Tag: Snapdragon 8 Elite 2

  • 2026 Android Flagships May Feature 24GB RAM with AI Advancements

    2026 Android Flagships May Feature 24GB RAM with AI Advancements

    Key Takeaways

    1. New high-end chips, Qualcomm’s Snapdragon 8 Elite 2 and MediaTek’s Dimensity 9500, may lead to higher smartphone prices this year.
    2. These chips will offer AI computing capabilities that are twice as powerful as their predecessors.
    3. Smartphone manufacturers are considering models with 24GB of RAM and 1TB of storage to meet increased AI demands.
    4. Premium smartphone models are making a comeback, despite previous trends of moving away from higher memory options.
    5. Benchmark scores reveal the Snapdragon 8 Elite 2 and Dimensity 9500 have impressive performance, with both exceeding 11,000 in multi-core tests.

    Smartphones using Qualcomm’s Snapdragon 8 Elite 2 and MediaTek’s Dimensity 9500 could have higher prices this year. A leak from the tipster Digital Chat Station suggests that these new high-end chips will provide AI computing capabilities that are twice as powerful as those of their predecessors. Consequently, the tipster indicates that smartphone makers are contemplating offering devices with 24GB of RAM and 1TB of storage to accommodate the greater AI demands.

    Android Flagships to Feature 24GB of RAM

    Just a year back, many brands stepped away from releasing 24GB models due to the rising costs of memory. The brief trend towards larger memory in smartphones lost steam as prices increased and general demand remained low. This left the market to settle around 12GB and 16GB of RAM as the usual maximum options. However, the competitive landscape for AI hardware could change these priorities. The Snapdragon 8 Elite 2 is said to provide up to 100 TOPS (trillion operations per second) of AI performance, and similar capabilities are anticipated from the Dimensity 9500.

    Premium Models are Making a Comeback

    Because of this, DCS asserts that the top five smartphone manufacturers are getting ready to bring back premium models with 24GB + 1TB configurations. Nevertheless, the rise in memory specs may also mean an increase in smartphone prices. Although the tipster does not directly mention any specific pricing, an increase in memory specifications will likely result in higher costs for smartphones.

    Benchmark Scores Reveal Chip Power

    In related developments, leaked Geekbench 6 scores provide an early indication of just how powerful these chips could be. The Snapdragon 8 Elite 2 reportedly achieves over 4,000 points in single-core tests and exceeds 11,000 in multi-core performance. On the other hand, MediaTek’s Dimensity 9500 is not lagging behind, scoring over 3,900 in single-core tests and also surpassing 11,000 in multi-core benchmarks.

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  • Exynos 2600 Specs and Expected Geekbench Performance Leaked

    Exynos 2600 Specs and Expected Geekbench Performance Leaked

    Key Takeaways

    1. The Exynos 2600 is expected to launch in 2026, competing with Qualcomm’s Snapdragon 8 Elite 2 and Dimensity 9500.
    2. Projected Geekbench scores for the Exynos 2600 are ~2,400 (single-core) and 9,400 (multicore), showing only slight improvements over its predecessor, the Exynos 2500.
    3. The Xclipse 960 GPU is anticipated to achieve around 5,800 points in 3DMark Wild Life Extreme, indicating a 62% improvement over the previous Xclipse 940 GPU.
    4. The CPU architecture will feature two Cortex-X Prime cores and six Cortex-A cores, similar to the Snapdragon 8 Elite, but performance could improve if new Arm cores are used.
    5. The Exynos 2600 is crucial for Samsung Foundry’s 2 nm manufacturing process and faces challenges from emerging competitors like Intel Foundry.

    With the Exynos 2600 getting closer to its mass production phase, people are buzzing about its performance. It’s set to debut in 2026 and will go up against competitors like Qualcomm’s Snapdragon 8 Elite 2 and Dimensity 9500. If the rumored Geekbench scores are true, Samsung’s flagship might have quite a bit of ground to cover. According to the well-known X leaker OreXDA, the performance of the Exynos 2600 might not meet expectations.

    Expected Geekbench Scores

    Reports suggest that the Exynos 2600 is projected to achieve a mere ~2,400 points in the Geekbench single-core test and 9,400 points in the multicore test. This is not too far off from the Exynos 2500 that was used in the Galaxy S25+ prototype last year, which scored 2,359 for single-core and 8,141 for multicore. Interestingly, recent results for the Exynos 2500 on Geekbench were even weaker at 2,012 in single-core and 7,563 in multicore. Some analysts believe that Samsung might be prioritizing stable production yields over raw performance.

    Graphics Performance

    Furthermore, the Xclipse 960 GPU on the Exynos 2600 is anticipated to register around 5,800 points in 3DMark Wild Life Extreme. This marks a significant 62% improvement compared to the Xclipse 940 GPU of the Exynos 2400. Additionally, its GFXBench Aztec Ruins score is expected to hit 85 FPS. However, OreXDA did not clarify whether this score is for the 4K test or the standard one, making it difficult to assess how much of an upgrade it actually is.

    CPU Architecture

    OreXDA also mentioned that the Exynos 2600 will include two Cortex-X Prime CPU cores along with six Cortex-A cores, a configuration similar to the Snapdragon 8 Elite but using Nuvia IP. It remains uncertain if Samsung will employ Arm’s latest Travis and Altos cores, but if they do, performance could surpass the earlier projections. The Dimensity 9500, one of the first smartphone system-on-chips to utilize these cores, is rumored to bring substantial improvements over its predecessor.

    All in all, the Exynos 2600 carries significant importance as it could shape the future of Samsung Foundry’s 2 nm SF2 manufacturing process. Although the chipmaker recently received financial support from the Nintendo Switch 2, that alone won’t suffice to ensure its survival in the upcoming years, especially with Intel Foundry emerging as a strong alternative to TSMC.

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  • Xiaomi 16 Pro Max May Feature Rear Sub-Screen, New Leak Reveals

    Xiaomi 16 Pro Max May Feature Rear Sub-Screen, New Leak Reveals

    Key Takeaways

    1. Xiaomi may reintroduce a full-sized secondary display on the back of its upcoming flagship phone, possibly called the Xiaomi 16 Pro Max.
    2. The device is rumored to use the Qualcomm SM8850 or Snapdragon 8 Elite 2 chip, providing high performance with impressive Geekbench scores.
    3. It will feature a periscope telephoto camera with a vertical hole-punch design on the rear and is designed as a “wide screen” type, not foldable.
    4. The rear sub-screen could offer functionalities similar to the Mi 11 Ultra, such as previewing messages and serving as a monitor for selfies.
    5. The phone is expected to include advanced memory options with LPDDR5X RAM and UFS 4.1 storage, likely starting at a configuration of 12GB + 256GB.

    Xiaomi seems to be gearing up to revisit one of its more unique design features. A recent leak from a popular source, Digital Chat Station, suggests that a new flagship phone might include a full-sized secondary display on the back.

    Clues from the Leak

    While the blogger didn’t explicitly mention Xiaomi, the hints were quite clear. The post discusses a flagship device using the Qualcomm SM8850 or Snapdragon 8 Elite 2, along with a design that showcases a “horizontal large matrix full-size sub-screen DECO.” Additionally, it’s rumored that the phone will have a periscope telephoto camera featuring a vertical hole-punch design on the rear. The leaker later mentioned that this device isn’t foldable, but rather a “wide screen” type.

    Possible Xiaomi 16 Pro Max?

    Many Chinese news sources are suggesting that this device might be called the Xiaomi 16 Pro Max. It appears this model will take the place of the Xiaomi 15 Pro, while the Xiaomi 16 and Xiaomi 16 Pro are expected to be smaller versions in the series.

    This information remains speculative. Regardless of the final name, the key highlight of this phone will likely be the reintroduction of the rear sub-screen. Back in 2021, the Xiaomi 11 Ultra had a small 1.1-inch AMOLED display on its back.

    Features of the Mi 11 Ultra

    This panel allowed users to preview messages quickly, offered always-on display features, and even served as a monitor for selfies. CEO Lei Jun acknowledged that the main challenge wasn’t the expense of the display but rather fitting it within the device without affecting battery life or the arrangement of other components.

    Regarding performance, this new phone is likely to come equipped with Qualcomm’s SM8850 chip, which is built on TSMC’s 3nm manufacturing process and features a custom-designed CPU core. Reports suggest that this chip scores over 4000 in single-core and surpasses 11000 in multi-core Geekbench 6 tests. It also includes a 16MB GMEM and the Adreno 840 GPU for high-quality graphics. The memory setup is expected to feature LPDDR5X RAM and UFS 4.1 storage, possibly starting at a configuration of 12GB + 256GB.

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    Xiaomi 16 Pro Max May Feature Rear Sub-Screen, New Leak Reveals

     

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  • Oppo Find N6 Flip Launch Leaked: Snapdragon 8 Elite 2 Inside

    Oppo Find N6 Flip Launch Leaked: Snapdragon 8 Elite 2 Inside

    Key Takeaways

    1. The Motorola Razr Ultra is currently the only high-end clamshell foldable smartphone available, priced at $1,299.99, featuring the Snapdragon 8 Elite chipset.
    2. By 2026, a major Chinese smartphone company is expected to re-enter the foldable market, potentially launching a new version of the Flip with advanced features.
    3. Rumored designs for the new foldable include a single punch-hole camera and a larger cover display, with potential upgrades like a periscope telephoto lens.
    4. The identity of the new foldable smartphone remains uncertain, with contenders like successors to the Vivo X Flip and Oppo Find N3 Flip.
    5. Vivo may not upgrade its upcoming X Fold5 to the Snapdragon 8 Elite, indicating Oppo could lead the market with a well-equipped smartphone similar to the Samsung Galaxy Z Flip.

    We are currently a little more than halfway through the year, but there’s only one high-end clamshell foldable smartphone available worldwide.

    The Motorola Razr Ultra, priced at $1,299.99, is the sole device in this category that features Qualcomm’s latest Snapdragon 8 Elite chipset for mobile devices. It is also marketed as the “most advanced flip” phone, boasting improvements in charging speed and rear camera technology.

    Competition on the Horizon

    By 2026, however, the smartphone landscape may change as one of China’s top five companies is expected to return to this market.

    The next version of the Flip is rumored to feature a main display with a single punch-hole camera, powered by the “SM8850” or Snapdragon 8 Elite 2 processor. This chipset is anticipated to be used in other upcoming non-foldable Android flagship models, such as the OnePlus 15 and Samsung Galaxy S26 Ultra.

    Mystery Surrounding the Next Generation

    The exact identity of this foldable counterpart remains unclear at this moment. However, strong contenders include potential successors to the Vivo X Flip or Oppo Find N3 Flip.

    Recent leaks suggest a Pixel-like bar design, which could accommodate a larger cover display. This is similar to Oppo’s latest clamshell foldable patent, although the camera bump’s orientation is reversed.

    The camera setup might also see an upgrade with a periscope telephoto lens, a feature not commonly found in clamshell devices. Yet, Oppo and Vivo have successfully integrated such specifications into smaller devices recently.

    Future Prospects

    On another note, Vivo seems hesitant to upgrade even its upcoming full-sized X Fold5 to the Snapdragon 8 Elite, despite its improved design and durability.

    Thus, it appears more probable that Oppo will take the lead and introduce a fully-equipped smartphone that shares a design similar to the Samsung Galaxy Z Flip in its next product cycle.

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  • MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

    MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

    Key Takeaways

    1. The Dimensity 9500 is expected to score 3,900 in single-core and 11,000 in multicore Geekbench tests, showing competitive performance despite lagging behind Qualcomm and Apple’s chips.
    2. It features a 16 MB L3 cache and a 10 MB System Level Cache, along with LPDDR5X-10677 MT/s memory and support for four-lane UFS 4.1 storage.
    3. The Dimensity 9500 is projected to be 49% faster in single-core and 36% faster in multicore performance compared to its predecessor, the Dimensity 9400.
    4. These performance gains may indicate a significant redesign in Arm’s architecture, particularly with the new Cortex-X925 (Lumex).
    5. The Dimensity 9500 is anticipated to launch in late September, potentially setting new standards in high-performance mobile processors.

    Weibo leaker Digital Chat Station, or DCS for short, recently shared insights on how the Apple A19 Pro and Snapdragon 8 Elite 2 will stack up against their predecessors. With the future of the Exynos 2600 being unclear, the only major player left in the high-end smartphone SoC arena is MediaTek’s Dimensity 9500. If DCS’s predictions hold true, it may fall just short of its rivals.

    Performance Insights

    The Dimensity 9500 is said to achieve scores of 3,900 in Geekbench’s single-core tests and 11,000 in multicore tests. While the single-core score is a bit behind Qualcomm and Apple’s offerings, the multicore score indicates it remains relevant in the competitive landscape. It will feature a 16 MB L3 cache and a 10 MB System Level Cache (SLC) for the GPU and other components. For memory, it will utilize LPDDR5X-10677 MT/s modules. It’s also compatible with four-lane UFS 4.1 storage.

    Benchmark Comparisons

    As per our benchmark database, the Dimensity 9400 averages scores of 2,605 and 8,078 in Geekbench 6.4. If DCS’s figures are on point, the Dimensity 9500 is expected to be 49% faster in single-core performance and 36% faster in multicore performance. These projections are exceptionally high and nearly impossible to achieve with just a slight node upgrade (from TSMC N3E to N3P). This suggests that Arm has a significant redesign in the works with the Cortex-X925, now referred to as Lumex. Ideally, we should see the SoC make an appearance on a benchmarking platform before its anticipated launch in late September.

    Conclusion

    Digital Chat Station on Weibo has provided these updates, giving us a glimpse into the future of high-performance mobile processors. The advancements in the Dimensity 9500 could set a new standard in the market, making it an exciting development to watch as it approaches its release.

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    MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

     

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  • Exynos 2600 Achieves Key Milestone Ahead of Galaxy S26 Launch

    Exynos 2600 Achieves Key Milestone Ahead of Galaxy S26 Launch

    Key Takeaways

    1. Samsung has started mass production of the Exynos 2600 processor for the Galaxy S26 and S26+ smartphones.
    2. The Galaxy S26 Ultra will use a standard Snapdragon 8 Elite 2 processor instead of a specialized version.
    3. Samsung aims for 50% production yields for the Exynos 2600, with actual mass production requiring yields over 60%.
    4. Historical challenges with the Exynos 2500 may repeat, as it faced delays due to low yields on its SF3 node.
    5. It’s uncertain how the Exynos 2600 will perform compared to competitors like Snapdragon 8 Elite 2 and MediaTek Dimensity 9500.

    Samsung has begun mass production of its next-generation smartphone processor, the Exynos 2600. This chip is expected to power the Galaxy S26 and Galaxy S26+ in the upcoming year. Similar to the Galaxy S24 lineup, the Ultra version—known as the Galaxy S26 Ultra—will use a Snapdragon processor. However, this time, it will feature a standard Snapdragon 8 Elite 2 instead of the For Galaxy version typically seen in Samsung devices.

    Production Challenges

    According to reports, Samsung is aiming to achieve 50% yields for the Exynos 2600. This processor is set to be the first smartphone chip made on Samsung’s SF2 node. Previously, estimates suggested yields were around 40%, with some performance sacrifices involved. Actual mass production can only commence once yields exceed 60%, which seems unlikely until later this year.

    Historical Context

    We’ve witnessed a similar situation with last year’s Exynos 2500. While it was ready in a reasonable timeframe for the Galaxy S25, the chip’s release got delayed to mid-2025 due to low yields on its SF3 node. There is a significant possibility that history might repeat itself, as SF2 is reportedly just a renamed variant of SF3 (SF3P). The Exynos 2500 is planned to be used in the Galaxy Z Flip 7, but the more premium Galaxy Z Fold 7 will stick with the Snapdragon 8 Elite for Galaxy.

    Future Outlook

    At this point, it’s too soon to determine how the Exynos 2600 will compare to other processors. If the Exynos 2500 is any indication, there’s still much work to do, especially when stacked against the Snapdragon 8 Elite 2 and MediaTek Dimensity 9500, both of which are expected to deliver notable improvements from generation to generation.

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  • Snapdragon 8 Elite 2 Benchmarks Show Major CPU, GPU Boost

    Snapdragon 8 Elite 2 Benchmarks Show Major CPU, GPU Boost

    Key Takeaways

    1. Qualcomm will host the 2025 Snapdragon Summit from September 23 to 26 to unveil the Snapdragon 8 Elite 2 chipset.
    2. The Snapdragon 8 Elite 2 features Qualcomm’s second-generation Oryon CPU architecture, with significant performance improvements in CPU and GPU.
    3. It is expected to achieve over 4,000 points in single-core and more than 11,000 points in multi-core benchmarks, surpassing its predecessor.
    4. The chipset will include a 16MB GMEM cache and an upgraded Adreno 840 GPU for enhanced graphics performance.
    5. Xiaomi is likely to be the first brand to launch smartphones with the Snapdragon 8 Elite 2, along with other brands like OnePlus, iQOO, and Honor.

    Qualcomm is set to host the 2025 Snapdragon Summit from September 23 to 26 this year. During this event, the American chipmaker is anticipated to unveil the Snapdragon 8 Elite 2, which will be the driving force behind the upcoming flagship smartphones. A recent post on Weibo from trusted source Digital Chat Station indicates that this new SoC will offer remarkable enhancements in both processing and graphical capabilities.

    Snapdragon 8 Elite 2: Enhanced Performance in CPU and GPU

    According to the leaked information, the Snapdragon 8 Elite 2 will feature Qualcomm’s second-generation Oryon CPU architecture. In Geekbench 6 tests, this chipset is said to aim for over 4,000 points in single-core benchmarks and more than 11,000 points in multi-core performance. This marks a considerable upgrade from the first-generation Snapdragon 8 Elite, which achieved scores of about 3,100 and 9,800, indicating a significant performance leap.

    Specifications and Features

    The platform is also rumored to come with a 16MB GMEM cache and an upgraded Adreno 840 GPU, specifically designed to manage demanding visuals and graphics-intensive applications seamlessly. These enhancements point to an emphasis on efficiency and improved thermal management for future flagship devices.

    The Snapdragon 8 Elite 2 is expected to utilize a 2+6 CPU configuration, with a peak clock speed reaching 5GHz, showing notable advancements compared to its predecessor. It is likely to be manufactured using TSMC’s third-generation 3nm process, boasting a base frequency of 4.4GHz, which is a bit higher than the previous generation’s 4.32GHz.

    Anticipated Launches

    Following past trends, Xiaomi is predicted to be the first brand to release smartphones powered by this new chipset, particularly the Xiaomi 16 and Xiaomi 16 Pro. Other brands expected to adopt the chip early include OnePlus with its 15 series, iQOO’s 15 and 15 Pro, the Honor Magic 8 series, Realme’s GT 8 Pro, Nubia’s Red Magic 11 series, and the Redmi K90 series.

    Moreover, the Oppo Find X9 Ultra and Vivo X300 Ultra, set to debut next year, are also likely to feature this new chip. However, it remains uncertain if the Xiaomi 16 Ultra will use the Snapdragon 8 Elite 2 or opt for the company’s proprietary Xring SoC.

    Snapdragon 8 Elite 2 Benchmarks Show Major CPU, GPU Boost
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  • Snapdragon 8 Elite 2 Leak: Impressive Multi-Core Performance Revealed

    Key Takeaways

    1. The Apple A19 Pro chipset may outperform the existing 10-core M4 in single-core performance.
    2. Qualcomm’s Snapdragon 8 Elite 2 is expected to outperform the A19 Pro, achieving over 4,000 in single-core scores and over 11,000 in multi-core scores.
    3. The Snapdragon 8 Elite 2 could see a 30% increase in single-core performance and a 20% boost in multi-core performance compared to its predecessor.
    4. The A19 Pro is anticipated to achieve around 4,000 in single-core tests but may only reach about 10,000 in multi-core performance.
    5. The Adreno 830 GPU in the Snapdragon 8 Elite is currently better than the A18 Pro’s GPU, a trend expected to continue with the next chipsets.

    A leak emerged yesterday shedding light on the potential performance of Apple’s A19 Pro chipset. It seems that this new chip may surpass Apple’s existing 10-core M4 in terms of single-core capabilities. However, reports suggest that Qualcomm’s Snapdragon 8 Elite 2 might actually perform even better.

    Snapdragon 8 Elite 2’s Dominance

    According to Digital Chat Station, Qualcomm’s upcoming flagship chipset, the Snapdragon 8 Elite 2, is poised to take the lead over the A19 Pro when it debuts later this year. The anticipated performance metrics suggest it could achieve a single-core score exceeding 4,000 on Geekbench 6, with a multi-core score exceeding 11,000.

    Performance Comparison

    To put this into context, the current Snapdragon 8 Elite averages around 3,000 in single-core performance and roughly 9,200 in multi-core tests, according to our database. This points to a potential increase of about 30% in single-core performance for the next-generation chipset, while multi-core performance might see an improvement of around 20%.

    Regardless, it looks like the Snapdragon 8 Elite 2 could finally surpass its Apple competitor this year. The A19 Pro is rumored to achieve a similar score of about 4,000 in single-core tests, but it may only reach around 10,000 in multi-core performance. Furthermore, in terms of GPU performance, the Snapdragon 8 Elite’s Adreno 830 currently outshines the A18 Pro, and this trend is expected to continue with their next iterations.

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  • Honor Magic 8 Testing Periscope Camera Features

    Honor Magic 8 Testing Periscope Camera Features

    Key Takeaways

    1. Honor is developing the Magic 8 series of premium smartphones aimed at the Chinese market.
    2. Flagship models powered by the Snapdragon 8 Elite 2 are expected to be unveiled by the end of September.
    3. The Honor Magic 8 is rumored to feature a 6.58-inch flat display with a 1.5K resolution and an ultrasonic in-display fingerprint sensor.
    4. The device may include wireless charging and an IP68/69 rating for water and dust protection, along with advanced camera features like a periscope telephoto camera.
    5. Complete hardware specifications are not confirmed, but the device is anticipated to deliver flagship-level performance.

    Honor is said to be developing the Magic 8 series of premium smartphones aimed at the Chinese market. It is anticipated that flagship models powered by the Snapdragon 8 Elite 2 will be unveiled by the end of September in China. Therefore, the Magic 8 series, which is predicted to include this chipset, is also likely to make its debut in the same month.

    Honor Magic 8 Specifications Expected

    Details about the Honor Magic 8 have surfaced. The rumored device is expected to have a flat 6.58-inch display with a 1.5K resolution and 2.5D glass. The design of the screen will feature large-radius corners and thin bezels. A previous leak suggested that the black border’s thickness would be under 1mm. Moreover, this new information indicates that the display will come with an ultrasonic in-display fingerprint sensor.

    Features and Imaging Capabilities

    This device is also speculated to offer wireless charging along with an IP68/69 rating for protection against water and dust. Interestingly, the prototype currently being tested is rumored to include a periscope telephoto camera, suggesting that even the standard version will have advanced photography features. To recall, the rear camera setup of last year’s Honor Magic 7 included a 3x telephoto lens.

    While the complete hardware specifications have not been confirmed yet, the source hints that the “core specs are decent,” suggesting a flagship-level performance, likely powered by the Snapdragon 8 Elite 2 chipset.

    Anticipated Release Dates

    The Snapdragon 8 Elite 2 is expected to launch by the end of September this year. It is also believed that the Honor Magic 8 series, which will feature this new chip, will be revealed around the same time in China. Currently, there are no details available regarding the global release of the Honor Magic 8 series.

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    Honor Magic 8 Testing Periscope Camera Features

     

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  • Oppo Find X9 Series Launch in September: Ultrasonic Sensor & More

    Oppo Find X9 Series Launch in September: Ultrasonic Sensor & More

    Key Takeaways

    1. The Oppo Find X9 series will include models X9, X9+, X9 Pro, and possibly X9 Ultra, with high-end features being tested.
    2. All models are expected to have ultrasonic in-display fingerprint sensors, wireless charging, and IP68/69 dust and water resistance.
    3. The X9, X9+, and X9 Pro will feature the Dimensity 9500 chipset, while the Ultra version is anticipated to use the Snapdragon 8 Elite 2 processor.
    4. The Find X9 Pro may include a 200-megapixel periscope telephoto lens for enhanced zoom and macro photography.
    5. Display sizes for the series will range from 6.3 inches for the X9 to 6.82 inches for the X9 Ultra.

    Reliable source Digital Chat Station has been consistently sharing information about Oppo’s upcoming flagship series, known as the Find X9 lineup. From his posts on Weibo, it’s clear that Oppo is testing a variety of high-end features that are likely to be included in all models of the Find X9 series, which consists of the X9, X9+, X9 Pro, and potentially the X9 Ultra.

    Key Features of the Find X9 Series

    This tipster has indicated that the Find X9 series will probably come with ultrasonic in-display fingerprint sensors, which should provide better biometric accuracy compared to the previous short-focus fingerprint technology. Every model is expected to support wireless charging and is currently undergoing tests for IP68/69 dust and water resistance. Moreover, the whole series is also being examined for a periscope telephoto camera.

    Performance Expectations

    The X9, X9+, and X9 Pro are believed to be equipped with the Dimensity 9500 chipset, which is manufactured using TSMC’s 3nm N3P technology. Meanwhile, the Ultra version is anticipated to utilize the upcoming Snapdragon 8 Elite 2 processor. According to a fresh leak from DCS, both the Snapdragon 8 Elite 2 and Dimensity 9500 flagship devices are set to launch by the end of September in China. Therefore, it seems that the X9, X9+, and X9 Pro will be revealed in September, while the X9 Ultra might make its debut in the first quarter of 2026.

    Camera and Display Features

    Reports suggest that the Find X9 Pro may sport a substantial 200-megapixel periscope telephoto lens, unlike the dual periscope cameras found on the Find X8 Pro, which could greatly improve both zoom and macro photography capabilities. The X9 is projected to be a compact flagship with a flat 6.3-inch display, while the X9+, X9 Pro, and X9 Ultra are expected to have display sizes of 6.59 inches, 6.78 inches, and 6.82 inches, respectively.

    Oppo Find X9 Series Launch in September: Ultrasonic Sensor & MoreOppo Find X9 Series Launch in September: Ultrasonic Sensor & More
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