MediaTek has introduced two new mid-range chipsets – the Dimensity 7300 and Dimensity 7300X. Both chips are built on a 4nm process and claim to offer 25% lower power consumption on the performance cores compared to the Dimensity 7050.
Technical Specifications
The Dimensity 7300 series differs from the Dimensity 7050’s (2+6) core configuration by featuring 4 x Cortex-A78 cores clocked at 2.5GHz and 4 x Cortex-A55 cores clocked at 2.0GHz. Although these are the same cores used in the Dimensity 7050, there are significant improvements in performance and power efficiency.
For graphics, the series uses the latest Arm Mali-G615 GPU, accompanied by MediaTek HyperEngine optimizations designed to enhance the gaming experience. MediaTek claims these chips offer a 20% higher FPS and 20% lower power consumption compared to competitors. The series also includes “smart resource optimization,” network optimization for games, and support for Bluetooth LE with Dual-Link True Wireless Stereo Audio.
A notable difference between the two chips is that the Dimensity 7300X supports dual displays, making it suitable for more affordable foldable devices.
Imaging Enhancements
The Dimensity 7300 series also introduces imaging enhancements with the new MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP. Phones equipped with this series can support a 200MP main camera. With enhanced hardware engines, it offers precise noise reduction (MCNR), face detection (HWFD), and video HDR. Live focus photo performance and photo remastering are now 1.3X and 1.5X faster respectively compared to the Dimensity 7050.
In simpler terms, the chip enables OEMs to offer better camera systems, but it depends on the smartphone manufacturers on how they utilize these added capabilities.
AI Performance
The series includes the MediaTek APU 655, boasting a 2x improvement in AI performance over the Dimensity 7050.
