Category: Computers

  • Qualcomm Project Glymur Leaks with Snapdragon X2 Ultra Premium

    Qualcomm Project Glymur Leaks with Snapdragon X2 Ultra Premium

    Less than a year ago, Qualcomm presented its Snapdragon X Plus and Snapdragon X Elite chipsets, which feature the long-anticipated Oryon CPU cores. To give some context, the Snapdragon 8 Elite, which uses second-generation Oryon cores, powers many top-tier smartphones like the OnePlus 13, Galaxy S25 Ultra, and Nubia Z70 Ultra (currently available for $749 on Amazon), to name a few.

    Recent Chipset Developments

    Qualcomm is still rolling out first-generation chipsets, with the latest being the Snapdragon X (X1-26-100), which made its debut at CES 2025 in Las Vegas and is found in devices such as the Asus Zenbook A14. There have been whispers about next-gen chipsets since September 2024, when leaker Roland Quandt shared codenames like ‘SC8480XP’ and ‘Project Glymur’.

    Expectations for Future Chipsets

    Later, the same source hinted that Qualcomm is trialing the Snapdragon X Elite Gen 2 chipsets in desktop setups using All in One (AiO) 120 mm coolers. Recent findings from export databases indicate that Project Glymur is still being actively developed. The presence of ’12CH’ in these database entries has sparked rumors that Qualcomm’s upcoming Snapdragon X chipsets might offer support for twelve memory channels, marking a 50% increase over the first-generation models.

    New Chipset Identified

    Additionally, a new chipset has been observed under the name ‘Snapdragon X2 Ultra Premium.’ Identified with the part number X2-000-096, the ‘Ultra Premium’ label suggests it will serve as a stronger option compared to the SC8480XP. While details remain scarce at this time, Qualcomm has already indicated that its Snapdragon X Elite Gen 2 and Snapdragon X2 chipsets will feature third-generation Oryon CPU cores.

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  • Nvidia RTX 5090 Release: Customers Line Up at Micro Center

    Nvidia RTX 5090 Release: Customers Line Up at Micro Center

    Some shoppers are going to great lengths, as retailers report significant shortages of the RTX 50 series. A Reddit post from Micro Center reveals a number of tents set up outside its store in Tustin, California. Micro Center is a go-to place for PC builders in the U.S., known for keeping the most sought-after components in stock. Now, it has turned into a hotspot for eager buyers ahead of the January 30th launch of the RTX 5080 and RTX 5090.

    Cold Weather and Campers

    With the expectation of limited stock, Micro Center released a YouTube video addressing the situation. They advised customers against waiting outside in the cold winter weather, yet that hasn’t deterred some determined individuals at the Tustin location. While the climate isn’t exactly warm, Tustin’s weather is milder compared to the colder regions of the east and north in the U.S. There’s some debate on whether tents are allowed on the property, but previous customers have shared stories of similar scenes before other big product releases.

    A Plan for Launch Day

    To avoid chaos on January 30th, Micro Center is implementing a voucher system. On launch day, customers will be able to buy either the RTX 5080 or RTX 5090 GPUs, but the store will not stock the Founders Edition cards. MSI is expected to be the main supplier, although it has already dampened hopes for availability. The company cites Nvidia’s failure to provide enough chips for third-party manufacturers to produce their custom graphics cards. Consequently, scalpers are likely to attempt to grab any RTX 50 series inventory again and sell it at higher prices.

    Dedication or Desperation?

    Whenever customers turn a retail location into a camping site, it tends to spark mixed reactions. One camper at the Tustin Micro Center even took to Reddit to clarify that they had no plans to scalp. Facing the cold days before the RTX 5090’s launch, it’s tough not to appreciate such commitment.

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  • Nvidia Reveals Unique Features of Founders Edition RTX 5090

    Nvidia Reveals Unique Features of Founders Edition RTX 5090

    The Nvidia RTX 5090 FE stands out as a top-tier graphic card crafted to meet high power demands and manage significant heat output. Its surprisingly slim two-slot design breaks the mold for GPUs within this power range. As a premier offering, it showcases cutting-edge engineering and innovation, marking the 5090 FE as a significant advancement in Nvidia’s continuous evolution of graphics processing unit technology.

    Prototype Insights

    A recent video presented a prototype of this GPU, which featured an ambitious quad-slot design with a fully flow-through cooling solution and a vertical PCB. While this initial concept displayed the impressive capabilities of the hardware, the final version of the RTX 5090 FE was streamlined into a more compact design. This adjustment avoids the impracticality of the bulky 4-slot configuration, which wouldn’t fit well in numerous modern cases, opting instead for a design that better aligns with contemporary system builds and user needs.

    Thermal Innovations

    The RTX 5090 FE brings forth new ideas in thermal management. It employs liquid metal on the GPU die, held in place by a specially designed rubber gasket to prevent leaks that might harm the PCB. The GPU features a semi-pass-through setup that integrates a modular PCB with a two-thirds blow-through cooling system, ensuring temperatures remain optimal. Additionally, a 3D vapor chamber equipped with artery wicks significantly boosts heat dissipation efficiency.

    Usability Features

    This design also includes user-friendly elements like repositioned power connector ports for better accessibility and an anti-fingerprint coating, although its effectiveness has yet to be fully evaluated. These enhancements aim to improve maintenance and ease of use, but measuring their actual impact in real-world scenarios might be challenging.

    The RTX 5090 FE is a formidable graphics card that challenges the limits of technology and hardware design. With an impressive power consumption of 575W, it offers top-notch performance in a sleek two-slot layout, as verified through our testing. Such extreme power needs raise concerns regarding its practicality for everyday use and the heat it generates in smaller builds.

    Future of GPU Design

    The compact design of the 5090 FE reflects the trend toward minimalist PC cases, prompting the industry to reconsider the increasing size of GPUs. Where could this lead us? Ideally, towards a future with slimmer, more efficient GPU designs, steering us closer to a standard that is less than 3 slots.

  • Xiaomi 5-in-1 Type-C Hub 100W PD Now Available in Europe

    Xiaomi 5-in-1 Type-C Hub 100W PD Now Available in Europe

    Xiaomi is now making its 5-in-1 Type-C Hub available throughout Europe. This accessory was first seen on the company’s global website last year and was launched in the UK a few months after that. It’s now up for grabs in EU nations like Italy and Germany, and a support page hints that a release in France is coming soon.

    Features of the Hub

    The 5-in-1 Type-C Hub comes equipped with three USB 3.0 ports that allow for data transfers, boasting speeds of up to 450 Mbps. Users can also utilize the HDMI port to link up to a monitor that supports a maximum resolution of 4K@60Hz. The last port is a 100W USB-C input that works with the USB Power Delivery (PD) protocol, enabling 90W pass-through charging for the host device. An integrated USB-C cable connects it, and when it’s not needed, you can store the USB-C connector’s head in a groove, creating a handy loop for carrying it around.

    Compatibility and Design

    The device is designed to work with various operating systems, including Windows, MacOS, Linux OS, and Android. The sleek accessory features a light silver aluminum alloy exterior and has dimensions of 112.5 x 10.4 x 39 mm (approximately 4.4 x 0.4 x 1.5 inches). Currently, you can purchase the Xiaomi 5-in-1 Type-C Hub in the UK for £24.99, in Italy for €29.99, and in Germany for €34.99. It remains uncertain when it will be available in France or other parts of Europe.

    Conclusion

    With its versatile functionality and stylish design, the Xiaomi 5-in-1 Type-C Hub is a great addition for anyone needing multiple connections in a compact form. Availability is growing, but patience may be required for those in France and beyond.

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  • SilverStone Expansion Card: Add Up to 4 High-Performance SSDs

    SilverStone Expansion Card: Add Up to 4 High-Performance SSDs

    SilverStone, a well-known maker of PC accessories, has recently introduced a new expansion card called the ECM40. This innovative solution is designed to help users expand their storage when there are limited options for installing high-performance storage devices. The ECM40 connects to a PCIe 4.0 slot, allowing for the installation of up to 4 M.2 SSDs. It supports a variety of formats, including M.2 2230, M.2 2242, M.2 2260, and M.2 2280, making it highly flexible in terms of storage choices. The dimensions of this expansion card are 147.74 x 181 x 21.59 millimeters, and it occupies just one slot.

    Impressive Speed Capabilities

    According to SilverStone, users can achieve data transfer speeds of up to about 7,350 Mbps on modern PCs when using a Kingston Fury SSD. This speed is primarily relevant for sequential data transfers and reading files. The ECM40 serves not only to connect SSDs but also to keep them cool during operation. It comes equipped with a heat sink and a 40-millimeter fan, which can be toggled on or off manually via a switch located on the back of the card.

    Perfect for Compact Cases

    The ECM40 could prove to be particularly valuable in compact PC cases that lack mounting options for 2.5-inch drives or on motherboards that have limited space for installing an M.2 SSD. However, details regarding its price or availability have yet to be announced by SilverStone.

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  • Morefine S800 Mini PC: Intel Core Ultra 9, 96GB DDR5 RAM

    Morefine S800 Mini PC: Intel Core Ultra 9, 96GB DDR5 RAM

    Chinese company Morefine has just introduced its newest mini PC, the S800, aimed at global consumers. This small but powerful machine is perfect for those who want high performance without taking up much space. The S800 is available for $659 in its barebone version and is expected to ship by mid-February. Let’s take a closer look at its main features.

    Morefine S800 Specs

    The Morefine S800 is powered by the Intel Core Ultra 9 185H processor. This 16-core, 24-thread chip can reach a turbo speed of 5.1GHz and boasts a 24MB Smart Cache. It also has an Intel Arc Graphics GPU that operates at 2.35GHz, making it great for gaming, 3D rendering, and creating content. Its CPU+GPU+NPU setup delivers 34.5 TOPS of AI performance, making it ideal for AI tasks and ray tracing.

    Memory and Storage

    Regarding memory and storage, the S800 can handle dual-channel DDR5 RAM, achieving speeds of up to 5600MHz and supporting up to 96GB. This ensures smooth performance during multitasking. For storage, it provides two M.2 2280 NVMe PCIe 4.0 slots along with a 2.5-inch SATA SSD slot.

    Cooling and Design

    The S800 is equipped with a dual cooling system that features a quiet fan and pure copper radiator for effective heat management while keeping noise levels low. Its compact dimensions are 149 x 146 x 55.4mm, and the design is inspired by cyberpunk aesthetics. It also includes ventilation holes on the sides to improve airflow and maintain top performance.

    Connectivity Options

    When it comes to connectivity, this mini PC has dual 2.5G Ethernet ports for speedy networking. Additionally, it supports Wi-Fi 6E and Bluetooth 5.3 for reliable wireless connections. The S800 can handle 4K UHD on three displays at once through HDMI 2.0 (4K@60Hz), USB-C (4K@144Hz), and DisplayPort 1.4 (4K@144Hz). Moreover, it offers a variety of I/O options, including USB4, two USB-A 3.0 ports, and four USB-A 2.0 ports, making it compatible with many devices.

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  • Apple’s Success Drives Innovation at Qualcomm and MediaTek in 2025

    Apple’s Success Drives Innovation at Qualcomm and MediaTek in 2025

    The tech sector has long been a hotbed for new ideas, especially in the semiconductor field. Apple’s unyielding drive for advanced technology has established new standards for performance, efficiency, and integration, pushing rivals like Qualcomm and MediaTek to elevate their efforts.

    Apple’s Influence by 2025

    By 2025, Apple’s achievements with its unique silicon, especially the M-series chips, have transformed consumer expectations and compelled its competitors to innovate more rapidly than ever. This piece delves into how Apple’s leadership is making Qualcomm and MediaTek reassess their strategies and hasten their technological progress.

    The Shift to M-Series Chips

    Apple’s move from Intel processors to its uniquely crafted M-series chips was a game-changer in the semiconductor sector. The M1, M2, and later versions have set fresh benchmarks for performance per watt, merging CPU, GPU, and neural engines into a single system-on-a-chip (SoC).

    These chips have provided desktop-level performance in ultra-slim laptops and tablets, challenging the long-standing x86 architecture led by Intel and AMD. Apple’s integration of hardware and software optimization has granted it a significant advantage, leaving competitors scrambling to keep pace.

    The M-series chips have also illustrated the strength of ARM-based designs in high-performance computing, showing they can rival and even exceed traditional x86 processors. This has prompted Qualcomm and MediaTek, which primarily focus on ARM designs, to rethink their methods regarding performance, efficiency, and scalability.

    Qualcomm’s Strategic Moves

    Qualcomm, a frontrunner in mobile processors, acknowledged the necessity to innovate beyond its Snapdragon range to keep up with Apple’s silicon. In 2021, Qualcomm took a significant step by acquiring Nuvia, a startup founded by ex-Apple engineers with experience on the A-series chips. This acquisition was a tactical decision to enhance Qualcomm’s skills in creating high-performance, energy-efficient CPUs.

    By 2024, Qualcomm’s Snapdragon X Elite and Snapdragon X Plus chips showcased the benefits of this acquisition. These processors, utilizing Nuvia’s tailored Oryon CPU cores, are engineered to compete with Apple’s M-series chips in terms of both performance and efficiency.

    The Snapdragon X series is aimed not only at laptops but also desktops and servers, indicating Qualcomm’s ambition to broaden its horizons beyond mobile devices. The company has also directed its attention towards enhancing AI capabilities and GPU performance, areas where Apple has excelled.

    Qualcomm’s collaboration with Microsoft to fine-tune Windows for ARM processors has further solidified its standing. By 2025, Qualcomm-powered Windows laptops deliver battery life and performance that can compete with Apple’s MacBooks, thanks to the Snapdragon X series.

    Yet, Qualcomm’s innovations extend beyond PCs. In 2024, the Snapdragon 8 Elite chipset debuted, revolutionizing the smartphone landscape. Built using Nuvia’s Oryon architecture, the Snapdragon 8 Elite boasts unmatched performance and efficiency, narrowing the gap with Apple’s A-series chips and even excelling in certain tests.

    The custom Oryon cores within the Snapdragon 8 Elite provide a 40% enhancement in single-threaded performance compared to its predecessor, making it the most rapid mobile CPU available. This empowers Android flagship devices to match Apple’s iPhones in terms of sheer power.

    The Snapdragon 8 Elite also incorporates an advanced AI engine capable of 75 TOPS (trillions of operations per second), enabling sophisticated on-device AI functions like real-time language translation, improved photography, and tailored user experiences.

    Its Adreno GPU has set new benchmarks for mobile gaming, facilitating ray tracing and 8K gaming at 60 FPS, appealing to gamers and content creators alike. Despite its exceptional performance, the Snapdragon 8 Elite remains impressively power-efficient, thanks to its 3nm manufacturing process, ensuring smartphones can provide all-day battery life, even under strenuous conditions.

    The Snapdragon 8 Elite not only enhances Android flagship devices but now also compels Apple to hasten its own innovation cycle.

    MediaTek’s New Direction

    MediaTek, usually recognized for its mid-range and budget chips, has also been compelled to innovate due to Apple’s achievements. The company has redirected its focus towards high-performance processors, striving to compete in the premium market led by Apple and Qualcomm. MediaTek’s Dimensity series, originally aimed at smartphones, has expanded to include chips for Chromebooks, tablets, and even automotive uses.

    Since 2024, MediaTek has been capitalizing on its AI and 5G expertise to stand out. The company’s latest Dimensity chips come equipped with advanced neural processing units (NPUs) that rival Apple’s Neural Engine, allowing for faster and more effective AI tasks. Additionally, MediaTek has heavily invested in heterogeneous computing, merging CPU, GPU, and NPU resources to create a smooth user experience.

    Although their current flagship chip, the Dimensity 9400, performs at par with the Snapdragon 8 Elite, the upcoming Dimensity 9500 exemplifies MediaTek’s ambition to disrupt the high-performance chip arena. Rumored to feature a ‘2 + 6’ CPU cluster with ARM’s next-gen Cortex-X930 and Cortex-A730 cores, the chip may lack custom cores like Qualcomm’s Oryon but compensates with other advancements.

    Constructed on TSMC’s advanced 3nm N3P process, the Dimensity 9500 promises enhanced thermal efficiency and up to 20% gains in multi-core performance. These developments position MediaTek as a serious player in the premium market, with an official launch anticipated in late 2025.

    Moreover, MediaTek is also targeting other sectors, like smart home devices and IoT, to lessen its dependence on the fiercely competitive smartphone market. By diversifying its product lineup, MediaTek aims to forge new revenue streams while continuing to innovate in the processor domain.

    The Industry’s Evolving Landscape

    Apple’s triumph in pushing ARM-based innovation with its M-series chips has not only challenged the supremacy of x86 processors but also ignited a transformation throughout the semiconductor industry. The company’s lead in single-core performance has established a high standard, forcing competitors like Qualcomm and MediaTek to enhance their offerings.

    The anticipated Snapdragon 8 Elite Gen 2 and Dimensity 9500, both utilizing TSMC’s cutting-edge 3nm ‘N3P’ process, exemplify this competitive drive. These chipsets are projected to achieve Geekbench 6 single-core scores of 4,000, potentially matching or exceeding Apple’s forthcoming M4 chip.

    Beyond mere performance, the industry is also adopting ARM’s Scalable Matrix Extension to improve efficiency in managing complex tasks, a feature both Qualcomm and MediaTek plan to incorporate into their latest SoCs.

    While the ultimate performance of these chips in consumer devices remains uncertain, this competitive environment illustrates the growing shift towards custom silicon designs. As more players enter the ARM-based market, the effects of Apple’s pioneering efforts are likely to inspire further innovation across the industry.


  • Minisforum UN150P: Affordable Mini PC with Intel Twin Lake CPU

    Minisforum UN150P: Affordable Mini PC with Intel Twin Lake CPU

    Minisforum has launched a new budget-friendly mini PC called the UN150P. It is powered by the recently released Intel N150 CPU from the Twin Lake series. This isn’t the first device to use this chip; similar mini PCs from Beelink and Acemagic were released in December of last year.

    Design and Features

    The Minisforum UN150P isn’t significantly different from the Acemagic V1 or Beelink EQ14 (current price $189 on Amazon). However, it features a stylish chassis that the company claims is small enough to fit in most environments. Additionally, the new mini PC incorporates what Minisforum refers to as “cold wave cooling,” which aims to optimize the performance of the Intel N150 while maintaining a quiet operation.

    Connectivity Options

    Another standout feature of the Minisforum UN150P is its extensive set of connectivity options. It includes:

    With one USB Type-C port and two HDMI ports, this mini PC can support three display outputs simultaneously. For wireless connections, it offers WiFi 6 and Bluetooth 5.2. Other impressive features include support for up to 16 GB of DDR4 RAM in a single-channel configuration and up to 3 TB of storage.

    Pricing Information

    Regarding pricing, the Minisforum UN150P comes in a single configuration that includes 16 GB of RAM and 512 GB of storage. It is currently available for purchase on the official website for $219.

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  • Lenovo’s AMD ThinkPad P14s Gen 5: Unequal Features Explained

    Lenovo’s AMD ThinkPad P14s Gen 5: Unequal Features Explained

    When a laptop company puts out a model featuring both Intel and AMD CPUs, they often utilize the same parts for both versions. This approach makes sense financially, as creating unique components can be quite costly.

    Lenovo’s Unique Approach

    Interestingly, Lenovo takes a different path with its ThinkPad P14s Gen 5. This compact mobile workstation comes with either the AMD Ryzen 8000HS or Core Ultra 100H CPUs, but the two versions are quite distinct. The ThinkPad P14s Gen 5 Intel (available on Amazon) boasts a 14.5-inch display, a 75 Wh battery, and a dual-fan cooling system. In contrast, the ThinkPad P14s Gen 5 AMD features a smaller 14-inch screen, a 52.5 Wh battery, and a single-fan cooling setup.

    Design Choices Behind the Models

    The differences arise because Lenovo adopts the design from the ThinkPad T14 Gen 5 for the AMD variant, while the Intel model is equipped with its own uniquely designed chassis.

    In our detailed review of the ThinkPad P14s Gen 5 AMD, we found that this version isn’t the best option: The battery is quite small, causing the OLED display to drain it rapidly. Furthermore, the performance edge over the more efficient T14 Gen 5 AMD is minimal.

    A Better Option Could Have Been

    This situation could have been different: If Lenovo had based the AMD version on the P14s Gen 5 Intel, it would likely be a superior choice. Currently, potential buyers might find it more advantageous to opt for the ThinkPad T14 Gen 5 for a lighter and more energy-efficient laptop or the ThinkPad P14s Gen 5 Intel for higher performance. The P14s Gen 5 AMD seems a little out of place between these two options.

  • Beelink SER9 Pro: AMD Ryzen 9 365 Mini-PC Launch Discount

    Beelink SER9 Pro: AMD Ryzen 9 365 Mini-PC Launch Discount

    Beelink has been in the market with its SER9 mini-PCs for some time, offering them for sale since September. At first, the SER9 series came with AMD’s Ryzen AI 9 HX 370 (currently priced at $999 on Amazon), which is now also seen in gaming handhelds like the Ayaneo 3.

    New Addition to the SER9 Series

    Recently, Beelink has updated the SER9 lineup by introducing a more affordable Ryzen AI 9 365 variant. This model is housed in a compact 135 x 135 x 44.7 mm design and weighs 780 g. While the Ryzen AI 9 365 is one of AMD’s stronger Strix Point APUs, it possesses 25% fewer Zen 5c CPU cores and four less threads than the Ryzen AI 9 HX 370, leading to a performance drop of nearly 20%. The performance differences extend to their integrated GPUs as well, despite the 25% disparity in unified shaders.

    Features of the SER9 Pro

    On the other hand, the newly introduced SER9 Pro comes with two M.2 2280 slots that are compatible with PCIe 4.0 SSDs and features 32 GB of quad-channel LPDDR5X RAM, running at 8,000 MT/s. Beelink also includes modern connectivity options such as DisplayPort 1.4, HDMI 2.1, and USB4, allowing users to connect to an external monitor with support for resolutions up to 4K and refresh rates of 240 Hz. You can pre-order the SER9 Pro directly from Beelink for $949, which is a savings of $250 off its suggested retail price of $1,199.

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