Honor has recently introduced the Honor Magic V3 series of foldable devices, the MagicPad 2 tablet, and the Honor MagicBook Art 14 notebook in China. Now, the company is reportedly developing the Magic 7 series of flagship smartphones. Today, tipster Digital Chat Station shared a Weibo post revealing what seem to be the main specifications of the standard version of the Magic 7.
Rumored Specifications of Honor Magic 7
According to the leak, the Honor Magic 7 will come with a 1.5K resolution display and a large silicon battery. The current engineering prototype of the device is said to have three 50-megapixel cameras on its rear.
The tipster also mentioned that the device is being tested with an OmniVision OV50H primary camera and a Sony IMX882 periscope telephoto camera. The upcoming Snapdragon 8 Gen 4 chipset will be the powerhouse of the device.
Qualcomm is anticipated to unveil the Snapdragon 8 Gen 4 chipset in October this year. This chipset is expected to be featured in many future flagship phones, including the Xiaomi 15 series, the iQOO 12, the OnePlus 13, and the Realme GT 7 Pro, among others.
Additional Insights
A recent leak indicated that one of the Magic 7 series phones will be equipped with an OLED panel from Tandem, a Snapdragon 8 Gen 4 chipset, a battery exceeding 6,000mAh, and a triple camera setup consisting of a 50-megapixel (OV50K, main), 50-megapixel (OV50H), and 200-megapixel (Samsung HP3, telephoto) sensors. These specifications could belong to either the Magic 7 Pro or the Magic 7 Ultimate.
The Magic 6 series of smartphones was unveiled in January of this year, so it's likely that the Magic 7 lineup will be announced in January 2025.
