Lenovo Details Cooling System for Forthcoming Legion Y700 Infinite Gaming Tablet
Lenovo has shared new technical details about its upcoming high-performance Android gaming tablet, the Legion Y700 Infinite, ahead of an expected August launch. The compact device is set to succeed the Legion Y700, which is sold internationally as the Legion Tab Gen 5, with a sharper focus on raw processing power and sustained thermal performance.
Centralized Cooling Architecture
In a recent post on the Chinese social platform Weibo, the company confirmed that the tablet will incorporate a 15,000 mm² vapor chamber to manage heat output. The cooling solution is paired with a centrally mounted chassis design that positions the processor away from the edges, specifically targeting the areas where users typically grip the device. According to Lenovo’s promotional material, this passive central cooling layout keeps the grip zone approximately 4 °C cooler than an actively cooled smartphone powered by the same Snapdragon 8 Elite Gen 5 chipset.
Overclocked Platform and Display Shift
The Legion Y700 Infinite will run on a specially binned, overclocked version of Qualcomm’s flagship processor, reaching clock speeds of 4.74 GHz. This configuration will be supported by LPDDR5T memory and UFS 4.1 Pro storage. In a notable hardware change, Lenovo is moving from the 8.8-inch IPS LCD found in the current model to a smaller, 8-inch high refresh rate OLED panel. The company has already indicated that RAM configurations will top out at 24 GB alongside up to 1 TB of internal storage.
Additional Specifications and Launch Window
Further specifications teased by the manufacturer include a 50-megapixel rear camera framed by an RGB ring light and the option for 5G connectivity with dual-SIM support. The tablet is expected to make its official debut in China next month, with a global release likely to follow shortly thereafter.
Source: weibo.com