Tag: TSMC

  • TSMC Developing Advanced Chip Packaging for Apple M4

    TSMC Developing Advanced Chip Packaging for Apple M4

    TSMC recently won four high-profile customers for its latest SoIC packaging technology – AMD, Nvidia, Broadcom and Apple. As the semiconductor producer ramps up production capacity for CoWoS chip packaging technology.

    Apple Explores Advanced Packaging Solutions

    Apple is said to be exploring SoIC combined with Hybrid molding technology – which integrates thermoplastic carbon fiber board composite molding – for mass production by 2025. They currently are engaged in limited trial production phase but plan to ramp up mass production as early as 2019. They anticipate using this cutting-edge packaging approach with their forthcoming AI chip or M4 chip from Apple.

    TSMC’s SoIC technology represents an innovative high-density 3D chip stacking method for accommodating chips with different sizes through Chip-on-Wafer packaging. First introduced in 2018, SoIC will soon become one of the key elements at an advanced packaging facility planned in Chiayi, Taiwan which will feature both CoWoS plants as well as its SoIC facility.

    AMD Adopts SoIC Technology

    AMD was the pioneering client to embrace SoIC technology with CoWoS for data center AI accelerator chips; their Instinct MI300 AI Accelerators utilized these methods.

    Mark Gurman reports that Apple has officially begun development on an M4 chip destined to appear in their next-gen MacBook Pro laptops. TrendForce suggests Apple could switch over to 2nm process nodes with this chip design.

    Historical patterns for Apple Silicon releases suggest roughly one and a half year intervals between each version, such as November 2020 for M1, June 2022 for M2 and late October for M3. Therefore it seems plausible that they would reveal M4 by first half of next year.

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  • NVIDIA chip supply stable despite Taiwan 7.5-magnitude quake

    NVIDIA chip supply stable despite Taiwan 7.5-magnitude quake

    After the recent 7.5-magnitude earthquake near Taiwan, concerns have arisen about potential disruptions to the global chip supply chain. Taiwan plays a significant role in semiconductor manufacturing, leading to speculations about the status of semiconductor factories post-earthquake. However, NVIDIA, a prominent player in the AI industry, has reassured stakeholders that its chip supply remains unaffected.

    NVIDIA Confirms Unharmed Chip Supply

    US-based NVIDIA, a company heavily dependent on Taiwan Semiconductor Manufacturing Co. (TSMC) for chip production, has stated that the earthquake did not impact its supply chain in Taiwan. TSMC, known for producing chips for tech giants like Apple, AMD, Qualcomm, and NVIDIA, has reported no damage to crucial chip-making equipment, including the Extreme Ultraviolet Lithography machines.

    Despite some tools being affected at specific TSMC facilities, the core machinery remains unscathed. As a precautionary measure, TSMC temporarily evacuated certain production facilities to ensure employee safety. However, operations resumed at 70-80% capacity within just 10 hours after the earthquake.

    TSMC's Preparedness and Resilience

    TSMC attributes its quick operational recovery to preparedness for such incidents. Utilizing building dampers and conducting regular earthquake drills, TSMC mitigates seismic activity's impact on semiconductor production.

    Semiconductor manufacturing demands precise, uninterrupted processes in controlled settings. Even minor disruptions can lead to significant losses, such as discarding entire silicon wafers. TSMC's earthquake readiness and protective measures have proven vital in safeguarding its production line.

    Importance of TSMC to NVIDIA

    TSMC serves as NVIDIA's primary chip manufacturer, providing cutting-edge semiconductor technology. NVIDIA relies on TSMC's advanced manufacturing processes for high-performance GPUs, including the latest Blackwell architecture models.

    The collaboration between NVIDIA and TSMC ensures efficient chip designs and supply. Beyond GPUs, TSMC contributes essential semiconductor technologies crucial for NVIDIA's products. This partnership guarantees a dependable chip supply, essential for meeting market demands and sustaining NVIDIA's competitive edge.

    TSMC holds the largest global market share in chip manufacturing. Any disruption to TSMC would not only impact NVIDIA but also other top AI and tech firms, potentially disrupting their chip production and supply chains. Any threat to TSMC poses a concern for NVIDIA and the broader tech industry, potentially hampering global technological advancements.

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  • Taiwan earthquake impacts TSMC chip production, prices may increase

    Taiwan earthquake impacts TSMC chip production, prices may increase

    A powerful earthquake recently struck Taiwan, causing concerns within the tech industry regarding potential disruptions to global chip production. The 7.4-magnitude tremor, the strongest in decades for the island nation, led Taiwan Semiconductor Manufacturing Company (TSMC), a major chipmaker, to evacuate some of its factory personnel.

    Chip Shortage Concerns Post Taiwan Earthquake

    While TSMC has confirmed the safety of its workers and initial inspections suggest no significant damage, a comprehensive evaluation is currently ongoing. The company's safety measures prompted evacuations, possibly resulting in production delays.

    This development comes amidst a period where the world is already facing a chip shortage. The COVID-19 pandemic exposed vulnerabilities in the global supply chain, resulting in a shortage of semiconductors essential for various devices, from smartphones to high-performance computers. Any interruptions in TSMC's operations, being the largest contract chipmaker globally, could further stress the already strained supply chain.

    Potential Impact on Tech Giants and Consumers

    The repercussions on leading tech companies like Apple and NVIDIA, which heavily rely on TSMC for their chips, are yet to be determined. Nevertheless, an extended disruption could lead to increased prices for consumers as chip scarcity deepens.

    The earthquake underscores the risks associated with depending heavily on a single region for chip manufacturing. Taiwan's geographic location along a major fault line makes it susceptible to frequent earthquakes. Calls for diversifying manufacturing sites have been strengthening in recent times, particularly given the ongoing tensions between Taiwan and China.

    While the immediate aftermath of the earthquake seems limited, the tech industry closely monitors TSMC's assessment of the situation. Any production setbacks could worsen the existing chip shortage, impacting consumers globally.

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  • TSMC Arizona Factory Accelerates Apple Chip Production Timeline

    TSMC Arizona Factory Accelerates Apple Chip Production Timeline

    TSMC, the renowned Taiwan Semiconductor Manufacturing Company, is making significant strides at its Arizona factory. Recent reports indicate that the factory is operating at full throttle, with plans to initiate trial production for its inaugural production line by mid-April this year. If operations proceed smoothly, the mass production of Apple chips might even be advanced to the end of 2024, a notable improvement from the initial target of the first half of 2025.

    TSMC's Accelerated Progress

    TSMC, often dubbed the "world's largest chipmaker," holds a pivotal role in the tech industry. While they aren't the designers of the devices we interact with daily, they are the masterminds behind the essential semiconductor chips that power a myriad of electronic gadgets, ranging from smartphones and laptops to gaming consoles and automobiles.

    Financial Report Conference Call

    Scheduled for April 18th, TSMC's financial report conference call is eagerly awaited by industry enthusiasts. The company's recent announcement on April 1st regarding the expedited construction of the Arizona facility has generated considerable excitement. As trial production looms closer, the pace of developments at TSMC's factory underscores a sense of rapid progress within the organization, setting the stage for potentially earlier production milestones, a prospect likely to be a focal point during the forthcoming financial report conference.

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  • TSMC Responds to Escalating Demand by Expanding 3nm Chip Production

    TSMC Responds to Escalating Demand by Expanding 3nm Chip Production

    TSMC, the world’s leading chipmaker, is reportedly ramping up production of its advanced 3nm chips. The expansion is said to be done due to the increased demand from tech giants seeking cutting-edge processors for their products.

    Increased Demand for 3nm Chips

    In 2023, Apple was TSMC’s primary customer for 3nm chips, utilized in its iPhone 15 Pro smartphones. However, major players like Qualcomm, MediaTek, NVIDIA, and Intel have since expressed interest and placed orders.

    Meeting the Demand

    To accommodate this influx, TSMC is reportedly eyeing to boost its monthly 3nm wafer production to 100,000 units by 2024. The company is also making efforts to improve its production yields for higher efficiency.

    Improved Second-Generation Process

    The initial version of TSMC’s 3nm process (N3B) reportedly faced yield challenges and carried a high cost. These factors may have deterred some companies from adopting the technology in its early stages. However, TSMC’s improved second-generation 3nm process (N3E) will offer better performance while being affordable. This has likely led to an increase in client interest, which in turn means demand.

    This year will likely see heightened competition in the semiconductor market as major tech companies begin releasing their first 3nm-powered devices.

    Whether TSMC can successfully meet this surging demand, while addressing potential production challenges, will significantly impact the success of these upcoming devices and the companies behind them.

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  • TSMC and Toyota Prepare for $5.26 Billion Investment in New Semiconductor Plant in Japan

    TSMC and Toyota Prepare for $5.26 Billion Investment in New Semiconductor Plant in Japan

    TSMC Announces Construction of Second Semiconductor Plant in Japan

    Taiwan Semiconductor Manufacturing Co (TSMC) is set to make a significant advancement in Japan with the announcement of the construction of a second semiconductor plant. This move, backed by new investor Toyota Motor Corp, will bring about a major shift in the global chip manufacturing landscape.

    Expansion in Kumamoto Prefecture

    TSMC, globally recognized as the leading contract chip maker, is expanding its presence in Kumamoto Prefecture, Japan. This strategic initiative aligns with Prime Minister Fumio Kishida’s vision of enhancing Japan’s semiconductor production capabilities.

    Collaboration with Toyota

    The collaboration between TSMC and Toyota is a notable cross-industry effort to strengthen the semiconductor supply chain, a critical component for various technologies ranging from vehicles to smartphones. The investment for the new facility is capped at US$5.26 billion, with a focus on advancing semiconductor technology through the addition of 6- and 7-nanometre process technologies at the new site.

    Commitment to Innovation and Job Creation

    The construction of the new plant is scheduled to begin later this year and is expected to be operational by 2027. This project goes beyond manufacturing expansion; it represents a commitment to innovation and technological advancement. The new facility has the potential to produce over 100,000 12-inch wafers monthly and create more than 3,400 high-tech jobs.

    Addressing Semiconductor Supply Chain Challenges

    This development comes at a time when countries are increasingly aware of the need for a robust semiconductor supply chain. Recent global shortages have highlighted the impact on industries such as automotive and consumer electronics. The construction of the second semiconductor plant in Japan by TSMC, with the support of Toyota, aims to address these challenges and strengthen the global chip manufacturing ecosystem.

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  • Report: TSMC’s 2nm technology set to be exclusively secured by Apple

    Report: TSMC’s 2nm technology set to be exclusively secured by Apple

    Apple to Utilize TSMC’s 2nm Chip Technology

    According to a report by DigiTimes, Apple may become the first company to utilize TSMC’s upcoming 2-nanometer chip technology. TSMC, a major chip manufacturer, is expected to start the production of 2nm chips in the second half of 2025. The use of this technology allows for more transistors to be packed onto a single processor, resulting in faster performance and lower power consumption.

    Apple’s History of Early Adoption

    Apple has a track record of being an early adopter of TSMC’s leading-edge chip technologies. For instance, this year, both the A17 Pro chip in the iPhone 15 Pro and the M3 series chips in Macs are built on TSMC’s 3-nanometer process. Therefore, it is not surprising that Apple is expected to be the first to try TSMC’s new 2nm process as well.

    The Advantages of the 2nm Process

    The new 2nm node will introduce a new manufacturing process called gate-all-around field-effect transistors (GAAFET) with nanosheets. This technology is expected to bring faster speeds and lower power consumption compared to the FinFET transistors used in current chips. However, the shift to GAAFET presents challenges for TSMC. They will need to build new fabs and heavily invest in adapting their production process.

    Adjustments for Apple

    As a key customer of TSMC, Apple will likely need to make adjustments to its chip designs to accommodate the new technology. This will ensure that Apple’s devices can take full advantage of the benefits offered by the 2nm chips.

    Refinement of Current 3nm Process

    In addition to the development of the 2nm process, TSMC is also refining its current 3nm process. The company has already made improvements to its fabrication process in the new N3E and N3P chips. Furthermore, TSMC is working on other chips like N3X and N3AE, which are designed for high-performance computing and automotive applications respectively.

    Exploring Even More Advanced Chips

    Looking even further ahead, rumors suggest that TSMC is already exploring the development of even more advanced 1.4-nanometer chips. These chips are expected to be available as early as 2027. Unsurprisingly, Apple is reportedly interested in securing early access to this cutting-edge technology as well.

    In conclusion, Apple is poised to be the first company to utilize TSMC’s upcoming 2nm chip technology. This technology promises faster performance and lower power consumption. While there are challenges associated with the shift to the new GAAFET process, both TSMC and Apple are expected to make the necessary adjustments to take advantage of this innovative technology. Additionally, TSMC continues to refine its current 3nm process and explore even more advanced chips for future applications.

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  • TSMC to Potentially Produce Google Tensor G5

    TSMC to Potentially Produce Google Tensor G5

    Google Initiates Testing of In-House Chip

    Reports suggest Google partners with Taiwanese firm KYEC for evaluating a chip it developed internally, signaling a shift towards independent chip creation. KYEC offers testing services for fresh chips made in Taiwan. Google procures testing equipment at KYEC, with testing set to commence in the middle of the year and scale up gradually.

    Elaboration on Tensor G5 Chip

    The chip undergoing testing, named "Laguna," is speculated to be the Tensor G5. Set for unveiling in 2025, it will be produced using TSMC’s 3nm process. This chip will emphasize AI functionalities, aligning well with Google’s emphasis on AI-driven attributes in Pixel gadgets.

    Noteworthy Transition in Chip Development

    This potential change represents Google’s premier endeavor in crafting custom chipsets. Previously, the company banked on Samsung’s Exynos chips. Moving production to TSMC empowers Google with enhanced control over chip design, facilitating the development of more robust and competent Pixel phones. It also sidesteps Samsung’s Exynos chips, currently trailing Qualcomm’s Snapdragon lineup in performance and efficiency.

    Ongoing Relationship with Samsung

    In the immediate future, Google upholds its alliance with Samsung. The forthcoming Pixel 9 series will showcase the Tensor G4 chip, constructed utilizing Samsung’s 4nm process. While presenting marginal enhancements over the Tensor G3 chip of the Pixel 8, it shares technology with Samsung’s Exynos 2400 SoC, hinting at marked improvements in CPU and GPU performance.

    In a Nutshell

    Google’s collaboration with KYEC for chip assessment hints at potential self-reliant chip development efforts. The Tensor G5 chip is foreseen to give precedence to AI capabilities by 2025. Shifting production to TSMC might augment Google’s authority in chip design, leading to more potent Pixel devices. Nevertheless, Google maintains its partnership with Samsung through the Tensor G4 chip in the upcoming Pixel 9 series.

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  • TSMC Uncovers Huawei’s Kirin 9006C Mystery Amid Global Chip Issues

    TSMC Uncovers Huawei’s Kirin 9006C Mystery Amid Global Chip Issues

    TSMC Manufactures Huawei’s Kirin 9006C Processor Instead of SMIC

    A recent disassembly analysis by TechInsights unveiled that Huawei’s Kirin 9006C processor in the Qingyun L540 notebook was produced by Taiwan Semiconductor Manufacturing Co. (TSMC), contrary to initial speculations about China’s advanced semiconductor manufacturing capabilities.

    TSMC’s Role in Huawei’s Semiconductor Progress

    Past semiconductor advancements by Huawei, such as the 7nm system-on-chip in the Mate 60 Pro smartphone reportedly manufactured by China’s Semiconductor Manufacturing International Co. (SMIC), are now overshadowed by the confirmation of TSMC as the manufacturer of the Kirin 9006C processor.

    Huawei’s Confrontation with Geopolitical Realities

    The geopolitical backdrop complicates Huawei’s semiconductor journey, notably with US export controls in 2020 cutting off Huawei’s access to TSMC during the Kirin 9006C’s production. Sanctions against Chinese GPU vendors Biren and Moore Threads further escalated challenges for Chinese semiconductor designers.

    Huawei’s Technological Achievements

    Despite obstacles, Huawei’s technological successes have solidified its reputation as a pioneer in Chinese initiatives to develop local alternatives to Western technologies. The triumph of the Mate 60 smartphone in 2023 propelled Huawei beyond the $100 billion revenue mark, challenging iPhone dominance in the Chinese market.

    Huawei’s Drive to Lead in Innovation

    The Kirin 9006C processor marks a significant advancement for Huawei into the 5nm realm, underscoring the company’s commitment to leading in technological progress. The mystery surrounding Huawei’s acquisition of a three-year-old processor showcases the company’s proactive stance in stockpiling semiconductors amid global restrictions.

    Huawei’s Adaptability in Trade Confrontations

    Through strategic investments in chip research and stockpiling, alongside partnerships with domestic suppliers and manufacturers, Huawei exhibits resilience in navigating the intricate landscape of international trade limitations. The L540 laptop, introduced circa 2016, aligns with Huawei’s expansion into mobile and computing devices, in line with Beijing’s efforts to substitute foreign technologies in sensitive sectors with local options.

    Huawei’s Compliance with Regulations

    Reports from online vendors suggest that the L540 laptop complies with stringent data security standards in China for sensitive government agencies, highlighting Huawei’s dedication to meeting evolving regulatory demands. As the global semiconductor scene evolves, Huawei’s capacity to adjust and innovate remains pivotal to its triumphs in the fiercely competitive tech sector.

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  • Controversy over Overseas Investments Forces TSMC to Withdraw from Election Debates

    Controversy over Overseas Investments Forces TSMC to Withdraw from Election Debates

    In the lead-up to Taiwan’s presidential and parliamentary elections on January 13, TSMC (Taiwan Semiconductor Manufacturing Co) finds itself at the center of a heated vice presidential debate. The world’s largest contract chipmaker has withdrawn from the election campaign discussions amidst clashes between candidates regarding the company’s overseas investments and concerns about the safety of investing in Taiwan.

    Tensions between Taiwan and China

    The withdrawal comes against the backdrop of heightened tensions between Taiwan and China, which claims Taiwan as its territory. The presidential campaigns have seen increased focus on issues affecting the semiconductor industry, such as power grid stability and water shortages, with occasional mentions of TSMC’s role in Taiwan.

    Concerns raised by opposition party

    Jaw Shaw-kong, the vice presidential candidate for Taiwan’s largest opposition party, Kuomintang (KMT), took center stage by expressing concerns raised by Wall Street financiers about the potential impact of a war on investment in Taiwan. He placed blame on the ruling Democratic Progressive Party (DPP) for the tensions with China, accusing them of creating an unfavorable investment climate.

    Jaw Shaw-kong proposed the “Taiwan plus one” strategy, advocating for one factory in Taiwan and another overseas. He specifically targeted TSMC, suggesting the company’s desire to relocate overseas, potentially undermining Taiwan’s economic stability.

    Defense from the ruling party

    In response, Hsiao Bi-khim, the DPP’s vice presidential candidate and former de facto ambassador to the United States, refuted Jaw’s claims. She highlighted that foreign investment in Taiwan has reached record levels under the DPP administration and emphasized TSMC’s significance as a cornerstone of Taiwan’s economy. Hsiao urged against using the company for political competition and described TSMC as a “sacred mountain protecting the country.”

    TSMC’s stance and future trajectory

    TSMC, currently expanding its global footprint with factories in Japan, the U.S. state of Arizona, and plans for another in Germany, remained silent in response to the debate. However, both the company and the government consistently asserted their commitment to keeping the majority of manufacturing, especially advanced chip production, in Taiwan.

    As the election date draws near, the withdrawal of TSMC from the campaign discussions adds a new layer of complexity to the political landscape, raising questions about the company’s future trajectory and its impact on Taiwan’s economic resilience in the face of external pressures.

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