Category: Computers

  • HP Launches OmniBook X Flip 16: Intel Core Ultra 7, 3K OLED

    HP Launches OmniBook X Flip 16: Intel Core Ultra 7, 3K OLED

    Key Takeaways

    1. Versatile Design: The HP OmniBook X Flip 16 AI is a 2-in-1 laptop with a stylish 16-inch convertible OLED display, available in both AI and non-AI models.

    2. High-Quality Display: It features a 16-inch screen with a resolution of 2880 x 1800 pixels, 500 nits brightness, and 100% DCI-P3 color space coverage, ideal for creative tasks.

    3. Powerful Processing Options: Users can choose between Intel Core Ultra or AMD Ryzen AI processors, with up to 32 GB of RAM and 2 TB of SSD storage, but it lacks a dedicated GPU.

    4. Connectivity and Battery: The laptop has a 68 Wh battery supporting 65 W USB Type-C charging, and offers multiple ports including Thunderbolt 4 and HDMI 2.1, but no SD card reader.

    5. Lightweight and Portable: Weighing only 1.8 kg (4.15 lbs) and measuring 15.4 mm (0.61 inches) thick, it is designed for easy portability with additional features like WiFi 7 and Bluetooth 5.4.


    HP has launched its new OmniBook X Flip 16 AI, a versatile 2-in-1 laptop designed for productivity with high-end features and a stylish 16-inch form. In this latest iteration, HP has introduced both AI and non-AI models within the OmniBook X lineup. Along with the OmniBook X Flip 16 AI, the company has also revealed the OmniBook X Flip 14 AI, OmniBook X Flip 17.3 AI, and standard OmniBook X Flip 16 notebooks.

    Display Features

    The HP OmniBook X Flip 16 AI features a 16-inch convertible OLED screen with a resolution of 2880 x 1800 pixels and a variable refresh rate ranging from 48 to 120 Hz, achieving a peak brightness of 500 nits. This display covers 100% of the DCI-P3 color space, making it ideal for activities like digital drawing, video editing, and photo enhancement. Alternatively, users looking for a more casual experience can select the lower-resolution 2K (1920 x 1200) OLED option, which offers a peak brightness of 300 nits. Additionally, the panel is certified by TUV + Eyesafe for low blue light emission.

    Processor and Storage Options

    When it comes to processing power, buyers can choose between the Intel Core Ultra 7 258V/ 5 226V or AMD Ryzen AI 7 350/ 5 340 CPUs. Unfortunately, there is no separate GPU; depending on the selected processor, you will have either Intel’s Arc 140V or AMD Radeon 860M integrated graphics. The laptop can be configured with a maximum of 32 GB of LPDDR5x RAM and a 2 TB PCIe Gen 4 NVMe SSD.

    Battery and Connectivity

    This convertible laptop is equipped with a 68 Wh battery that supports 65 W wired charging through USB Type-C. HP includes various connectivity options, such as 1 x Thunderbolt 4, 1 x USB-C, 2 x USB Type-A, 1 x HDMI 2.1, and a 3.5 mm headphone jack. Unfortunately, there is no SD card reader, so users will need to use an adapter. Despite its large display, the laptop is lightweight at just 1.8 kg (4.15 lbs) and has a slim thickness of 15.4 mm (0.61 inches), making it easy to carry. Additional features include WiFi 7 support, a 5 MP IR camera with temporal noise reduction (TNR), dual speakers featuring DTS X ultra audio, and Bluetooth 5.4 connectivity.

    The HP OmniBook X Flip 16 AI 2-in-1 laptop will be offered in Glacier Silver, Eclipse Gray, and Meteor Silver colors. As for pricing and availability, HP has not yet released specific details regarding when the HP OmniBook X Flip 16 AI laptop will be available or how much it will cost.


  • HP ProBook 4 G1q 14 with Snapdragon X1P-26-100 and Copilot+

    HP ProBook 4 G1q 14 with Snapdragon X1P-26-100 and Copilot+

    Key Takeaways

    1. HP launched multiple ProBook 4 models with Intel and AMD processors, but they do not qualify as Copilot+ PCs due to limited NPU capabilities.
    2. The ProBook 4 G1q 14 features a Snapdragon X1P-26-100 SoC with a 45 TOPS NPU, making it eligible for the Copilot+ PC designation.
    3. The G1q model can be customized with up to 32 GB of LPDDR5X RAM and 1 TB NVMe SSD storage, enhancing performance for business tasks.
    4. The G1q has a 14-inch screen with 1200p display options and includes a 5 MP webcam and a 56 Whr battery.
    5. It offers upgraded connectivity with 2x USB4 40 Gbps ports and Qualcomm FastConnect 6900 Wi-Fi 6E or FastConnect 7800 Wi-Fi 7 options.


    HP has launched multiple models of the ProBook 4 today, featuring both Intel and AMD processors. However, these models do not qualify as Copilot+ PCs due to their limited NPU capabilities. For those interested in maximizing AI functionality, HP is also offering the ProBook 4 G1q 14.

    Performance and Features

    The ProBook 4 G1q 14 is powered by the Snapdragon X1P-26-100 SoC, which boasts a 45 TOPS NPU. This makes it eligible for the Copilot+ PC designation. Customers can customize the ProBook 4 G1q to have up to 32 GB of LPDDR5X RAM and a maximum storage of 1 TB with an NVMe SSD.

    HP claims that the 45 TOPS NPU is beneficial for intensive business tasks, such as document analysis and setting management. It also offers the option to choose between on-device processing and cloud computing based on user needs.

    Display and Design

    In contrast to the Intel and AMD versions, the ProBook 4 G1q is available solely with a 14-inch screen and provides various 1200p display options. Besides this, the G1q retains many characteristics from its Intel and AMD variants, including a 5 MP webcam, a 56 Whr battery, and a comparable selection of ports.

    The main distinctions include the inclusion of 2x USB4 40 Gbps ports, which is an upgrade from the 20 Gbps ports found on the Intel and AMD models. Additionally, it features Qualcomm FastConnect 6900 Wi-Fi 6E with Bluetooth 5.3 or FastConnect 7800 Wi-Fi 7 with Bluetooth 5.4 network adapters.


  • Apple MacBook Fold: 18.8-Inch Touchscreen Launching in 2026

    Apple MacBook Fold: 18.8-Inch Touchscreen Launching in 2026

    Key Takeaways

    1. The iPhone Fold is expected to launch in 2026 with a price around $3,000.
    2. An “iPad Fold” may be released in 2027 or 2028, potentially running macOS and Mac apps.
    3. The rumored “MacBook Fold” would be Apple’s first touchscreen Mac, debuting in late 2026 or early 2027.
    4. The device is anticipated to have a foldable OLED screen that expands to 18.8 inches.
    5. Predictions about the launch timeline vary, with some analysts suggesting earlier production than previously expected.


    Speculation about the iPhone Fold has been buzzing for several months now. It is expected to launch in 2026, with a price tag of around $3,000. There’s also talk of an “iPad Fold” that might come out in 2027 or 2028. However, there have been hints that this device could run Mac apps, and analyst Jeff Pu has mentioned that Apple might actually be including macOS, which would essentially make it a MacBook instead.

    A Touchscreen MacBook?

    If these rumors are true, the so-called “MacBook Fold” would mark the first Mac to feature a touchscreen. It’s anticipated to debut in September or October, and the upcoming macOS 16 could offer a more touchscreen-friendly user experience thanks to its newly redesigned interface. This is in line with earlier reports from 2023 that suggested Apple has been developing its first touchscreen Mac for a significant period.

    Predictions Diverging

    Jeff Pu’s insights differ from earlier predictions regarding the launch schedule. While Bloomberg’s Mark Gurman forecasted a release in 2028, Pu believes that the device will start mass production in the latter half of 2026, pointing to a potential launch in late 2026 or early 2027. In any case, the device is rumored to come equipped with a foldable OLED screen that expands to an 18.8-inch display, featuring a nearly invisible crease in the center. It remains unclear whether Apple will include a detachable keyboard, similar to what we’ve seen in the Asus Zenbook 17 Fold OLED.

    Final Thoughts

    Jeff Pu has shared his insights through MacRumors, and it will be interesting to see if these predictions hold true as more information becomes available.

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  • Samsung’s Chip Exports to China Reach $44.6 Billion, Surpassing US

    Samsung’s Chip Exports to China Reach $44.6 Billion, Surpassing US

    Key Takeaways

    1. Samsung exported $44.6 billion in memory chips to China in 2023, exceeding exports to the US and marking a 53.9% increase from the previous year.
    2. China’s economic stimulus, injecting over $20 billion, has boosted demand for new gadgets, leading to higher memory chip purchases.
    3. Samsung focuses on older memory products for the Chinese market while reserving its latest high-bandwidth memory (HBM) for Western clients.
    4. Ongoing US chip sanctions may limit Samsung’s ability to sell advanced memory products in China, posing challenges to its growth.
    5. Samsung’s success in China relies on managing geopolitical tensions and adapting to evolving global trade regulations.


    Even if Samsung doesn’t have a strong presence in China’s smartphone sector, it has become a key supplier of memory chips there. A new report shows that the South Korean tech company exported $44.6 billion in chips to China in 2023. This amount surpassed the $42.1 billion it sent to the US, reflecting a significant increase of 53.9% compared to $28.9 billion from the year before.

    Economic Boosts Demand

    This sharp rise can be attributed to China’s robust economic stimulus, which injected over $20 billion into the market to encourage the purchase of new gadgets. As a result of this initiative, consumers have been replacing their old phones and home appliances at a quicker pace, increasing the demand for memory chips from suppliers such as Samsung and SK Hynix.

    Product Focus in China

    In the Chinese market, Samsung mainly supplies NAND flash, LPDDR memory, image sensors, and display driver ICs. Notably, the company employs a dual strategy: it concentrates on older memory products for China, while reserving its latest high-bandwidth memory (HBM) modules for Western clients, particularly in the US.

    Challenges Ahead

    Despite the positive developments, industry analysts caution that Samsung’s growth in China could be impacted by ongoing chip sanctions imposed by the US. These restrictions might soon prevent Samsung from selling some of its most advanced and profitable memory products in China.

    As US-China tensions escalate, semiconductor companies like Samsung face a more complex geopolitical landscape. While Samsung remains an essential component of China’s tech supply chain, its success largely depends on how effectively it adjusts to evolving global trade regulations.

    With China expected to continue its economic stimulus efforts and the semiconductor market poised for a rebound, Samsung could achieve even more favorable results in China—provided it can effectively manage the challenges brought on by international trade barriers.

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  • Huawei’s Kirin PC Chip Spotted: First Look at Self-Developed Tech

    Huawei’s Kirin PC Chip Spotted: First Look at Self-Developed Tech

    Key Takeaways

    1. Huawei is developing laptops running on HarmonyOS, with a potential launch delayed to 2025.
    2. The company is creating its own PC chip, the Kirin PC processor, expected to debut in early 2025.
    3. The Kirin X90 chip may use SMIC’s 7nm technology, limiting its competitiveness against Apple’s M-series and Qualcomm’s Snapdragon X series.
    4. The Kirin X90 is rumored to have an 8-core CPU, a 10-core graphics unit, and performance comparable to Apple’s M2 chip.
    5. The chip is expected to support 32GB of LPDDR5 memory, 2TB SSD storage, and include three USB-4 ports.


    Huawei has been developing laptops that run on HarmonyOS for some time, with a launch anticipated in 2025. Nevertheless, a recent report indicates that this timeline might have been delayed.

    Kirin PC Processor Development

    We’ve been aware for a while that Huawei is creating its own PC chip. A report from last year suggested that the Kirin PC processor could debut in early 2025. Coinciding with this speculation, a new chip called Kirin X90 has appeared on the China Information Security Evaluation Center’s radar.

    Specifications of Kirin X90

    The listing for the Kirin X90 doesn’t provide extensive details about its specifications. However, considering Huawei’s limited choices, it’s probable that it’s manufactured using SMIC’s 7nm technology. This suggests that it may not be able to compete with the performance levels of Apple’s newest M-series chips or Qualcomm’s Snapdragon X series.

    An earlier report hinted that, in terms of performance, the SoC is comparable to Apple’s M2 chip. It is rumored to be based on Huawei’s Taishan v130 architecture, featuring an 8-core CPU that could be clocked at 2.5GHz, likely its base speed. The graphics unit is said to be a 10-core component known as “Ma Liang 920”.

    Memory and Storage Capabilities

    The chip is anticipated to support as much as 32GB of LPDDR5-6400 memory on a 128-bit bus, providing 100GB/s of bandwidth. In terms of storage, it might accommodate up to 2TB of SSD capacity and include three USB-4 ports.

    Huawei’s venture into the PC processor market is significant, but whether its Kirin chip can genuinely compete on an international scale remains uncertain.


  • GMKtec Launches World’s First AMD Ryzen AI Max+ 395 Mini PC

    GMKtec Launches World’s First AMD Ryzen AI Max+ 395 Mini PC

    Key Takeaways

    1. GMKtec will launch the EVO-X2 mini PC with AMD Ryzen AI Max+ 395 on March 18, 2025.
    2. The design of the new Strix Point mini computer may resemble the EVO-X1 but could feature changes in connector arrangement for better cooling.
    3. Strix Halo mini PCs are expected to have a maximum TDP of up to 140 W, significantly higher than the EVO-X1’s 70 W.
    4. Performance for Strix Halo mini PCs is predicted to be much better than previous versions, with successful testing in 1440p gaming.
    5. High-end Strix Halo mini PCs may start at over $1,000, reflecting a premium pricing strategy similar to the Ryzen AI 9 HX 370 models.


    AMD officially introduced the Strix Halo series at CES 2025, and many brands have revealed plans for products equipped with the latest Zen 5 APUs, including several mini PCs. However, these compact devices have yet to become available, but it looks like the wait is almost over.

    Launch Announcement

    GMKtec has shared that it will unveil the ‘world’s first’ AMD Ryzen AI Max+ 395 mini PC, named the EVO-X2, in China on March 18, 2025. The announcement was somewhat vague regarding the specifics of the new Strix Point mini computer, but it did suggest that the overall design will closely resemble the EVO-X1, which is one of the tiniest mini PCs to feature the Ryzen AI 9 HX 370.

    Design and Layout Changes

    The promotional material also implies that there might be alterations to the connector arrangement, possibly due to a more powerful cooler. While this hasn’t been confirmed, it’s reported that mini PCs using this AMD Strix Halo APU may reach up to 140 W. For comparison, the EVO-X1 has a peak TDP of 70 W.

    Performance Expectations

    No matter the maximum TDP, the Strix Halo mini PCs are predicted to deliver a significant boost in performance compared to their Strix Point versions. Recently, ETA Prime tested a prototype mini PC with the Ryzen AI Max+ 395 and found it performed quite well in 1440p gaming, benefiting from the Radeon 8060S iGPU.

    Pricing Insights

    This indicates that the high-end Strix Halo mini PCs will be excellent choices for gaming systems without a discrete GPU, yet they are likely to come with a hefty price tag. For context, the Ryzen AI 9 HX 370 models were launched starting at over $900 (with the Minisforum AI370 currently priced at $935.99 on Amazon), hinting that the Ryzen AI Max+ 395 models could begin at over the $1,000 threshold.

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  • Kirin X90 Processor Leak: Huawei’s Upcoming PC Chip Details

    Kirin X90 Processor Leak: Huawei’s Upcoming PC Chip Details

    Key Takeaways

    1. Huawei’s HiSilicon division is developing a new processor to compete with Intel in the PC market.
    2. The new processor may use older 5nm or 7nm manufacturing processes but could still challenge Intel’s M3 chip.
    3. The chip is expected to feature a similar instruction set to ARM, akin to Apple’s M series chips.
    4. It will integrate DRAM technology, similar to advancements made by Apple and Intel.
    5. The processor, likely named Kirin X90, is expected to launch by the end of March 2025.


    As Intel continues to face various challenges, it appears that its products will encounter a fresh wave of competition from in-house chipsets developed by Huawei’s HiSilicon division.

    New Processor for PCs

    The new processor is rumored to be aimed at either desktop or laptop computers and is expected to feature a generic instruction set similar to ARM, which serves as the foundation for Apple’s growing M series chips. This could mean some interesting developments in the PC market.

    Production Technology and Competition

    While the upcoming HiSilicon offering may have to utilize older 5-nanometer (nm) or even 7nm manufacturing processes, it has reportedly posed a challenge to the M3 based on prior leaks. This indicates that even with older technology, it could still be competitive.

    Integration and Launch Timeline

    Additionally, it is believed that the new chip will incorporate DRAM, mirroring the advancements seen in modern chips from both Apple and Intel. Interestingly, it has been identified as a “CPU” in a recent leak, which features an official Chinese safety certification for such components, alongside certifications from other manufacturers like Longxin and Shentai Information Technology.

    The insider information also hints that it will be officially launched as the Kirin X90, potentially by the end of March 2025, according to Digital Chat Station on Weibo.

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  • Western Digital Launches 26TB Red Pro SATA NAS HDD for Storage

    Western Digital Launches 26TB Red Pro SATA NAS HDD for Storage

    Key Takeaways

    1. Western Digital has launched a 26 TB WD Red Pro hard drive specifically designed for network-attached storage (NAS) devices, priced at $569.99.
    2. Hard drives remain more affordable than solid-state drives for large data storage, but they can face mechanical failures over time.
    3. The WD Red Pro operates at 7200 rpm, has an MTBF rating of 2.5 million hours, and can handle 550 TB of data transfers annually with notable internal transfer rates.
    4. It features anti-vibration technology for RAID environments and uses conventional magnetic recording (CMR) for better data update speed.
    5. This release is part of Western Digital’s effort to enhance NAS storage solutions for creative professionals and improve workflow productivity.


    Western Digital has introduced the 26 TB 3.5-inch WD Red Pro hard drive (model WD260KFGX), which is specifically made for network-attached storage devices, like the Synology 4-bay DiskStation NAS available on Amazon. The suggested retail price for this drive is $569.99, and you can find it on Amazon right now.

    Affordability of Hard Drives

    Hard drives are still more affordable than solid-state drives when it comes to storing large quantities of data, such as 8K RAW videos from cameras, backups of 4K Ultra HD Blu-Ray discs, and countless adorable puppy photos. While hard drives can experience mechanical failures over time, multi-layer SSDs may face data loss sooner due to natural electron migration, particularly in high storage temperature conditions.

    Performance Features

    The 7200 rpm Red Pro is made for heavy-duty, always-on NAS tasks, boasting a mean time between failure (MTBF) rating of 2.5 million hours and a capability for 550 TB of data transfers per year. It offers a maximum internal transfer rate of 287 MB/s and a peak SATA interface transfer rate of 272 MB/s, thanks to the enhancements provided by OptiNAND technology.

    RAID Optimization and Reliability

    Designed to work effectively in a RAID environment, this SATA drive helps mitigate the risk of catastrophic data loss from a single drive failure. It incorporates anti-vibration technology that uses information from internal rotation vibration (RV) sensors to combat disruptive vibrations that could damage data.

    This drive operates at a standard 7,200 rpm speed, features a 512 MB cache, and utilizes conventional magnetic recording (CMR) instead of shingled magnetic recording (SMR), which is slower when it comes to updating data changes.

    You can purchase the WD 26 TB 3.5-inch WD Red Pro hard drive on Amazon.

    Western Digital’s Commitment

    Western Digital has expanded its storage solutions for NAS, catering to creative professionals and content makers with its 26TB high-capacity CMR HDDs. This expansion is part of their WD Red® Pro and G-DRIVE®/G-RAID® Professional product lines, aimed at enhancing data storage capabilities and improving workflow productivity.

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  • Intel Core i7-240H Benchmarks Show Similarity to i7-12800H

    Intel Core i7-240H Benchmarks Show Similarity to i7-12800H

    Key Takeaways

    1. Core 7 240H laptops are becoming the popular choice for midrange multimedia and gaming devices, potentially replacing the Core i7-12800H and i7-13700H models.
    2. The performance of the Core 7 240H is very similar to the Core i7-12800H and i7-13700H, with only a 5% difference in benchmarks.
    3. The Core 7 240H is built on the older Raptor Lake-H architecture, making it comparable in age to the i7-12800H.
    4. Power consumption for the Core 7 240H is inconsistent, showing throttling issues during stress testing, despite having the same performance cores as the i7-12800H.
    5. The Core 7 240H lacks integrated AI features found in the newer Core Ultra series, making upgrades less appealing for current users.


    Laptops featuring the Core 7 240H are increasingly becoming the preferred choice for midrange multimedia and gaming devices. It is anticipated that this processor will gradually take the place of models utilizing the Core i7-12800H or Core i7-13700H. However, those looking for a significant performance upgrade may find themselves let down based on our experience with the latest Asus V16.

    Performance Comparison

    Our benchmarks indicate that the Core 7 240H operates within a 5 percent range of the average Core i7-12800H or Core i7-13700H laptop in our records, even though the i7-12800H has been around for over three years. This newer Core 7 240H is still built on the older Raptor Lake-H architecture, which is just as dated as the i7-12800H.

    Power Consumption Insights

    When it comes to power usage, the answer is less clear-cut. Our initial retail sample of the Core 7 240H demonstrated throttling issues during Prime95 stress testing, leading to inconsistent consumption levels, as depicted in the graph below. The processor maintains the same number of performance cores as the i7-12800H but has only half the efficiency cores (4 compared to 8), while delivering roughly equivalent performance. Therefore, the differences in load performance should be negligible, although the Core 7 240H may offer slightly better efficiency for less demanding applications. While it’s distinct enough to not merely be a rebranding, the Core 7 240H still feels too much like its immediate Core i7 predecessors, making it hard for many current users to justify an upgrade, especially since it misses the integrated AI features found in the Core Ultra series.

  • Exclusive Lenovo ThinkPad Interview: Future of Repairable Laptops

    Exclusive Lenovo ThinkPad Interview: Future of Repairable Laptops

    Key Takeaways

    1. The ThinkPad brand, originally under IBM, was handed over to Lenovo in 2005, and it continues to evolve with new leadership and product innovations.
    2. The recent introduction of the ThinkPad X9, which lacks a TrackPoint, aims to attract new users while still offering models with the TrackPoint for long-time fans.
    3. Future laptop input may include more voice recognition features, but traditional keyboard and touchpad designs will remain central to ThinkPad’s approach.
    4. Lenovo emphasizes brand clarity with distinct naming conventions for ThinkPad series while maintaining strong brand recognition among consumers.
    5. Sustainability is a priority for Lenovo, focusing on durable products, repairability, and eco-friendly packaging to achieve carbon neutrality.


    On the market since 1992, the ThinkPad laptops have a rich history that began under IBM’s guidance. In 2005, IBM handed over the brand to Lenovo, a newcomer at the time, who has since continued to develop this line of enterprise laptops.

    Leadership Changes

    Recently, the ThinkPad team was still guided by veterans from IBM until the spring of 2024, when Tom Butler became the new Executive Director of Commercial Portfolio and Product Management. Tom joined Lenovo in 2005, shortly after the brand transitioned from IBM, and he started as a product manager for the Lenovo ThinkPad R60. Now, he is in charge of the whole ThinkPad lineup. During Lenovo’s MWC 2025 showcase, Notebookcheck’s Benjamin Herzig had a unique conversation with Tom.

    Thoughts on TrackPoint and Touchpad

    Notebookcheck: Lenovo has made headlines with the new premium ThinkPad X9, which does not have a TrackPoint. Are you more of a TrackPoint or touchpad user?

    Tom Butler: Let’s talk about the ThinkPad X9 first. We understand that some people were shocked by the absence of a TrackPoint. However, we want to reassure our users that we still have a range of ThinkPads featuring the TrackPoint. The X9 (available at Amazon) is meant to attract those who have not used a ThinkPad before.

    As for your question: I am a long-time TrackPoint user, but I also know that a good touchpad experience is essential for those who are not familiar with ThinkPads. I particularly find touchpad gestures helpful. So, to sum it up: Both!

    Future of Laptop Input

    Notebookcheck: The typical laptop input devices seem pretty established: touchpad plus keyboard. Do you foresee any major changes in this area?

    Tom Butler: I liken laptops to an upright piano—the display is like sheet music and the input, which in ThinkPad’s case includes the keyboard, touchpad, and TrackPoint, is at the front. As we approach the 33rd anniversary of the ThinkPad brand, our fundamental approach remains the same. The keyboard is crucial for how we interact with our PCs, and we invest significant effort in refining it. On a piano, you have the keyboard leading to music; on a laptop, it’s the keyboard interfacing with the screen.

    Regarding the future of laptop input, we must consider the possibilities of AI. This includes natural language processing. We expect more voice input, though it will likely be limited to private settings—people won’t be chatting with their laptops on planes or trains! (laughs) This is why we’re experimenting with prototypes to figure out how to incorporate these features into our designs.

    Branding in the Laptop Industry

    Notebookcheck: Branding is a hot topic right now. One competitor has eliminated their laptop brand names. Are brand names becoming less significant, replaced by simple “good, better, best” labels?

    Tom Butler: We take a traditional and straightforward approach. Each ThinkPad series, like T, L, or E, has a specific name along with screen sizes for clarity—T14, T16, and so forth. We also add a generational label for logical tracking. Currently, we are not planning any changes. Lenovo has strong brand equity, and our sub-brands like ThinkPad, ThinkBook, and Lenovo Yoga are well recognized by consumers.

    Commitment to Sustainability

    Notebookcheck: You’ve made strides in sustainability with recycled materials and plastic-free packaging, and improved repairability in models like the ThinkPad T series. Could selling replacement parts become a new business model?

    Tom Butler: Sustainability is a key focus for us in our journey toward carbon neutrality—Lenovo’s overarching goal. To achieve that, we aim for more sustainable products and avoid forcing a replacement cycle. Part of this involves developing durable systems that last longer and offer repairability to extend their lifecycle. If our customers are satisfied, they will return for more, even if it takes a bit longer.

    We are leading in repairability, offering replaceable keyboards and batteries, along with easy-to-remove screws. At trade shows like MWC, we showcase our open products to highlight their repairable features. This leadership extends to our packaging, as we’ve eliminated plastic, even down to stickers and ties, which is incredibly important.

    The Future of Thin Laptops

    Notebookcheck: Thinner laptops were a major trend in the 2010s. Do customers still want that, or is it a thing of the past?

    Tom Butler: When we ask customers, they prioritize high battery life, performance, lightweight, and a slim design. However, these demands often compete with one another—a larger battery and better cooling lead to a heavier and thicker device. We strive for the right balance.

    Regarding the Z height, we’ve reached a point where the current thickness is generally acceptable. This is partly due to features like the HDMI port, which is standard on our newer models. Although some devices like the ThinkPad Z series or ThinkPad X1 Nano utilize USB-C only, we’ve received substantial feedback indicating the need for HDMI. Since many conference rooms globally have HDMI connectors, a certain thickness is necessary for that feature, which means we won’t be going significantly thinner for now. However, we still aim to provide more value, focusing on reducing weight with products like the new ThinkPad X13 Gen 6 and ThinkPad X1 Carbon Gen 13 Aura Edition.

    Personal Favorite ThinkPad

    Notebookcheck: Lastly, do you have a favorite ThinkPad?

    Tom Butler: Oh man! That’s a tough choice. Reflecting on the ThinkPad history, the ThinkPad X300 marked a significant shift for us. It was like a proto-Ultrabook back in its day, and it’s definitely among my favorites. I also have a fondness for our ultraportables, particularly the 12-inch devices from the X200 series. That form factor was ideal for frequent travelers, fitting well in small regional jets. A standout example for me is the ThinkPad X240s, a Japan-exclusive model I had, which was extremely lightweight. The modern equivalent would be the ThinkPad X13, though I also love the X1 Carbon, naturally.

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