Tag: TSMC

  • TSMC’s 2nm Process Costs Over $30,000 Per Wafer

    TSMC’s 2nm Process Costs Over $30,000 Per Wafer

    The next major development for TSMC is its future N2 manufacturing process. As of early October, this technology is still under development, but an article from Commercial Times reveals potential costs associated with producing chips using this advanced method.

    Cost of N2 Technology

    The information suggests that creating a single 300-mm wafer with N2 technology will exceed $30,000. This is a significant amount, especially compared to past processes.

    In comparison, wafers made with N3 technology (commonly known as the 3nm process) are priced at around $18,500. Older technologies like N4 and N5 are even cheaper, costing about $15,000 each. This indicates that the expense of utilizing the upcoming N2 technology could be nearly double that of the N4 and N5 processes.

    Benefits of N2 Technology

    The increased costs might be largely justified by the various advantages the new technology promises to deliver. As reported by Tom’s Hardware, the 2nm process is expected to be highly efficient, boasting over 25% lower energy usage compared to N3E.

    It is important to mention that these figures are not officially provided by TSMC, so they should be viewed with caution. Additionally, pricing may fluctuate based on several factors, including order size and customer needs.

    Potential Early Adopters

    Apple is likely to be one of the first companies to adopt N2 technology. This includes the M5 series chips for devices like iPads, Mac minis, iMacs, and MacBooks, as well as the next A-series chips for iPhones. Other companies such as Qualcomm, Intel, AMD, Mediatek, and Nvidia may join later on in the process.

    Commercial Times (in Chinese) via Tom’s Hardware

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  • Qualcomm Snapdragon 8 Gen 5 May Have Huge Clock Speed Boost

    Qualcomm Snapdragon 8 Gen 5 May Have Huge Clock Speed Boost

    With the Qualcomm Snapdragon 8 Gen 4 set to debut later this month, we have gathered substantial information about its specifications through various Geekbench listings and leaks. A well-known leaker on Weibo has now shed some light on its successor, the Snapdragon 8 Gen 5.

    Improved Performance Specs

    The Snapdragon 8 Gen 5 will maintain the same 2+6 core layout as its predecessor. However, the performance cores (codenamed Pegasus) are expected to reach clock speeds of 5.0 GHz, while the efficiency cores will run at 4.0 GHz. These speeds are notably higher compared to the Snapdragon 8 Gen 4, which features performance and efficiency cores clocked at 4.32 GHz and 3.53 GHz, respectively.

    Manufacturing Details

    It’s important to note that only the Snapdragon 8 Gen 5 produced on TSMC’s N3P node will achieve the aforementioned clock speeds. Previous rumors indicated that Qualcomm intended to source its flagship SoCs from both TSMC and Samsung Foundry.

    The standard Snapdragon 8 Gen 5 will be fabricated on a TSMC process, whereas the Snapdragon 8 Gen 5 designed for Galaxy devices will utilize Samsung’s SF2 process. Currently, the clock speeds for the latter remain unknown, but if SF2 lives up to its reputation, it may either match or even surpass the performance of its TSMC counterpart.

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  • Apple Orders A16 SoC Production at TSMC US Plant

    Apple Orders A16 SoC Production at TSMC US Plant

    TSMC has begun production of Apple’s mobile chips in Arizona, but they aren’t the models you might expect.

    Taiwan Semiconductor Manufacturing Company Limited (TSMC) has officially opened its new chip fabrication facility in the U.S. Based in Arizona, one of the top semiconductor producers has already started making its first chips. Interestingly, these are not the latest models but rather the iPhone chips from two generations back.

    Production of A16 SoC

    The Arizona facility has commenced the manufacturing of Apple’s A16 System on a Chip (SoC), which was first introduced with the iPhone 14 Pro and iPhone 14 Pro Max. These devices are now two years old and can be found refurbished on Amazon for $679.95, having originally hit the market in 2022.

    The A16 chips produced in Arizona utilize the same N4P process as those from the main facility in Taiwan, as reported by Tim Culpan. While it may seem unusual for Apple to request chips for a two-year-old device, it’s important to note that the A16 also powers the iPhone 15 and iPhone 15 Plus. However, there could be additional reasons behind Apple’s order for these new chips.

    Speculations on Future Devices

    The commencement of this production has sparked speculation that the upcoming iPhone SE 4, which is rumored to adopt the design of the iPhone 14, might be equipped with the A16 chips being manufactured in Arizona. There are also hints that a new iPad Mini could be another potential recipient of the silicon made in the U.S.

    The U.S. government has been investing significantly to promote the establishment of semiconductor manufacturing plants within the country. With Apple producing an SoC for an upcoming iPhone or iPad, this move is likely to boost domestic manufacturing efforts even further.

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  • Explosion at TSMC Phoenix: Facility Remains Undamaged

    Explosion at TSMC Phoenix: Facility Remains Undamaged

    A reported explosion at the Taiwan Semiconductor Manufacturing Company (TSMC) facility in Phoenix on Wednesday raised concerns. However, the company clarified that there were no injuries or damage to the facility.

    The incident involved a waste disposal truck, and the driver was taken to the hospital. TSMC confirmed that no employees or construction workers were harmed. Firefighters responded swiftly, but additional details from fire officials have yet to be released.

    TSMC's Role in the Industry

    TSMC is a critical player in the global semiconductor market. Recently, the company received a substantial $6.6 billion grant under the CHIPS and Science Act from the Biden administration.

    In an effort to enhance chip manufacturing capabilities in the United States, TSMC has been expanding its operations beyond Taiwan. These expansions include new facilities in Japan, Germany, and notably, Arizona in the USA, where the Phoenix campus is situated.

    Arizona Expansion and Challenges

    The Arizona project is part of TSMC’s broader strategy to bring advanced chip manufacturing to the U.S., promising to create thousands of jobs in both the manufacturing and construction sectors. However, the project has encountered hurdles, such as initial construction delays due to safety concerns from local unions and objections to the inclusion of workers from Taiwan.

    Despite these issues, Arizona's importance in the semiconductor industry has been growing, with investments in the state surpassing $100 billion since the CHIPS Act was introduced.

    Future Plans and Market Response

    The incident at the TSMC Arizona site occurs at a crucial time, as the company recently announced an additional $25 billion investment, bringing their total commitment to $65 billion. This includes plans to add a third factory by 2030, demonstrating TSMC's dedication to U.S.-based production.

    Technological advancements are also in the pipeline, with the second Arizona factory slated to produce the world's most advanced 2-nanometer technology, expected to commence production in 2028.

    Initially, the market response to the incident was mixed, with TSMC's shares rising before paring gains upon the news. Nevertheless, the company remains positive about its expansion plans and technological progress, despite this temporary setback.

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  • TSMC Developing Advanced Chip Packaging for Apple M4

    TSMC Developing Advanced Chip Packaging for Apple M4

    TSMC recently won four high-profile customers for its latest SoIC packaging technology – AMD, Nvidia, Broadcom and Apple. As the semiconductor producer ramps up production capacity for CoWoS chip packaging technology.

    Apple Explores Advanced Packaging Solutions

    Apple is said to be exploring SoIC combined with Hybrid molding technology – which integrates thermoplastic carbon fiber board composite molding – for mass production by 2025. They currently are engaged in limited trial production phase but plan to ramp up mass production as early as 2019. They anticipate using this cutting-edge packaging approach with their forthcoming AI chip or M4 chip from Apple.

    TSMC’s SoIC technology represents an innovative high-density 3D chip stacking method for accommodating chips with different sizes through Chip-on-Wafer packaging. First introduced in 2018, SoIC will soon become one of the key elements at an advanced packaging facility planned in Chiayi, Taiwan which will feature both CoWoS plants as well as its SoIC facility.

    AMD Adopts SoIC Technology

    AMD was the pioneering client to embrace SoIC technology with CoWoS for data center AI accelerator chips; their Instinct MI300 AI Accelerators utilized these methods.

    Mark Gurman reports that Apple has officially begun development on an M4 chip destined to appear in their next-gen MacBook Pro laptops. TrendForce suggests Apple could switch over to 2nm process nodes with this chip design.

    Historical patterns for Apple Silicon releases suggest roughly one and a half year intervals between each version, such as November 2020 for M1, June 2022 for M2 and late October for M3. Therefore it seems plausible that they would reveal M4 by first half of next year.

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  • NVIDIA chip supply stable despite Taiwan 7.5-magnitude quake

    NVIDIA chip supply stable despite Taiwan 7.5-magnitude quake

    After the recent 7.5-magnitude earthquake near Taiwan, concerns have arisen about potential disruptions to the global chip supply chain. Taiwan plays a significant role in semiconductor manufacturing, leading to speculations about the status of semiconductor factories post-earthquake. However, NVIDIA, a prominent player in the AI industry, has reassured stakeholders that its chip supply remains unaffected.

    NVIDIA Confirms Unharmed Chip Supply

    US-based NVIDIA, a company heavily dependent on Taiwan Semiconductor Manufacturing Co. (TSMC) for chip production, has stated that the earthquake did not impact its supply chain in Taiwan. TSMC, known for producing chips for tech giants like Apple, AMD, Qualcomm, and NVIDIA, has reported no damage to crucial chip-making equipment, including the Extreme Ultraviolet Lithography machines.

    Despite some tools being affected at specific TSMC facilities, the core machinery remains unscathed. As a precautionary measure, TSMC temporarily evacuated certain production facilities to ensure employee safety. However, operations resumed at 70-80% capacity within just 10 hours after the earthquake.

    TSMC's Preparedness and Resilience

    TSMC attributes its quick operational recovery to preparedness for such incidents. Utilizing building dampers and conducting regular earthquake drills, TSMC mitigates seismic activity's impact on semiconductor production.

    Semiconductor manufacturing demands precise, uninterrupted processes in controlled settings. Even minor disruptions can lead to significant losses, such as discarding entire silicon wafers. TSMC's earthquake readiness and protective measures have proven vital in safeguarding its production line.

    Importance of TSMC to NVIDIA

    TSMC serves as NVIDIA's primary chip manufacturer, providing cutting-edge semiconductor technology. NVIDIA relies on TSMC's advanced manufacturing processes for high-performance GPUs, including the latest Blackwell architecture models.

    The collaboration between NVIDIA and TSMC ensures efficient chip designs and supply. Beyond GPUs, TSMC contributes essential semiconductor technologies crucial for NVIDIA's products. This partnership guarantees a dependable chip supply, essential for meeting market demands and sustaining NVIDIA's competitive edge.

    TSMC holds the largest global market share in chip manufacturing. Any disruption to TSMC would not only impact NVIDIA but also other top AI and tech firms, potentially disrupting their chip production and supply chains. Any threat to TSMC poses a concern for NVIDIA and the broader tech industry, potentially hampering global technological advancements.

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  • Taiwan earthquake impacts TSMC chip production, prices may increase

    Taiwan earthquake impacts TSMC chip production, prices may increase

    A powerful earthquake recently struck Taiwan, causing concerns within the tech industry regarding potential disruptions to global chip production. The 7.4-magnitude tremor, the strongest in decades for the island nation, led Taiwan Semiconductor Manufacturing Company (TSMC), a major chipmaker, to evacuate some of its factory personnel.

    Chip Shortage Concerns Post Taiwan Earthquake

    While TSMC has confirmed the safety of its workers and initial inspections suggest no significant damage, a comprehensive evaluation is currently ongoing. The company's safety measures prompted evacuations, possibly resulting in production delays.

    This development comes amidst a period where the world is already facing a chip shortage. The COVID-19 pandemic exposed vulnerabilities in the global supply chain, resulting in a shortage of semiconductors essential for various devices, from smartphones to high-performance computers. Any interruptions in TSMC's operations, being the largest contract chipmaker globally, could further stress the already strained supply chain.

    Potential Impact on Tech Giants and Consumers

    The repercussions on leading tech companies like Apple and NVIDIA, which heavily rely on TSMC for their chips, are yet to be determined. Nevertheless, an extended disruption could lead to increased prices for consumers as chip scarcity deepens.

    The earthquake underscores the risks associated with depending heavily on a single region for chip manufacturing. Taiwan's geographic location along a major fault line makes it susceptible to frequent earthquakes. Calls for diversifying manufacturing sites have been strengthening in recent times, particularly given the ongoing tensions between Taiwan and China.

    While the immediate aftermath of the earthquake seems limited, the tech industry closely monitors TSMC's assessment of the situation. Any production setbacks could worsen the existing chip shortage, impacting consumers globally.

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  • TSMC Arizona Factory Accelerates Apple Chip Production Timeline

    TSMC Arizona Factory Accelerates Apple Chip Production Timeline

    TSMC, the renowned Taiwan Semiconductor Manufacturing Company, is making significant strides at its Arizona factory. Recent reports indicate that the factory is operating at full throttle, with plans to initiate trial production for its inaugural production line by mid-April this year. If operations proceed smoothly, the mass production of Apple chips might even be advanced to the end of 2024, a notable improvement from the initial target of the first half of 2025.

    TSMC's Accelerated Progress

    TSMC, often dubbed the "world's largest chipmaker," holds a pivotal role in the tech industry. While they aren't the designers of the devices we interact with daily, they are the masterminds behind the essential semiconductor chips that power a myriad of electronic gadgets, ranging from smartphones and laptops to gaming consoles and automobiles.

    Financial Report Conference Call

    Scheduled for April 18th, TSMC's financial report conference call is eagerly awaited by industry enthusiasts. The company's recent announcement on April 1st regarding the expedited construction of the Arizona facility has generated considerable excitement. As trial production looms closer, the pace of developments at TSMC's factory underscores a sense of rapid progress within the organization, setting the stage for potentially earlier production milestones, a prospect likely to be a focal point during the forthcoming financial report conference.

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  • TSMC Responds to Escalating Demand by Expanding 3nm Chip Production

    TSMC Responds to Escalating Demand by Expanding 3nm Chip Production

    TSMC, the world’s leading chipmaker, is reportedly ramping up production of its advanced 3nm chips. The expansion is said to be done due to the increased demand from tech giants seeking cutting-edge processors for their products.

    Increased Demand for 3nm Chips

    In 2023, Apple was TSMC’s primary customer for 3nm chips, utilized in its iPhone 15 Pro smartphones. However, major players like Qualcomm, MediaTek, NVIDIA, and Intel have since expressed interest and placed orders.

    Meeting the Demand

    To accommodate this influx, TSMC is reportedly eyeing to boost its monthly 3nm wafer production to 100,000 units by 2024. The company is also making efforts to improve its production yields for higher efficiency.

    Improved Second-Generation Process

    The initial version of TSMC’s 3nm process (N3B) reportedly faced yield challenges and carried a high cost. These factors may have deterred some companies from adopting the technology in its early stages. However, TSMC’s improved second-generation 3nm process (N3E) will offer better performance while being affordable. This has likely led to an increase in client interest, which in turn means demand.

    This year will likely see heightened competition in the semiconductor market as major tech companies begin releasing their first 3nm-powered devices.

    Whether TSMC can successfully meet this surging demand, while addressing potential production challenges, will significantly impact the success of these upcoming devices and the companies behind them.

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  • TSMC and Toyota Prepare for $5.26 Billion Investment in New Semiconductor Plant in Japan

    TSMC and Toyota Prepare for $5.26 Billion Investment in New Semiconductor Plant in Japan

    TSMC Announces Construction of Second Semiconductor Plant in Japan

    Taiwan Semiconductor Manufacturing Co (TSMC) is set to make a significant advancement in Japan with the announcement of the construction of a second semiconductor plant. This move, backed by new investor Toyota Motor Corp, will bring about a major shift in the global chip manufacturing landscape.

    Expansion in Kumamoto Prefecture

    TSMC, globally recognized as the leading contract chip maker, is expanding its presence in Kumamoto Prefecture, Japan. This strategic initiative aligns with Prime Minister Fumio Kishida’s vision of enhancing Japan’s semiconductor production capabilities.

    Collaboration with Toyota

    The collaboration between TSMC and Toyota is a notable cross-industry effort to strengthen the semiconductor supply chain, a critical component for various technologies ranging from vehicles to smartphones. The investment for the new facility is capped at US$5.26 billion, with a focus on advancing semiconductor technology through the addition of 6- and 7-nanometre process technologies at the new site.

    Commitment to Innovation and Job Creation

    The construction of the new plant is scheduled to begin later this year and is expected to be operational by 2027. This project goes beyond manufacturing expansion; it represents a commitment to innovation and technological advancement. The new facility has the potential to produce over 100,000 12-inch wafers monthly and create more than 3,400 high-tech jobs.

    Addressing Semiconductor Supply Chain Challenges

    This development comes at a time when countries are increasingly aware of the need for a robust semiconductor supply chain. Recent global shortages have highlighted the impact on industries such as automotive and consumer electronics. The construction of the second semiconductor plant in Japan by TSMC, with the support of Toyota, aims to address these challenges and strengthen the global chip manufacturing ecosystem.

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