Category: Computers

  • CERN Physicists Transform Lead into Gold Using Particle Physics

    CERN Physicists Transform Lead into Gold Using Particle Physics

    Key Takeaways

    1. Alchemists believed they could transform lead into gold due to similarities in their atomic structures.
    2. Lead contains 82 protons, while gold has 79 protons, highlighting their atomic similarities.
    3. Researchers at CERN’s ALICE experiment have observed the transformation of lead into gold during high-energy collisions.
    4. These collisions can reach trillions of electron-volts and can create around 86 billion gold nuclei momentarily.
    5. The produced gold exists only for a very short time, limiting its practical value despite the theoretical transformation.

    The alchemists of old believed it was possible to transform common lead into precious gold, due to their similar traits.

    Later findings confirmed their theories, revealing that lead (Pb) contains 82 protons while gold (Au) has 79 protons, showing strong similarities in their atomic structures.

    A New Discovery

    Even with this knowledge, the transformation of one into the other has always been deemed impossible—until now. Researchers from the ALICE (A Large Ion Collider Experiment) at CERN assert that they have witnessed this phenomenon firsthand.

    Their observations stemmed from the ALICE team’s mission to collide heavy lead ions, allowing them to investigate the quark-gluon plasma that forms during these high-energy collisions.

    High-Energy Collisions

    These collisions, which can reach extraordinary energies of trillions of electron-volts (TeV), are said to be capable of displacing protons from the nuclei of the ions, transforming them into other elements, including gold.

    The ALICE team claims their experiments may have produced around 86 billion gold nuclei at once, roughly equivalent to 2.9 ×10^-11 grams (g) of gold.

    A Momentary Existence

    Moreover, this gold only survives for an incredibly short time after the collision.

    Thus, while the age-old dream of turning lead into gold (or chrysopoeia) may have finally been realized, it might not fulfill the aspirations of early scientists throughout history.

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  • AMD Zen 6 Leak: 50% Boost in 3D V-Cache and Core Count

    AMD Zen 6 Leak: 50% Boost in 3D V-Cache and Core Count

    Key Takeaways

    1. AMD plans to increase the CPU core count per CCD to 12 for Zen 6 CPUs, a 50% increase from the 8-core CCDs in Zen 5.
    2. Zen 6 CPUs will feature larger L3 cache sizes, with around 48 MB per CCD for client models and up to 128 MB for server models.
    3. The potential total core count for the flagship Zen 6 chip could reach 24 cores and 48 threads.
    4. Future Ryzen 7 X3D CPUs might offer 12 cores and a total of 144 MB of L3 cache, significantly enhancing gaming performance.
    5. Current information is speculative, and final specifications for Zen 6 CPUs are yet to be confirmed.

    Thanks to a lot of reports that have come out recently, we now have a clearer picture of what AMD is planning with their Zen 6 CPU architecture. The main areas AMD is looking at include increasing the CPU core count, enlarging the L3 cache, and raising clock speeds, which should provide a significant performance boost compared to Zen 5.

    Core Count and Cache Size Updates

    Regarding the increase in CPU core counts and L3 cache sizes, there’s now more evidence about AMD’s intentions. HXL shared information on X, indicating that AMD plans to raise the core count per CCD to 12 for the Zen 6 CPUs. This marks a 50% increase compared to the current Zen 5 Ryzen 9000 CPUs, which utilize 8-core CCDs. Therefore, the flagship Ryzen 9 9950X uses two 8-core CCDs. If this trend continues, the Zen 6 flagship chip could potentially feature as many as 24 total cores and an impressive 48 threads.

    Plans for Epyc Server CPUs

    Moreover, AMD might also be working on 32-core CCDs for their Epyc server CPUs. To fit 32 cores on a single CCD, the cores will likely need to be notably smaller than those found in the client Zen 6 CPUs. Thus, it’s expected that there will be 32 Zen 6c cores per CCD rather than the standard Zen 6 cores.

    As previously mentioned, Zen 6 CPUs will also feature more L3 cache compared to their Zen 5 predecessors. HXL reports that the client “Olympic Ridge” Zen 6 SKUs will have around 48 MB of L3 cache per CCD, while server chips could see a massive 128 MB L3 cache per CCD.

    Comparison with Current Models

    For context, the Ryzen 9 9950X provides 32 MB of L3 cache per CCD, resulting in a total of 64 MB. Thus, the increase in L3 cache could mean that the dual-CCD Ryzen 9 Zen 6 flagship could reach 96 MB total. This is quite significant for average users, and a per-CCD L3 cache of 48 MB is also substantial for gamers.

    The Ryzen 7 9800X3D, which is currently the fastest gaming CPU available, has one CCD with 8 cores, 16 threads, and 32 MB of L3 cache. With a single 64 MB 3D V-Cache stack positioned below the CCD, the total L3 cache amounts to 96 MB. If Zen 6 indeed offers 48 MB of L3 cache per CCD, then the successor to the Ryzen 7 9800X3D could potentially have 112 MB of total L3 cache, assuming AMD maintains the same 3D V-Cache amount.

    Potential for a New Gaming Champion

    This is where things become really intriguing. Kepler_L2 responded to HXL’s post, suggesting that AMD might also raise the total 3D V-Cache from 64 to 96 MB. When combined with the 48 MB of L3 cache for a Zen 6 CCD, a future Ryzen 7 X3D CPU could feature 12 cores and a whopping 144 MB of L3 cache.

    In summary, if AMD does launch a Zen 6 X3D chip with 144 MB of cache, 12 cores, and higher clock speeds than the Ryzen 7 9800X3D, Team Red might just hold onto the gaming performance title for another generation. However, this information is still speculative and based on rumors. The exact specifications of the final Zen 6 CPUs remain to be seen.

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  • Intel Arc B580 Variant Expected to Feature Major VRAM Upgrade

    Intel Arc B580 Variant Expected to Feature Major VRAM Upgrade

    Key Takeaways

    1. Intel will showcase its Arc Pro GPUs for enterprise use at Computex, expected between May 20 and May 23.
    2. New Intel GPUs, including the Maxsun Intel Arc B580 with 24 GB of VRAM, have appeared on the EEC website, but this model does not have the ‘Pro’ designation.
    3. The 24 GB Arc B580 may complicate Intel’s GPU lineup as it exceeds the expected VRAM of the Arc B770, rumored to have 16 GB.
    4. AMD is also rumored to be preparing a 32 GB Radeon RX 9070 XTX, though its reveal at Computex is uncertain.
    5. Speculations include the possibility of a professional-grade GPU and a Maxsun Intel Arc B580 iCraft 12G M.2 OC variant with integrated M.2 NVMe SSD slots, with more details expected soon.

    Intel has recently announced that it will showcase its Arc Pro GPUs designed for enterprise use at Computex. While the specific date is still unclear, it is expected to happen sometime between May 20 and May 23. Interestingly, some new Intel GPUs have appeared on the EEC website, as noted by @Olrak29_ on X, with one model featuring a significant increase in VRAM. Importantly, this model does not have the ‘Pro’ designation.

    New GPU Details

    Among the GPUs listed, there are two versions of the Intel Arc B580 featuring 24 GB of VRAM, identified as the Maxsun Intel Arc B580 iCraft 24G and its OC variant. This aligns with earlier rumors suggesting that such a model would be released without the Pro label. While 24 GB of VRAM may seem excessive for an Intel Arc B580, which has a relatively weak BMG-G21 GPU, it is nonetheless a beneficial enhancement, particularly for AI tasks.

    Potential Complications in Lineup

    However, introducing a 24 GB Arc B580 may complicate Intel’s GPU lineup, as it would provide more VRAM than the presumably still-in-development Arc B770, which is rumored to have 16 GB of video memory. What’s even more exciting is the possibility that the Arc B580 might not be the only GPU receiving a 2x VRAM increase. AMD is also rumored to be preparing a 32 GB Radeon RX 9070 XTX, but it’s unclear if this will be revealed during Computex.

    Speculations and Future Announcements

    It’s possible that the SKU mentioned above could actually be a professional-grade GPU with its true name disguised for secrecy. Additionally, there’s another intriguing SKU from last year that has surfaced: the Maxsun Intel Arc B580 iCraft 12G M.2 OC. This variant features two integrated M.2 NVMe SSD slots. Maxsun indicated that more details would be shared “soon,” but there hasn’t been any follow-up. Computex presents a fantastic opportunity for unveiling unique new designs.

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    Intel Arc B580 Variant Expected to Feature Major VRAM Upgrade
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  • Xiaomi Wireless Mouse Lite 3: 2.4GHz, 1000 DPI, Ergonomic Design

    Xiaomi Wireless Mouse Lite 3: 2.4GHz, 1000 DPI, Ergonomic Design

    Key Takeaways

    1. Affordable Pricing: The Xiaomi Wireless Mouse Lite 3 is priced at 39 yuan (about $5.40) and is available for pre-order, with deliveries starting on May 14.

    2. Minimalist Design: The mouse features a sleek, one-piece design in two colors (Deep Space Black and Plain White Grey), emphasizing comfort and aesthetics.

    3. User Comfort: Weighing around 45 grams, the mouse is designed to fit comfortably in the user’s palm, accommodating various grip styles and reducing wrist strain during prolonged use.

    4. Wireless Connectivity: It uses 2.4GHz wireless connectivity with a USB receiver that can be stored inside the mouse, enhancing portability and convenience.

    5. Performance Features: The mouse includes a 1000 DPI optical sensor for reliable tracking, and PTFE feet for improved gliding efficiency, though it lacks Bluetooth and rechargeable battery support.

    Xiaomi has launched the Wireless Mouse Lite 3 in China, expanding its range of budget-friendly peripheral devices. This new model is available for pre-order on JD.com and other retail websites. The price is set at 39 yuan (about $5.40), with deliveries expected to start on May 14.

    Design and Comfort Features

    The mouse comes in two color variations: Deep Space Black and Plain White Grey. Xiaomi maintains its minimalist design philosophy, featuring a sleek one-piece look that integrates the buttons into the smoothly curved body of the device. This design eliminates any sharp edges, yielding a softer appearance that fits well in different work environments.

    Weight and Usability

    The mouse is shaped to fit the user’s palm, enhancing comfort for long periods of use. Xiaomi states that the mouse weighs around 45 grams without batteries, making it light enough to reduce wrist strain during extended sessions. The design accommodates various grip styles and hand sizes, appealing to those seeking a simple, versatile pointing device.

    Connectivity and Practicality

    It features 2.4GHz wireless connectivity through a small USB receiver, which can be tucked away in a compartment beneath the mouse’s back cover. This design helps to prevent loss while traveling. Xiaomi’s receiver compartment design is similar to previous products, focusing on convenience and a cable-free experience.

    Performance Specifications

    The Lite 3 includes a 1000 DPI optical sensor that provides reliable tracking for typical work and study activities. It ensures smooth and steady cursor control that is adequate for everyday productivity, web browsing, and office tasks.

    Additional Features

    The bottom of the mouse is fitted with PTFE (Polytetrafluoroethylene) feet to enhance gliding efficiency. These self-lubricating feet reduce friction on surfaces, allowing for a smoother experience on desks or mouse pads. However, it does not support Bluetooth connectivity or rechargeable batteries, operating instead on a standard AA cell.

    Xiaomi has also unveiled the Mijia Wireless Floor Scrubber 4 Max, which boasts a patented edge-cleaning arm and powerful 23,000Pa suction. Additionally, the company has released a 256L three-door refrigerator featuring antibacterial cooling, HyperOS integration, and other smart functionalities.

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  • Beelink ME Mini NAS Launch: Supports Up to 24TB Storage Globally

    Beelink ME Mini NAS Launch: Supports Up to 24TB Storage Globally

    Key Takeaways

    1. Beelink’s ME mini NAS is now available for pre-order globally, priced at $329 for the entry-level model with 12 GB RAM and 2 TB storage.
    2. The device supports up to six NVMe SSDs, allowing for a total storage expansion of up to 24 TB.
    3. It features an Intel N150 chipset and is compatible with multiple operating systems, including Windows, Proxmox, and Linux.
    4. Connectivity options include WiFi 6 and Bluetooth 5.2, along with a compact design and integrated power supply.
    5. After the pre-order period, the base model will be priced at $409, with an upcoming version expected to include two 2 TB Crucial SSDs.

    Beelink has launched its ME mini to the world market. This NAS was first hinted at in early March 2025, with the official release in China happening in April 2025. Now, customers can pre-order it through the global website. The entry-level version, which includes 12 GB of LPDDR5 RAM and 2 TB of storage, is priced at $329.

    Key Features

    One standout feature of this NAS is its capacity to accommodate six NVMe SSDs. Beelink states that users can expand total storage up to 24 TB by using all six slots. There is also 64 GB of eMMC storage, presumably designated for the operating system. The ME mini is compatible with various operating systems such as Windows, Proxmox, and Linux.

    Performance Specs

    In terms of processing capabilities, the ME mini is powered by an Intel N150 chipset. This model is part of the Twin Lake series and is quite similar to the N100, albeit with minor adjustments. The device also offers a good array of connectivity options, which include:

    For wireless connections, the NAS comes equipped with WiFi 6 and Bluetooth 5.2. Additional features of this compact mini PC consist of a space-saving design, an integrated power supply unit (PSU), and a vertical airflow cooler. It comes in three different color choices. After the pre-order period, the base model of the Beelink ME mini will be available for $409, and there appears to be another configuration in the works. This alternate version will include two 2 TB Crucial SSDs (with the current price of a 2 TB Samsung 990 Pro being $169.99 on Amazon), while maintaining the same RAM specifications.

    Beelink ME Mini NAS Launch: Supports Up to 24TB Storage Globally
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  • SMIC Yield Issues Rise Due to U.S. Sanctions on Tool Servicing

    SMIC Yield Issues Rise Due to U.S. Sanctions on Tool Servicing

    Key Takeaways

    1. SMIC expects a revenue dip of up to 6% in Q2 due to equipment maintenance disruptions.
    2. U.S. export restrictions have forced unqualified SMIC engineers to manage advanced tool maintenance, increasing risk of further disruptions.
    3. In Q1 2025, SMIC reported $2.247 billion in revenue, a 1.8% increase, primarily driven by wafer sales.
    4. Equipment issues have diverted $30 million to $75 million from R&D, but SMIC maintains a $7.5 billion capital expenditure plan.
    5. Co-CEO Haijun Zhao noted that tariff impacts on revenue are minimal, but increasing prices may affect demand later in the year.

    Semiconductor Manufacturing International Corporation (SMIC) is expecting a revenue dip of up to six percent for the second quarter due to disruptions from equipment maintenance and validation. A mishap during their annual maintenance, along with problems found in newly set up tools, has led to a decrease in sellable output, without affecting the average selling prices.

    Maintenance Challenges

    U.S. export restrictions preventing American suppliers from servicing advanced wafer fabrication tools in China have compelled SMIC engineers, who don’t have formal qualifications for some tasks, to handle maintenance themselves. This situation raises the risk of further disruptions and could lead to lower yield quality.

    First Quarter Performance

    In the first quarter of 2025, SMIC reported revenue of $2.247 billion, reflecting a 1.8 percent increase from the previous quarter. Wafer sales made up 95.2 percent of this total, thanks to an 18 percent rise in shipments of 200-millimeter wafers and a two percent growth in 300-millimeter volumes. Factory utilization increased to 89.6 percent, helping to mitigate the effects of lower unit prices and rising depreciation costs on profit margins.

    Financial Implications

    Addressing the issues with the faulty equipment has already redirected between $30 million and $75 million from research and development. Nevertheless, management is sticking to a bold $7.5 billion capital-expenditure plan for the year. Executives believe the current impact of tariffs is “minor,” although they admit that increased prices downstream might limit demand in the latter half of the year.

    Co-CEO Haijun Zhao mentioned that close collaboration with partners and received tariff exemptions have helped to keep the direct revenue impact from trade policies below one percent. The company is still closely watching customer demand due to the ongoing geopolitical uncertainties.

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  • Aoostar GEM12+ Pro Mini-PC: OCuLink, Fingerprint Sensor, Display

    Aoostar GEM12+ Pro Mini-PC: OCuLink, Fingerprint Sensor, Display

    Key Takeaways

    1. The Aoostar GEM12+ Pro is available on Amazon as a barebones kit starting at $399.95 or a fully assembled system for $499.
    2. The Plus version features a built-in screen and a fingerprint sensor for easy unlocking, along with important system information display.
    3. It is powered by an AMD Ryzen 7 Pro 8845HS processor with integrated Radeon 780M GPU, suitable for various applications.
    4. The mini-PC offers extensive connectivity options, including multiple USB ports, HDMI 2.1, DisplayPort, and dual Ethernet ports supporting Wi-Fi 6.
    5. There is an option to attach an external graphics card via the OCuLink interface for enhanced graphics performance.

    The Aoostar GEM12+ Pro is now listed on Amazon, available as either a barebones kit or a fully assembled system, featuring 32 GB of RAM and a 1 TB SSD. The starting price for the barebones option is $399.95, while the complete setup with added memory and storage is priced at $499.

    Features of the Plus Version

    The Plus variant of the Aoostar GEM12+ Pro includes a built-in screen along with a fingerprint sensor situated on the top. The display is capable of showing important information like system usage stats, and the fingerprint sensor provides a convenient way for users to unlock the computer without needing to type a password. With dimensions of 130 x 130 x 60 mm (approximately 5.1 x 5.1 x 2.4 inches), this compact PC is powered by an AMD Ryzen 7 Pro 8845HS, which is potent enough to manage various applications, including those that require more power. The Ryzen chip comes with a Radeon 780M integrated GPU, and there is also an option to attach an external graphics card via the OCuLink interface.

    Connectivity Options

    The Aoostar GEM12+ Pro presents a comprehensive array of I/O ports, featuring two USB 3.2, two USB 2.0, and two USB4 ports. It also includes an HDMI 2.1 output and a DisplayPort for video connectivity. As for networking, the system supports Wi-Fi 6 and has dual Ethernet ports that can reach speeds up to 2.5 Gbit/s. To learn more, you can check out our review of the regular Aoostar GEM12, which is a comparable mini-PC that has the standard Ryzen 7 8845HS but does not come with a built-in screen.

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    Aoostar GEM12+ Pro Mini-PC: OCuLink, Fingerprint Sensor, Display

     

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  • Understanding HarmonyOS for PC: Key Differences from Windows

    Understanding HarmonyOS for PC: Key Differences from Windows

    Key Takeaways

    1. Introduction of HarmonyOS PC: Huawei launches its first personal computer operating system, HarmonyOS PC, to reduce reliance on Western technology.

    2. Core Features: Built on HarmonyOS 5, it emphasizes smooth performance, multi-device integration, AI enhancements, and robust security.

    3. Comparison with Windows: HarmonyOS PC is tailored for Huawei devices with a cohesive hardware-software relationship, unlike Windows which supports a wide range of hardware.

    4. AI Integration: HarmonyOS PC features a deeply integrated AI assistant, Xiaoyi, offering advanced functionalities like real-time summarization and automation.

    5. Privacy and Security: The OS includes advanced security measures like full-disk encryption at the chip level, enhancing data security compared to Windows.

    Huawei has introduced its first personal computer operating system, named HarmonyOS PC, or Hongmeng Computer in China. This launch marks a significant shift for the company as it seeks to reduce reliance on Western technology. HarmonyOS PC is the result of five years of internal development, involving more than 10,000 engineers and over 2,700 patents.

    What is HarmonyOS PC?

    HarmonyOS PC is a fully homegrown operating system from Huawei, built upon HarmonyOS 5. It is part of a larger ecosystem that already includes smartphones, tablets, smartwatches, TVs, and even vehicle dashboards. The PC version incorporates HarmonyOS’s core principles, such as smooth performance, multi-device integration, AI enhancements, and robust security into desktop computing.

    At the core of the system is a revamped Harmony kernel, backed by the Ark graphics engine and StarShield security framework. Additionally, Huawei provides proprietary development tools like ArkTS and ArkUI. HarmonyOS PC is designed for smooth interaction across various devices, allowing users to easily share keyboards, mice, screens, and files among phones, tablets, and PCs.

    Key Features of HarmonyOS PC

    The operating system also works closely with Huawei’s AI assistant, Xiaoyi, which facilitates voice commands, smart summarization, translation, and contextual data searches using AI-driven language understanding.

    The inaugural HarmonyOS PC is set to be launched on May 19, 2025, and will utilize the Kirin X90 desktop chip, a 10-core processor designed by Huawei. While the device won’t natively support Windows, users can run Windows 11 through the Oseasy virtual machine for added compatibility.

    Comparing HarmonyOS PC and Windows

    1. Architecture and Ecosystem
    Windows is a well-established operating system that offers compatibility across a wide range of hardware and software. In contrast, HarmonyOS PC is tailored specifically for Huawei’s devices and certified accessories, ensuring a more cohesive hardware-software relationship. HarmonyOS comes with over 150 native PC apps and more than 2,000 universal apps, most of which are optimized for Huawei’s devices. Windows, while supporting a vast array of legacy and modern applications, lacks the device-level integration that HarmonyOS aspires to achieve.

    2. Multi-Device Collaboration
    HarmonyOS PC emphasizes distributed computing, utilizing Huawei’s distributed soft bus technology to allow fluid transitions between devices, like dragging files and using a single keyboard and mouse across multiple screens. Windows has made progress with services such as Phone Link and OneDrive, but it still relies on third-party hardware and applications for more advanced integrations.

    3. User Interface and Interaction
    In terms of appearance, HarmonyOS PC bears more resemblance to macOS than Windows. It features a bottom-center dock for applications, top status bars, and a sleek, card-based desktop design. The OS includes dynamic wallpapers, motion effects, and gravity-based visuals that give it a contemporary feel. Windows maintains a more traditional layout, although Windows 11 has begun to adopt some visual elements akin to macOS.

    Gesture control on HarmonyOS PC is designed to be more intuitive, allowing for three-finger swipes and drag-and-drop multitasking. These elements are crafted with AI in mind and are intricately woven into the system’s functionality.

    4. AI Integration
    HarmonyOS PC aims to excel in AI integration. Huawei’s Xiaoyi assistant, driven by its Pangu and DeepSeek models, can create templates, translate images, summarize meetings in real-time, and provide system-level automation. In contrast, Windows offers Copilot and Microsoft 365 integrations, but Xiaoyi is more deeply integrated into the OS, allowing it to access system-level commands through voice, image, or text.

    5. Privacy and Security
    With privacy as a foundational element, Huawei has designed HarmonyOS PC with the StarShield architecture that enforces full-disk encryption at the chip level, ensuring data remains secure even if the drive is removed. Additional features include one-time permission grants, anti-peeping screens, and the ability to wipe the device remotely, even if it’s turned off. Windows provides BitLocker and various user-configurable privacy tools, but it does not offer chip-level full-disk encryption as a default on all devices and relies more on third-party antivirus solutions.

    Conclusion

    HarmonyOS PC signifies an important step in Huawei’s long-term strategy to reduce dependence on Western technology. While Windows remains the leader in legacy software compatibility and developer support, HarmonyOS PC’s strong integration with Huawei’s ecosystem, advanced AI features, and enhanced security offer a fresh option, especially for users and organizations within China.

    Nonetheless, HarmonyOS PC faces hurdles ahead. Development of native apps is ongoing, and it will take time for user habits to adapt, while international adoption may be limited due to geopolitical factors and software compatibility issues. For Huawei, HarmonyOS PC symbolizes more than just an operating system; it is a statement of independence and a significant move toward a unified, cross-device digital future.

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  • Intel Releases New Microcode for 13th & 14th Gen CPU Issues

    Intel Releases New Microcode for 13th & 14th Gen CPU Issues

    Key Takeaways

    – Intel launched microcode update version 0x12F to fix ‘Vmin Shift Instability’ in 13th and 14th Gen Core desktop processors.
    – The issue, noted by Tekken 8 players, involves voltage fluctuations during low activity or idle periods.
    – The update improves voltage behavior without affecting performance in productivity or gaming tests.
    – Users are advised to update BIOS and enable “Intel Default Settings” in UEFI for stability.
    – Intel has extended the warranty for affected processors by two years, totaling five years of coverage.

    Intel has launched a new microcode update, version 0x12F, to address the ‘Vmin Shift Instability’ that is affecting its high-end 13th and 14th Gen Core desktop processors, especially the Core i7 and i9 “K” series. This comes after the previous update, 0x12B, released in September 2024, which was thought to solve the problem.

    New Update and Its Purpose

    The instability issue was first brought to light by players of Korean Tekken 8, and it arises from voltage fluctuations during periods of low activity or while the system is idle for long periods, sometimes days or even weeks. The new update improves how voltage behaves in these less demanding conditions, which helps to lessen the risk of long-term damage to the processor.

    Performance Testing Insights

    Intel has pointed out that the fundamental cause of the instability has not changed. However, tests conducted on processors like the Core i9-14900K with DDR5 5600 MT/s memory indicate that the 0x12F update does not cause any noticeable performance differences in productivity tests (like Cinebench or Speedometer 3) or gaming scenarios (such as Cyberpunk 2077 or Hitman 3).

    User Recommendations and Warranty Extension

    To alleviate these issues, Intel recommends that users update to the latest BIOS firmware and enable the “Intel Default Settings” profile in UEFI. This update is part of Intel’s ongoing efforts to maintain stability and performance in its newest desktop CPUs.

    Users who are affected should be aware that Intel has also extended the warranty for the impacted processors by two years, giving a total coverage period of five years for qualifying chips.

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  • Apple M6, M7 SoCs and Powerful AI Chip with 6x M3 Ultra Cores

    Apple M6, M7 SoCs and Powerful AI Chip with 6x M3 Ultra Cores

    Key Takeaways

    1. Apple is expected to launch the iPhone 17 series, new Apple Watch models, and a MacBook Pro with the M5 SoC in Fall 2025.
    2. Apple is developing new SoCs, including the M6 “Komodo” and M7 “Borneo,” which may debut in 2026 and 2027, respectively.
    3. A new AI server chip, codenamed “Baltra,” is in development and could feature 64 to 192 CPU cores and 160 to 480 GPU cores, expected to release in 2027.
    4. The current Apple M3 Ultra chip boasts significant performance improvements over the M2 Ultra, with up to 32 CPU cores and 80 GPU cores.
    5. Apple is also working on another SoC named “Sotra” for future Macs, though details about its specifications and target devices remain unclear.

    Like in the past few years, Apple is likely to unveil many new products in the Fall of 2025. We might witness the launch of the new iPhone 17 series, various accessories like updated Apple Watch models, and a new MacBook Pro before 2025 wraps up. This upcoming MacBook Pro could feature the new Apple M5 SoC.

    New Developments in SoCs

    Bloomberg has reported that besides the M5, Apple is also developing several other SoCs, including a new AI server chip. According to the report, Apple is working on the M6 “Komodo” and the M7 “Borneo” SoCs. If they stick to their usual launch timeline for SoCs, we could see the Apple M6 and M7 debut in 2026 and 2027, respectively.

    Exciting AI Chip News

    In a more exciting twist, the report mentions that Cupertino is creating a new AI server chip with the codename “Baltra.” Supposedly, Apple’s new AI chip is in collaboration with Broadcom and is expected to hit the market in 2027. This chip may have an enormous core count, as Apple appears to be testing configurations with 2x, 4x, and 6x the CPU and GPU cores compared to the M3 Ultra.

    For some context, the Apple M3 Ultra features up to 32 CPU cores, 80 GPU cores, and a 32-core Neural Engine for AI functions. Apple has stated that the M3 Ultra is about 1.5x quicker than the M2 Ultra when it comes to CPU performance and 2x faster for GPU tasks.

    Speculations on Core Counts

    Thus, Apple’s new AI server chip could potentially feature anywhere from 64 to 192 CPU cores and 160 to 480 GPU cores. These figures are substantial, so we should reserve judgment until more information is available.

    In addition to the M6, M7, and the “Baltra” AI server chip, it seems Apple is also working on an SoC codenamed “Sotra” for the Macs. No technical specs have been shared about this SoC, nor do we know whether it is aimed at future desktop Macs or MacBooks. If we were to make an educated guess, a high-end desktop chip appears to be the most logical choice, given that Apple’s current M-series SoCs serve the laptop market quite effectively.

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