzen APUs. They have shared intentions to enhance the Win Mini, which was last updated with the AMD Ryzen 5 8640U and Ryzen 7 8840U APUs at the beginning of the year (currently priced at $1,094.99 on Amazon). For some context, GPD also launched updated versions of the Win 4 and Win Max 2 featuring AMD’s Ryzen AI 9 HX 370 APU.

    New Options for the Win Mini 2025

    The upcoming Win Mini 2025 will not only include the Ryzen AI 9 HX 370 but will also offer the more affordable Ryzen AI 9 365. To clarify, the Ryzen AI 9 365 does not perform as well as the 9 HX 370 in both CPU and GPU tests. Therefore, it is reasonable to anticipate that GPD will price the Ryzen AI 9 365 models of the Win Mini 2025 lower than those with the 9 HX 370. Additionally, there will be even more budget-friendly Ryzen 7 8840U options as well.

    Specifications and Features

    According to GPD’s product information, both Zen 5 APUs will come with choices of 32 GB or 64 GB of RAM and 2 TB of storage. Interestingly, this time around, the RAM operates at 7,500 MT/s right out of the box. Previously, the Win Mini had 6,400 MT/s RAM that could be overclocked to 7,500 MT/s manually. Furthermore, GPD has included M.2 2230 SSDs in the initial two versions of the Win Mini.

    For the 2025 model, however, they have switched to an M.2 2280 slot. The product page further notes that the Win Mini 2025 weighs 35 g more, is 4 mm taller, and 1 mm thicker compared to earlier versions. While there are no explanations provided for these adjustments, it appears that the Win Mini 2025 might also feature an enhanced cooling system. Unfortunately, GPD has not disclosed the price of the new Win Mini or when it will start shipping.

    Source: Link


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  • Dockcase USB Hub with Touchscreen, M.2 Slot, 4K 120Hz Support

    Dockcase USB Hub with Touchscreen, M.2 Slot, 4K 120Hz Support

    Dockcase is starting to become a familiar name in the tech world. The company is gearing up to launch a new product: a USB docking solution that features a more upscale design and enhanced specifications. It’s being promoted as a 7-in-1 device that serves not only as a docking station but also as external storage.

    Advanced Storage Capabilities

    This device can take in either an M.2 2230 or M.2 2242 SSD. The storage drive connects through PCIe and NVMe, which allows for faster data transfer using a modern protocol. Data is transmitted over two PCIe 3.0 lanes, providing a bandwidth of 10 Gbit/s. While this speed isn’t as impressive as that of high-end external SSDs, it remains quite good on its own.

    Lightweight and User-Friendly Design

    At a weight of 113 g (0.25 lb) and dimensions of 97.8 x 55.0 x 20.9 mm (3.9 x 2.2 x 0.8 in), the device features a 1.9-inch touchscreen with a resolution of 320 x 170 pixels. Besides showing information like SSD specs, it allows users to adjust the built-in cooling fan. There’s also a read-only mode designed to help users protect the data stored on their SSD.

    Connectivity and Pricing Details

    In addition, the dock supports memory cards and includes a HDMI 2.1 port that can handle 4K output at 120Hz. It connects to computers through USB-C, but it can only deliver a maximum of 100 watts via Power Delivery. Priced at $179, the Dockcase Smart USB-C Hub 7in1 will soon be available on Kickstarter, probably with some discounts typical of crowdfunding campaigns.

    You may also want to check out a similar product: the ORICO 8-in-1 USB-C hub available on Amazon.

    Source: Link

  • Lam Research Dextro Robot Doubles Precision in Semiconductor Care

    Lam Research Dextro Robot Doubles Precision in Semiconductor Care

    Lam Research has launched Dextro, a new collaborative robot designed to meet the needs of semiconductor manufacturing equipment maintenance. This mobile robot is already operational in various advanced wafer fabs worldwide, managing maintenance for 50 to 100 chambers in Lam tools each month.

    Unique Features of Dextro

    Dextro tackles major issues in semiconductor maintenance and boasts three key features. Firstly, it installs consumable parts with more than twice the accuracy compared to human workers, enhancing etch performance at the wafer’s edges. Additionally, it tightens vacuum-sealing bolts to exact specifications, removing the common 5 percent error rate associated with manual work. This improvement minimizes the risk of temperature changes in the chambers that could disrupt production.

    Enhanced Cleaning Processes

    Furthermore, Dextro includes automated cleaning and polymer removal technology that efficiently eliminates side-wall build-up in the chambers without the need for disassembling the lower sections. This innovation increases safety by removing the necessity for protective equipment like breathing masks, which were essential during manual cleanings.

    Industry Insights

    Young Ju Kim, who is the VP and head of the Memory Etch Technology Team at Samsung Electronics, emphasized the significance of prompt and effective maintenance: "When manufacturing equipment needs maintenance, it’s critical that it’s performed swiftly and effectively to prevent tool downtime and unnecessary costs. Error-free maintenance from Dextro contributes to better production variability and yield."

    Currently, Dextro is compatible with Lam’s Flex G and H series dielectric etch tools, with plans to broaden its compatibility across more equipment by 2025. The system operates on a mobile cart and is managed by fab technicians or engineers, utilizing different end-effectors for various maintenance jobs.

    Source: Link

  • Dell Pro Max 16 & 18 Plus Workstations Leaked: OLED & CAMM2 RAM

    Dell Pro Max 16 & 18 Plus Workstations Leaked: OLED & CAMM2 RAM

    Apple has recently updated its premium MacBook Pro 14 and MacBook Pro 16 laptops, which are currently priced at $2,249 on Amazon. These new models come equipped with M4, M4 Pro, and M4 Max chipsets, along with various other enhancements compared to last year’s versions. Interestingly, Dell seems to be gearing up for its own updates that might not be too far off. In a surprising twist, at least two of these new models appear to borrow from Apple’s recent iPhone naming conventions.

    Upcoming Dell Models

    Insider information suggests that the Pro Max 16 Plus and Pro Max 18 Plus are set to make their official appearance next month at CES 2025 in Las Vegas. It’s important to mention that the images displayed below have not been confirmed yet. However, they align with earlier leaks and product visuals associated with Dell.

    Specifications and Features

    Reports indicate that Dell intends to equip the Pro Max 16 Plus and Pro Max 18 Plus with Intel Arrow Lake HX processors that boast 55 W TDPs. The total system power is expected to rise to 170 W and 200 W, respectively, when in performance mode, thanks to Nvidia RTX 5000 laptop GPUs. Notably, both laptops will incorporate a robust cooling system, earning them the title of ‘industry first 3 fan mobile workstation.’

    Additional Details

    Additionally, these models will feature dual OLED displays, offer up to 16 TB of storage spread across 4 M.2 slots, and include 256 GB of CAMM2 RAM. Importantly, these components are designed for easy access, making repairs and servicing simpler. Furthermore, both laptops will support Thunderbolt 5 connectivity, achieving transfer speeds of up to 120 Gbit/s in specific configurations. It seems that Dell may have more laptop refreshes in the pipeline for CES 2025, though details on those remain undisclosed.

    Source: Link


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  • Aostar Unveils Ryzen AI 9 HX 370 Mini PC with OCuLink Port

    Aostar Unveils Ryzen AI 9 HX 370 Mini PC with OCuLink Port

    Aoostar is yet to launch the GEM 10 370, which was introduced as the company’s first product featuring the Ryzen AI 9 HX 370. This mini PC was announced in September, and before the year concludes, the company has hinted at another small computer that utilizes the same APU.

    Teaser Insights

    According to the teaser image, the AMD Strix Point APU in this new mini PC can be adjusted to 54W TDP, providing the Radeon 890M iGPU with sufficient power to effectively run modern AAA games at good graphical settings. Moreover, the system includes an OCuLink port, allowing users to connect an eGPU for enhanced gaming performance (GPD G1 can be found on Amazon).

    Connectivity Features

    In addition to the OCuLink port, this latest Aoostar mini PC is equipped with a USB4 port, further improving its compatibility with eGPUs. There are additional connectivity options, and it appears the system is designed to be compact. The overall design seems to be distinct from other products offered by the brand.

    Performance Specifications

    The teaser image also indicates that the Ryzen AI 9 HX 370 is combined with LPDDR5 RAM operating at 8,000 MHz, which is higher than the standard 7,500 MHz RAM typically found in most mini PCs. It also shows that the system has a VC cooling system, supports WiFi 7, and includes dual SSD slots.

    Pricing Information

    As for the price, the teaser image suggests that the model with 32 GB of RAM and 1 TB of storage will be priced at CNY 5,299 (approximately $731). This price is more budget-friendly compared to the GEM 10 370’s expected launch price, which could be around $1,000, similar to other Ryzen AI 9 HX 370 mini PCs that have been released in the international market.

    Source: Link


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  • Google’s Willow Quantum Chip Completes 10-Septillion-Year Task in Minutes

    Google’s Willow Quantum Chip Completes 10-Septillion-Year Task in Minutes

    Google’s latest quantum processor, Willow, is creating a buzz due to its revolutionary error correction capabilities. It’s able to handle calculations that would take traditional supercomputers billions of years to complete. This 105-qubit chip represents a significant advancement in quantum computing, particularly in addressing the critical issue of quantum error rates.

    Advancements in Error Correction

    Willow effectively minimizes error rates by expanding its qubit grids from 3×3 to 7×7, achieving a 50% reduction in errors with each increase. This is the first instance where quantum systems have reached “below threshold” performance since Peter Shor introduced the idea of quantum error correction back in 1995.

    Incredible Performance

    In testing, Willow accomplished tasks in less than five minutes that would take roughly ten septillion years (10^25 years) on Frontier, one of the fastest supercomputers globally. The test utilized Random Circuit Sampling (RCS), known to be one of the most challenging benchmarks for quantum computers.

    Another impressive feature of Willow is its T1 times, which indicate how long qubits can maintain their state — now nearly 100 microseconds. This is five times better than earlier versions. Willow was developed at Google’s advanced quantum facility in Santa Barbara, one of the rare locations globally designed specifically for creating quantum chips.

    Aiming for Practicality

    However, Google’s efforts with Willow are not merely about showcasing impressive figures. They are also striving to transform quantum computing into a practical tool, seeking to evolve quantum supremacy into a solution for real-world challenges. Currently, Willow is employed in areas like scientific simulations and quantum system modeling, with future potential applications in enhancing AI training, drug discovery, and energy efficiency.

    Despite Willow representing a significant move toward commercially viable quantum computing, the technology remains in the experimental phase. Google is persistently refining it, concentrating not only on increasing the number of qubits but also ensuring that the technology is dependable and applicable for practical use.

    Source: Link


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  • PNY CS2150 SSD Launches with 10GB/s Read Speed via PCIe Gen5

    PNY CS2150 SSD Launches with 10GB/s Read Speed via PCIe Gen5

    PNY believes that replacing your current SSD with the CS2150 is the best way to improve load times, performance, and overall gaming experience on a PC. This is especially true if your system has other modern components that meet at least DDR5 and DirectX 12 standards, like the XLR8 Gaming-series memory and RTX 4000-series graphics cards, as heavily suggested by the OEM.

    Features and Compatibility

    The new M.2 2280 SSD is compatible with Microsoft DirectStorage, which is available for PCs running Windows 10 version 1909 or later. It’s also promoted as a useful tool for productivity, thanks to its TCG Opal 2.0 feature that could enhance security at the hardware level.

    Durability and Reliability

    PNY claims that the CS2150 is a “highly durable” SSD, boasting a mean time between failure (MTBF) rating of 1.5 million hours. Additionally, it employs a low-density parity check (LDPC) error-correction code (ECC) algorithm to ensure data integrity.

    Pricing and Models

    The CS2150 SSD is currently available in a 1TB version, which has a maximum read speed of up to 10.2GB/s and a write speed of up to 8.3GB/s. There’s also a higher-end 2TB model that features a read speed of up to 10.3GB/s and a write speed of 8.6GB/s.

    On Amazon, you can find these models listed at their suggested retail prices of $99.99 for the 1TB and $179.99 for the 2TB, both of which come with a 5-year limited warranty or total bytes written (TBW) in the United States.their suggested retail prices of $99

    Source: Link


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  • Genki Moonbase Power Strip: 240W USB-C Charger & RGB Lighting

    Genki Moonbase Power Strip: 240W USB-C Charger & RGB Lighting

    From laptops to portable gaming devices and smartphones, more gadgets are now using USB-C for charging. This trend has left many users with a clutter of chargers, making their desks look untidy. The Genki Moonbase is designed to solve this problem.

    Efficient Charging Solution

    The Genki power strip includes a built-in GaN charger that features four USB-C ports, which can deliver a total of 240 watts to various devices. The most robust port can output up to 140 watts, which is sufficient to charge a 16-inch Apple MacBook Pro, priced at about $2,250 on Amazon. When all four USB-C ports are in use at the same time, two of them can provide up to 100 watts each, while the remaining two are limited to 20 watts. This is still adequate for charging smartphones and numerous tablets.

    User-Friendly Design

    In addition to the four USB-C ports, the Genki Moonbase is equipped with three sockets that include lighting, making it easier to use in dimly lit areas. Users can change the color of the lighting with a specific button located on the side of the power strip. Genki also has plans to release a version with European sockets, but this will only happen if at least 240 people commit to ordering the EU model. If not, those in Europe who backed the Indiegogo project will get their money back.

    Pricing Details

    Currently, the Genki Moonbase power strip is available for preorder on Indiegogo, with an “early bird” price of $88 plus additional shipping fees and taxes. Eventually, the price will rise to approximately $119. The product is expected to ship starting in April 2025. As is common with crowdfunding projects, there could be delays in shipping.


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  • IBM ThinkPad: How Lenovo Transformed into a PC Powerhouse

    IBM ThinkPad: How Lenovo Transformed into a PC Powerhouse

    On December 7, 2004, a shocking announcement was made: IBM, a pioneer in the personal computing realm known for the creation of the PC, declared it would exit the market. The iconic ThinkPad line of computers would now be produced by a Chinese firm named Lenovo, a partnership that continues today, two decades later. What led to this shift? How did Lenovo rise to become the largest PC maker by volume globally?

    The Shift in the Market

    In the early 2000s, the laptop and desktop segments were dominated by American firms like HP, Dell, IBM, and Compaq. Yet, the landscape began to change with the emergence of Asian companies such as Asus, Acer, and Legend, which transitioned from manufacturing PCs for U.S. brands to launching their own. Simultaneously, the popularity of laptops surged, overtaking desktops in sales, and prices began to fall, making laptops accessible to many consumers. This led to fierce competition among PC manufacturers, centered around pricing.

    IBM’s Tough Spot

    This competitive environment set the stage for IBM’s 2004 decision. The once-thriving PC division was experiencing significant financial losses, as “Big Blue” struggled to compete on pricing with its rivals. Although ThinkPad laptops were known for their exceptional quality and reputation, they also came with a hefty price tag— the IBM ThinkPad T series had a starting price of $2,150 in 2002, roughly equivalent to $3,800 today when adjusted for inflation.

    IBM was unable to pivot its strategy to accommodate a potentially low-margin business. Thus, the decision was made to divest from the PC sector. But who would be interested in acquiring a money-losing division? Enter Legend, which rebranded as Lenovo, eyeing an expansion into Western markets. Previously, Legend primarily sold affordable consumer PCs within China, and IBM’s PC division looked like a gateway to reach the West.

    Transition and Doubts

    When Lenovo took control in mid-2005, skepticism was rampant. Could this inexperienced Chinese company maintain the quality associated with IBM? Could they return the business to profitability? Would all the development shift to China?

    Lenovo’s approach was quite intelligent: Instead of a complete takeover, they appointed former IBM executives to lead the new entity. IBM’s development centers in the USA and Japan remained operational, and for several years, ThinkPads continued to bear the “IBM ThinkPad” branding. This strategy helped ease customer concerns during the transition.

    At the same time, Lenovo worked on lowering manufacturing costs. They phased out costly hardware options like the IBM FlexView IPS screens and established a closer partnership with Microsoft, marked by the inclusion of Windows keys on ThinkPad keyboards—something IBM had never done. The design of ThinkPads largely stayed the same during Lenovo’s first five years of ownership, while new premium models like the ThinkPad X300 and ThinkPad X1 Carbon were introduced. Lenovo successfully retained the ThinkPad brand as a strong name in the business market, outselling IBM and regaining profitability.

    Expanding Horizons

    With a solid reputation as the ThinkPad manufacturer, Lenovo began to tap into the consumer market. Initially, many of its consumer laptops were of lower quality and largely designed in China. However, over time, Lenovo’s consumer laptops began to resemble ThinkPads more closely, featuring similar keyboards and improved quality. The company also introduced premium consumer lines like Yoga and Legion gaming laptops.

    Ultimately, Lenovo managed to turn the business around. While profit margins were tight, selling PCs became lucrative again. By 2013, Lenovo surpassed HP to become the largest PC manufacturer by volume, a title it has maintained for 11 years. With this success in the PC sector, Lenovo ventured into other domains as well, acquiring the American brand Motorola Mobility in 2014, thus adding a well-known smartphone line to its offerings. That same year, IBM sold its System X server business to Lenovo, bringing their story full-circle.

    The Future Ahead

    With a trade war brewing between the U.S. and China, the future of this Chinese-American hybrid company is intriguing. Lenovo has managed to steer clear of U.S. government scrutiny, unlike other Chinese firms such as Huawei.

    However, Lenovo’s reliance on partners like Intel could pose risks. Intel, once the sole processor supplier for ThinkPad laptops, has long supported its PC partners with subsidies for hardware development. A failure at Intel could significantly impact Lenovo.

    On the bright side, Lenovo has diversified its offerings, now producing ThinkPad laptops like the ThinkPad T14s Gen 6, which uses Qualcomm Snapdragon chips and AMD Ryzen AI CPUs. This shows the company understands the importance of diversifying its partnerships. Unlike IBM, which boasted the resources and vision to be self-sufficient, Lenovo is dependent on its tech partners. Whether this reliance will prove to be a strength or a weakness remains to be seen as time progresses.

    Source: Link


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