Tag: TSMC 2nm

  • Apple and Qualcomm Lead in 2nm TSMC Chips for iPhone and Galaxy

    Apple and Qualcomm Lead in 2nm TSMC Chips for iPhone and Galaxy

    Key Takeaways

    1. TSMC will start mass production of 2nm chips by the fourth quarter, with Apple securing 50% of the capacity for future use.
    2. The Apple A19 processor for the iPhone 17 is being made using a 3nm process, while the 2nm capacity is likely for the iPhone 18 and A20 Pro chipset.
    3. Qualcomm’s Snapdragon 8 Elite 2 chip for the Samsung Galaxy S26 will also use a 3nm process, as they opted out of Samsung’s less reliable 2nm option.
    4. Major clients like Apple and Qualcomm are set to dominate TSMC’s 2nm chip production, while AMD, MediaTek, Intel, and Broadcom will join in 2026, and Nvidia, Google, and Amazon in 2027.
    5. TSMC’s 2nm process is expected to increase revenue from American firms to 80%, with the White House pushing for more US production through tariffs and investment incentives.


    TSMC is kicking off mass production of 2nm chips in the fourth quarter, and Apple has reportedly locked in 50% of this future capacity.

    Apple’s Plans for 2nm Chips

    The Apple A19 processor, set to be revealed in the iPhone 17 series on September 9, is still being manufactured using TSMC’s current 3nm process. However, the capacity that Apple has secured is likely intended for the iPhone 18 and its A20 Pro chipset.

    Snapdragon 8 Elite 2 and Samsung’s Strategy

    Similarly, the Snapdragon 8 Elite 2 chip for the upcoming Samsung Galaxy S26 series will utilize the latest 3nm process found in devices like the Galaxy S25 Ultra. Qualcomm did consider Samsung’s 2nm process as a less costly option compared to TSMC, but they quickly backed out due to Samsung’s capacity and production yield challenges at that time.

    Major Players in the 2nm Game

    Apple and Qualcomm have indeed claimed most of TSMC’s initial 2nm chip production capacity, expecting to receive the majority of shipments in the next year or so. Other clients for 2026 include AMD, MediaTek, Intel, and Broadcom, while Nvidia, Google, and Amazon’s Annapurna will join the mix in 2027.

    The costly 2nm process, which creates chips that are both more efficient and more powerful than the existing second-generation 3nm node, is projected to make 80% of TSMC’s revenue come from American firms, an increase from the current 75%. TSMC’s facilities in Arizona will focus solely on producing 2nm chips for Apple, Nvidia, and others, but they may only be able to provide a small portion of the processing power that these US companies require.

    To boost American production, the White House has pressured TSMC with tariffs to gain concessions regarding the expansion of its investment in the US, aiming to nearly double the initial $165 billion plan for the Arizona foundry.

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  • Google Pixel 11: Exciting Tensor G6 Upgrade for Better Performance

    Google Pixel 11: Exciting Tensor G6 Upgrade for Better Performance

    Key Takeaways

    1. Google is reportedly developing the Tensor G6 chipset, with potential improvements in performance and energy efficiency.
    2. There are conflicting rumors about the manufacturing process, with some suggesting TSMC’s advanced 2 nm technology may be used.
    3. The Tensor G6 could deliver up to 15% better performance and 30% lower power usage compared to the Tensor G5.
    4. The chipset is expected to launch next year with devices like the Pixel 11 and Pixel 11 Pro.
    5. The Tensor G6 will feature a single ARM Cortex-X930 core, six Cortex-A730 cores, one Cortex-A530 core, and a 3-core IMG CXTP GPU.


    Google hasn’t officially unveiled the Tensor G5, but details about its upcoming successor have been circulating for a while. Recent rumors hint that the Tensor G6 may be more potent and energy-efficient than what was previously believed.

    Rumors and Manufacturing

    To summarize, since October 2024, there have been whispers that Google is working on the Tensor G6 chipset, which is expected to use TSMC’s N3P node technology. However, a new report from Commercial Times Taiwan contradicts these earlier claims. This source supports an older rumor suggesting that Google might actually opt for TSMC’s more advanced 2 nm class node.

    Performance Expectations

    In theory, using TSMC’s N2 nodes could enable the Tensor G6 to deliver up to 15% improved performance compared to the Tensor G5, while also achieving a remarkable 30% reduction in power usage. Transitioning from the 4 nm manufacturing process to a 2 nm one should bring even more significant improvements when you look at how the Tensor G6 stacks up against the current Tensor G4, which powers the Pixel 9 Pro and Pixel 9 Pro XL (currently priced at $709.99 on Amazon).

    Upcoming Launch

    Currently, the Tensor G6 is anticipated to launch next year in devices like the Pixel 11 and Pixel 11 Pro. It will feature a single ARM Cortex-X930 prime core, six Cortex-A730 performance cores, and a Cortex-A530 efficiency core. Additionally, the chipset is set to include a 3-core IMG CXTP GPU running at 1.1 GHz, alongside various other specifications.

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  • Qualcomm Snapdragon 8 Elite Gen 3 to Use TSMC 2nm Process

    Qualcomm Snapdragon 8 Elite Gen 3 to Use TSMC 2nm Process

    Key Takeaways

    1. TSMC will start taking orders for its 2nm technology on April 1, with Qualcomm expected to join Apple in using this process.
    2. Qualcomm plans to use the 2nm process for the Snapdragon 8 Elite Gen 3 chip (SM8950) and another unnamed chip (SM8945).
    3. Flagship smartphones from manufacturers like Samsung and OnePlus currently use Snapdragon 8 Elite SoCs, with the next generation expected to feature the Snapdragon 8 Elite Gen 2.
    4. Apple will continue using 3nm technology for its A19 chips in the iPhone 17 series but will switch to 2nm for the A20 SoCs in the following year’s model.
    5. The SM8945 chips are likely to be the Snapdragon 8s Gen 6, targeting budget devices with reduced CPU and GPU capabilities while still utilizing 2nm technology.


    TSMC is expected to begin taking orders for its next-gen 2nm technology starting April 1. If recent rumors hold true, Qualcomm will be joining Apple in this endeavor. This indicates that Qualcomm plans to utilize the 2nm process for its forthcoming Snapdragon 8 Elite Gen 3 chip, as well as another unnamed chip. Initially, it was thought that Apple would continue with the 3nm technology for its A20 SoC, but recent leaks suggest a shift to the 2nm process.

    Qualcomm’s Upcoming Chips

    The well-known leaker, Digital Chat Station, shared insights on Weibo regarding TSMC’s 2nm process, indicating that Qualcomm will also be adopting this technology alongside Apple, albeit for two distinct chips. The chips in question are the SM8950 and SM8945, with the former likely being the Snapdragon 8 Elite Gen 3 and the latter representing the slightly less powerful Snapdragon 8s series. Interestingly, the leaker highlighted that these System on Chips (SoCs) are expected to debut next year.

    Flagship Smartphones and Future Releases

    Currently, flagship smartphones from Samsung, OnePlus, and other manufacturers are equipped with Snapdragon 8 Elite SoCs. The next iteration, which includes the Galaxy S26 series, is anticipated to feature the Snapdragon 8 Elite Gen 2. With these devices set for release next year, the announcement of a new, advanced SoC arriving the same year is quite unexpected. Meanwhile, Apple is reportedly sticking with the 3nm process for the A19 chips that will power its iPhone 17 series, launching later this year. However, the following year’s model is slated to incorporate the A20 SoCs, which will utilize the 2nm technology.

    Snapdragon 8s Gen 6 Details

    Regarding the SM8945 chips, they are anticipated to be the Snapdragon 8s Gen 6. Although they are also expected to be built on the 2nm technology, it’s likely they will feature reduced CPU and GPU capabilities, targeting more budget-friendly devices.

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  • Apple A20 Could Upgrade to TSMC’s 2nm Process, 15% Faster

    Apple A20 Could Upgrade to TSMC’s 2nm Process, 15% Faster

    Key Takeaways

    1. The iPhone 18 series is expected to use TSMC’s 2nm manufacturing technique for its A20 SoC, offering a 15% performance boost over the A19 chips.
    2. Earlier reports mistakenly suggested the A20 would stick with TSMC’s 3nm process, but updated analysis confirms the shift to 2nm.
    3. TSMC will begin accepting orders for 2nm wafers, with Apple likely being the first customer for the A20 chip.
    4. The iPhone 17 series will continue using the 3nm process with slight performance improvements due to higher transistor density.
    5. Both the iPhone 17 and 18 series may feature silicon-carbon batteries for increased capacity without added thickness.


    There has been a flurry of speculation and leaks regarding Apple’s upcoming iPhone 18 series, which is set to debut next year, even before the iPhone 17 series has been revealed. Recent developments suggest that Apple is likely to adopt TSMC’s 2nm manufacturing technique for its A20 SoC, which will drive the iPhone 18 series. This change could provide the SoC with a boost of around 15% in performance compared to the A19 chips.

    Changes in Chip Manufacturing

    Earlier reports indicated that Apple would remain with TSMC’s 3nm process for the A20 chips, similar to the A19, meaning no significant performance enhancement. However, a different industry analyst has confirmed that the A20 chips will actually utilize TSMC’s 2nm process. In addition, a report from Economic News Daily claims that this innovative manufacturing method could result in a 15% performance increase over the 3nm, all while maintaining the same power consumption levels.

    Potential Orders and Production

    Another source has mentioned that TSMC is poised to begin accepting orders for its 2nm wafers, with Apple possibly being the first to place an order for its A20 chip utilizing this new process.

    The iPhones currently available are powered by the Apple A18 SoCs, which are built on the 3nm process. It is expected that the iPhone 17 series will continue using this same manufacturing technology. However, it is anticipated to offer slight improvements in performance compared to the existing generation, thanks to a higher transistor density made possible by an enhanced 3nm process.

    Battery Innovations

    For both the iPhone 17 and 18 series, Apple is rumored to implement silicon-carbon batteries that boast greater capacity without adding to the thickness of the devices.

    It’s important to remember that Apple has not released any official details regarding the iPhone 17 or 18 series, so take this information with caution.

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  • Ryzen 9 11950X: 24 Zen 6 Cores Expected in 2026 Launch

    Ryzen 9 11950X: 24 Zen 6 Cores Expected in 2026 Launch

    A recent leak from Moore’s Law is Dead reveals some thrilling updates regarding AMD’s Zen 6 architecture. Unlike earlier versions which had distinct codenames, Zen 6 will come under the unified name Medusa. The laptop models will be known as Medusa Point/Medusa Ridge, while desktops will feature Medusa Ridge, and the successor to Strix Halo will be named Medusa Halo.

    Shared Technology Across Product Lines

    All three product lines are set to utilize the same 12-core Zen 6 CCD. It’s uncertain whether Zen 6c cores will be part of some variations, but if they are, they would probably be found on a different CCD. In addition, the high-end Ryzen 9 11950X (or a similar variant) will boost its core number from 16 to 24 by incorporating two of the aforementioned CCDs. Intel is also aiming to significantly increase its core count with Nova Lake, and AMD is eager to keep pace.

    Advanced Manufacturing Processes

    Things are looking even better. This time around, AMD plans to leverage TSMC’s advanced 2 nm (N2) node, a step up from previous generations that were typically a node or two behind. However, Zen 6 will also feature some parts built on the N3 node. A previous leak indicated that there will be an UDNA (formerly known as RDNA 5) iGPU included. Lastly, there have been whispers about Medusa Point SKUs incorporating 3D V-cache, though Tom has yet to confirm this information.

  • iPhone 17 Pro: Should You Wait for the 2nm Chipset Upgrade?

    iPhone 17 Pro: Should You Wait for the 2nm Chipset Upgrade?

    Apple has unveiled the iPhone 16 series, featuring devices powered by the 3 nm-based A18 and A18 Pro chips. Despite earlier predictions from Weibo tipster "Mobile chip expert" suggesting that the iPhone 17 lineup might not utilize 2nm chips, a new report from Business Times indicates that TSMC’s 2-nanometer process is set for mass production in 2025, with Apple poised to be one of the first companies to adopt this new process node.

    Next-Gen Chip Expectations

    The forthcoming A-series chip, which will drive the iPhone 17 lineup, is anticipated to be based on TSMC’s 2nm process node. However, it remains uncertain if both the Pro and standard iPhones will feature the 2-nm node. There is a possibility that the iPhone 17 Pro and iPhone 17 Pro Max models will debut with TSMC’s 2nm process, while the non-Pro models might continue with a 3nm process. This strategy aligns with Apple’s previous approach of equipping non-Pro models with older generation chips.

    Performance and Efficiency Gains

    Compared to the N3E (3nm), TSMC forecasts that the 2nm process will enhance performance by 10% to 15% at the same power levels, or decrease power usage by 25% to 30% at the same frequency and complexity. This could lead to significant improvements in performance and power efficiency for the iPhone 17 Pro models. TSMC’s 2nm process reportedly incorporates the advanced nanosheet transistor structure, offering comprehensive performance and power benefits to cater to the increasing demand for energy-efficient computing.

    Speculation on iPhone 17 Features

    A prior leak suggests that the iPhone 17 series will introduce a "Slim" model, expected to bridge the performance gap between the Pro and non-Pro variants. However, the integration of a 2nm chip into the iPhone 17 lineup remains speculative. So, should you consider upgrading to the iPhone 16? It’s crucial to evaluate several other important factors before making that decision.

  • TSMC 2nm Chip Trial Production Starting Sooner Than Expected

    TSMC 2nm Chip Trial Production Starting Sooner Than Expected

    TSMC will commence the trial production of 2nm chips next week, which will initially be used by Apple for the iPhone 17 series and other Apple products. Interestingly, this trial production is starting much earlier than anticipated.

    Initially, the trial production was slated to begin in Q4 (in October or later). This early start is seen as an effort to accelerate production to ensure a stable yield before moving to mass production. For context, trial production is where the company tests out the production line processes that will be used later for mass production.

    TSMC’s 2nm Fabrication Process

    TSMC first showcased its 2nm fabrication process in December last year. The trial production will take place at TSMC’s Baoshan plant in northern Taiwan. The necessary equipment for 2nm production has already been delivered and installed at the Baoshan plant since the second quarter.

    The iPhone 15 Pro models feature the A17 Pro chipset, made using TSMC’s 3nm process. This process allows more transistors to be packed into a smaller space, thereby enhancing performance and efficiency compared to its predecessor. Apple’s M4 chip, which recently launched with the new iPad Pro, uses an advanced 3nm fabrication process.

    Challenges and Future Plans

    Achieving a sufficient yield rate (the percentage of chips that pass quality-control checks) is typically one of the biggest hurdles for new process nodes. For instance, TSMC’s 3nm chips had a yield rate of around 50% back in April last year.

    Apple was previously believed to have reserved the entire production capacity of TSMC’s 3nm chips for the A17 Pro and M3 chip. It may do the same with TSMC for the 2nm production capacity. A report from May last year indicated that the company was working on securing all the production capacity of 2nm chips.

    TSMC plans to use gate all around (GAA) technology starting with the 2nm processes, which will enhance performance and power efficiency. Additionally, TSMC aims to introduce back-side power supply (BSPR) technology with the 2nm chips.