Tag: HiSilicon

  • SK Hynix Engineer Indicted for Stealing HBM Tech for Huawei Firm

    SK Hynix Engineer Indicted for Stealing HBM Tech for Huawei Firm

    Key Takeaways

    1. A former SK Hynix engineer, Kim, was arrested for allegedly stealing sensitive semiconductor information to share with HiSilicon, linked to Huawei.
    2. Kim collected around 11,000 pages of proprietary information, including plans for CMOS sensors and HBM production methods, after receiving a job offer from HiSilicon.
    3. The stolen information involved hybrid bonding technology, crucial for enhancing bandwidth and energy efficiency in future high-bandwidth memory.
    4. Kim is facing serious legal consequences under South Korea’s industrial technology protection laws, with potential prison sentences of up to ten years and fines.
    5. This case highlights a worrying trend of intellectual property theft aimed at Chinese companies, prompting South Korean authorities to strengthen protections for domestic innovations.


    A former engineer from SK Hynix has been arrested and officially charged for allegedly taking advanced semiconductor information, particularly regarding next-generation high-bandwidth memory (HBM) packaging methods, and trying to share it with HiSilicon, a company linked to Huawei. The prosecutors label this technology as a “future growth engine” for South Korea’s chip industry.

    Employee’s Actions

    The Seoul Central District Prosecutors’ Office reported that the individual, referred to as Kim, was employed at SK Hynix’s branch in China. He reportedly started collecting sensitive documents after he received a job offer from HiSilicon. Investigators claim Kim printed internal documents, erased their security labels, and took photos of around 11,000 pages of proprietary information, which included confidential plans for complementary metal-oxide-semiconductor (CMOS) image sensors and steps for HBM production.

    Details of the Stolen Information

    The stolen documents allegedly included information on hybrid bonding, a stacking method being examined by both SK Hynix and Samsung for future HBM versions. Hybrid bonding can reduce die size while significantly enhancing bandwidth and energy efficiency—features considered essential for artificial-intelligence accelerators and other demanding tasks.

    Legal Consequences

    Kim’s scheme began falling apart earlier this month. Investigators in industrial technology monitored his actions for several months and apprehended him at Incheon International Airport just before he was about to leave. He is now facing charges under South Korea’s Act on Prevention of Divulgence and Protection of Industrial Technology, which can impose prison sentences up to ten years and fines approximating $71,000; even stricter penalties apply when “strategic sectors” like semiconductors are involved.

    Authorities indicate that this case is part of a broader trend of attempted intellectual-property transfers to Chinese companies, referencing previous incidents with Samsung. Prosecutors have committed to a “stern response” to protect domestic innovations and the nation’s economic interests as the demand for advanced memory technologies grows.

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  • Kirin X90 Processor Leak: Huawei’s Upcoming PC Chip Details

    Kirin X90 Processor Leak: Huawei’s Upcoming PC Chip Details

    Key Takeaways

    1. Huawei’s HiSilicon division is developing a new processor to compete with Intel in the PC market.
    2. The new processor may use older 5nm or 7nm manufacturing processes but could still challenge Intel’s M3 chip.
    3. The chip is expected to feature a similar instruction set to ARM, akin to Apple’s M series chips.
    4. It will integrate DRAM technology, similar to advancements made by Apple and Intel.
    5. The processor, likely named Kirin X90, is expected to launch by the end of March 2025.


    As Intel continues to face various challenges, it appears that its products will encounter a fresh wave of competition from in-house chipsets developed by Huawei’s HiSilicon division.

    New Processor for PCs

    The new processor is rumored to be aimed at either desktop or laptop computers and is expected to feature a generic instruction set similar to ARM, which serves as the foundation for Apple’s growing M series chips. This could mean some interesting developments in the PC market.

    Production Technology and Competition

    While the upcoming HiSilicon offering may have to utilize older 5-nanometer (nm) or even 7nm manufacturing processes, it has reportedly posed a challenge to the M3 based on prior leaks. This indicates that even with older technology, it could still be competitive.

    Integration and Launch Timeline

    Additionally, it is believed that the new chip will incorporate DRAM, mirroring the advancements seen in modern chips from both Apple and Intel. Interestingly, it has been identified as a “CPU” in a recent leak, which features an official Chinese safety certification for such components, alongside certifications from other manufacturers like Longxin and Shentai Information Technology.

    The insider information also hints that it will be officially launched as the Kirin X90, potentially by the end of March 2025, according to Digital Chat Station on Weibo.

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