Key Takeaways
1. TSMC is advancing quickly in semiconductor manufacturing, moving towards 1.4nm production while 2nm chips are not yet widespread.
2. The company plans to build four new factories, with the first expected to be operational by the end of 2027 and mass production starting in late 2028.
3. TSMC’s progress comes as competitors Intel and Samsung reassess their manufacturing plans, with Intel potentially halting its 1.4nm development and Samsung delaying its targets to 2029.
4. The current market is primarily using 3nm technology, with TSMC’s 3nm process being utilized in various CPUs from Intel and Apple.
5. New semiconductor nodes typically debut in mobile chips, with the upcoming Galaxy S26 series set to use the 2nm process for its Exynos 2600 CPU.
The race in semiconductor manufacturing is moving swiftly, and TSMC, the leading company in this field, is eager to further solidify its dominance. Although 2nm chips haven’t seen widespread use yet, it appears that TSMC is already pushing ahead with its 1.4nm production process. New factories dedicated to this advanced technology might be established as soon as next year, with plans for mass production to commence the following year.
Breakthrough in Manufacturing
According to UDN (translated by machines), TSMC has achieved a significant advancement in its 1.4nm production, enabling a quicker ramp-up of output, which begins with the construction of new factories. The company is set to build four facilities, with the first expected to be operational by the end of 2027 after its risk trial production is completed. This indicates that mass production could kick off in the latter half of 2028. TSMC has also reportedly notified its suppliers to get ready with the essential equipment for the 1.4nm production setup.
Production Phases and Future Plans
Among the four factories in the plans, two will initiate mass production of the new node in 2028 as part of the initial phase. In the second phase, the other two factories could potentially be utilized for an even more advanced 1nm manufacturing process.
This significant progress for TSMC arrives at a moment when rivals like Intel and Samsung are reevaluating their manufacturing roadmaps. Intel is considering halting its A14, the 1.4nm process development, while Samsung has delayed its 1.4nm targets to 2029 to improve yields with their 2nm process.
Current Market Landscape
However, the existing PC market is still primarily operating on the 3nm manufacturing process, with 2nm technology still absent. Intel’s Arrow Lake and Lunar Lake CPUs utilize TSMC’s 3nm process, whereas Apple’s latest M4 platform is built on TSMC’s N3E process, which is the second generation of 3nm. Generally, new nodes are first implemented in mobile chips before they reach mainstream desktop computing. The Exynos 2600, set to power the upcoming Galaxy S26 series, will be the first mobile CPU utilizing this process. Similarly, while Apple’s soon-to-be-released iPhone 17 series is expected to maintain the 3nm process, the iPhone 18 series equipped with the A20 SoC will likely transition to 2nm technology.
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