Key Takeaways
1. Xiaomi is developing the XRing O2 chip, which may support a wide range of devices, including smartphones, tablets, smartwatches, and possibly cars.
2. The XRing O2 has been spotted in a trademark list, indicating that its development is underway despite no official announcement from Xiaomi.
3. The chip design aims to be versatile, allowing for seamless integration of services across different device types.
4. The XRing O2 is expected to be manufactured using TSMC’s advanced 3-nanometer process, an upgrade from the previous generation chip.
5. Access to advanced manufacturing techniques may be challenged by export restrictions, potentially impacting Xiaomi’s long-term competitiveness in the chip market.
Xiaomi seems to be making another big move towards creating a complete hardware ecosystem. After successfully developing its own XRing O1 chip, there are signs that the next version, the XRing O2, is already in progress. This new chip could become crucial to Xiaomi’s strategy, as it may be used not just in phones, tablets, and smartwatches, but also possibly in future cars and other product lines.
Leaked Information
The details come from a leak shared by the reliable source, Digital Chat Station. While Xiaomi hasn’t officially announced the XRing O2 yet, the SoC has shown up on a trademark list in China. This adds weight to the speculation and indicates that development is already moving ahead.
Versatile Chip Design
What stands out is the plan for a single chip design that can be adaptable for many devices. If this becomes a reality, we could see the XRing O2 being used in a smartphone, a smartwatch, and even in cars like the Xiaomi SU7 and YU7, each tailored to specific needs. This could greatly simplify the way Xiaomi connects different types of devices on the software front and allows for seamless integration of services and applications across platforms.
Technical Specifications
On the technical side, the XRing O2 is reportedly built using TSMC’s 3-nanometer N3E process. This method is an upgrade from what was used in the XRing O1 found in the Xiaomi 15S Pro and the Pad 7 Ultra. Other leading companies like Qualcomm, MediaTek, and Apple are also moving towards using advanced N3P nodes in their next flagship chips. Following this trend, the industry is expected to gradually shift to even smaller processes, such as the 2-nanometer.
Yet, gaining access to these advanced manufacturing techniques might be tricky for Xiaomi. This is likely due to possible export restrictions that could hinder access to key software tools (EDA tools) needed for developing high-tech chips. While this might not directly affect the performance of the XRing O2, it could have implications for the platform’s long-term competitiveness and viability.
Source:
Link
Leave a Reply