Tag: Dimensity 9500

  • 2026 Android Flagships May Feature 24GB RAM with AI Advancements

    2026 Android Flagships May Feature 24GB RAM with AI Advancements

    Key Takeaways

    1. New high-end chips, Qualcomm’s Snapdragon 8 Elite 2 and MediaTek’s Dimensity 9500, may lead to higher smartphone prices this year.
    2. These chips will offer AI computing capabilities that are twice as powerful as their predecessors.
    3. Smartphone manufacturers are considering models with 24GB of RAM and 1TB of storage to meet increased AI demands.
    4. Premium smartphone models are making a comeback, despite previous trends of moving away from higher memory options.
    5. Benchmark scores reveal the Snapdragon 8 Elite 2 and Dimensity 9500 have impressive performance, with both exceeding 11,000 in multi-core tests.

    Smartphones using Qualcomm’s Snapdragon 8 Elite 2 and MediaTek’s Dimensity 9500 could have higher prices this year. A leak from the tipster Digital Chat Station suggests that these new high-end chips will provide AI computing capabilities that are twice as powerful as those of their predecessors. Consequently, the tipster indicates that smartphone makers are contemplating offering devices with 24GB of RAM and 1TB of storage to accommodate the greater AI demands.

    Android Flagships to Feature 24GB of RAM

    Just a year back, many brands stepped away from releasing 24GB models due to the rising costs of memory. The brief trend towards larger memory in smartphones lost steam as prices increased and general demand remained low. This left the market to settle around 12GB and 16GB of RAM as the usual maximum options. However, the competitive landscape for AI hardware could change these priorities. The Snapdragon 8 Elite 2 is said to provide up to 100 TOPS (trillion operations per second) of AI performance, and similar capabilities are anticipated from the Dimensity 9500.

    Premium Models are Making a Comeback

    Because of this, DCS asserts that the top five smartphone manufacturers are getting ready to bring back premium models with 24GB + 1TB configurations. Nevertheless, the rise in memory specs may also mean an increase in smartphone prices. Although the tipster does not directly mention any specific pricing, an increase in memory specifications will likely result in higher costs for smartphones.

    Benchmark Scores Reveal Chip Power

    In related developments, leaked Geekbench 6 scores provide an early indication of just how powerful these chips could be. The Snapdragon 8 Elite 2 reportedly achieves over 4,000 points in single-core tests and exceeds 11,000 in multi-core performance. On the other hand, MediaTek’s Dimensity 9500 is not lagging behind, scoring over 3,900 in single-core tests and also surpassing 11,000 in multi-core benchmarks.

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  • Exynos 2600 Specs and Expected Geekbench Performance Leaked

    Exynos 2600 Specs and Expected Geekbench Performance Leaked

    Key Takeaways

    1. The Exynos 2600 is expected to launch in 2026, competing with Qualcomm’s Snapdragon 8 Elite 2 and Dimensity 9500.
    2. Projected Geekbench scores for the Exynos 2600 are ~2,400 (single-core) and 9,400 (multicore), showing only slight improvements over its predecessor, the Exynos 2500.
    3. The Xclipse 960 GPU is anticipated to achieve around 5,800 points in 3DMark Wild Life Extreme, indicating a 62% improvement over the previous Xclipse 940 GPU.
    4. The CPU architecture will feature two Cortex-X Prime cores and six Cortex-A cores, similar to the Snapdragon 8 Elite, but performance could improve if new Arm cores are used.
    5. The Exynos 2600 is crucial for Samsung Foundry’s 2 nm manufacturing process and faces challenges from emerging competitors like Intel Foundry.

    With the Exynos 2600 getting closer to its mass production phase, people are buzzing about its performance. It’s set to debut in 2026 and will go up against competitors like Qualcomm’s Snapdragon 8 Elite 2 and Dimensity 9500. If the rumored Geekbench scores are true, Samsung’s flagship might have quite a bit of ground to cover. According to the well-known X leaker OreXDA, the performance of the Exynos 2600 might not meet expectations.

    Expected Geekbench Scores

    Reports suggest that the Exynos 2600 is projected to achieve a mere ~2,400 points in the Geekbench single-core test and 9,400 points in the multicore test. This is not too far off from the Exynos 2500 that was used in the Galaxy S25+ prototype last year, which scored 2,359 for single-core and 8,141 for multicore. Interestingly, recent results for the Exynos 2500 on Geekbench were even weaker at 2,012 in single-core and 7,563 in multicore. Some analysts believe that Samsung might be prioritizing stable production yields over raw performance.

    Graphics Performance

    Furthermore, the Xclipse 960 GPU on the Exynos 2600 is anticipated to register around 5,800 points in 3DMark Wild Life Extreme. This marks a significant 62% improvement compared to the Xclipse 940 GPU of the Exynos 2400. Additionally, its GFXBench Aztec Ruins score is expected to hit 85 FPS. However, OreXDA did not clarify whether this score is for the 4K test or the standard one, making it difficult to assess how much of an upgrade it actually is.

    CPU Architecture

    OreXDA also mentioned that the Exynos 2600 will include two Cortex-X Prime CPU cores along with six Cortex-A cores, a configuration similar to the Snapdragon 8 Elite but using Nuvia IP. It remains uncertain if Samsung will employ Arm’s latest Travis and Altos cores, but if they do, performance could surpass the earlier projections. The Dimensity 9500, one of the first smartphone system-on-chips to utilize these cores, is rumored to bring substantial improvements over its predecessor.

    All in all, the Exynos 2600 carries significant importance as it could shape the future of Samsung Foundry’s 2 nm SF2 manufacturing process. Although the chipmaker recently received financial support from the Nintendo Switch 2, that alone won’t suffice to ensure its survival in the upcoming years, especially with Intel Foundry emerging as a strong alternative to TSMC.

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  • MediaTek Dimensity 9500 Geekbench: New GPU Details Revealed

    MediaTek Dimensity 9500 Geekbench: New GPU Details Revealed

    Key Takeaways

    1. The Dimensity 9500 has been benchmarked on Geekbench, scoring 15,717 points in OpenCL, which is lower than its predecessor, the Dimensity 9400.

    2. The GPU in the Dimensity 9500 is identified as a Mali-G1-Ultra MC12, not an Immortalis variant, indicating a potential rebranding by Arm.

    3. The chip utilizes a 1+3+4 CPU architecture, but the reported clock speeds are lower than those of the Dimensity 9400.

    4. Early leaks suggest the Dimensity 9500 may compete with the Snapdragon 8 Elite 2 in multi-core performance, but not in single-core tasks.

    5. The current benchmark results do not fully reflect the chip’s capabilities, as the GPU is operating at a low clock speed of just 1 MHz.

    We are getting our first look at MediaTek’s upcoming flagship smartphone system-on-chip (SoC), the Dimensity 9500. An initial sample has appeared on Geekbench, and while it doesn’t showcase the chip’s full capabilities, it gives us a sneak peek of what to expect and hints at a new GPU.

    Performance Insights

    The Dimensity 9500 (k6993v1_64) achieved a score of 15,717 points on Geekbench’s OpenCL benchmark. Although this score is significantly lower than the Dimensity 9400’s score of around 20,937, the GPU’s clock speed is noted to be just 1 MHz, suggesting that it isn’t performing up to its specifications.

    GPU Details

    Moreover, the Geekbench entry also verifies the presence of a Mali-G1-Ultra MC12 GPU from Arm, rather than an Immortalis-branded variant. This might connect to Arm’s wider rebranding effort, which includes changing the names of Cortex CPU cores to Lumex.

    CPU Configuration

    In terms of other specifications, the Dimensity 9500 features a familiar 1+3+4 CPU architecture. The reported clock speeds appear to be inaccurate as they are lower than those of the Dimensity 9400. Previous leaks hinted that it would compete closely with the Snapdragon 8 Elite 2 in multi-core performance, although not in single-core tasks.

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    MediaTek Dimensity 9500 Geekbench: New GPU Details Revealed
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  • MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

    MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

    Key Takeaways

    1. The Dimensity 9500 is expected to score 3,900 in single-core and 11,000 in multicore Geekbench tests, showing competitive performance despite lagging behind Qualcomm and Apple’s chips.
    2. It features a 16 MB L3 cache and a 10 MB System Level Cache, along with LPDDR5X-10677 MT/s memory and support for four-lane UFS 4.1 storage.
    3. The Dimensity 9500 is projected to be 49% faster in single-core and 36% faster in multicore performance compared to its predecessor, the Dimensity 9400.
    4. These performance gains may indicate a significant redesign in Arm’s architecture, particularly with the new Cortex-X925 (Lumex).
    5. The Dimensity 9500 is anticipated to launch in late September, potentially setting new standards in high-performance mobile processors.

    Weibo leaker Digital Chat Station, or DCS for short, recently shared insights on how the Apple A19 Pro and Snapdragon 8 Elite 2 will stack up against their predecessors. With the future of the Exynos 2600 being unclear, the only major player left in the high-end smartphone SoC arena is MediaTek’s Dimensity 9500. If DCS’s predictions hold true, it may fall just short of its rivals.

    Performance Insights

    The Dimensity 9500 is said to achieve scores of 3,900 in Geekbench’s single-core tests and 11,000 in multicore tests. While the single-core score is a bit behind Qualcomm and Apple’s offerings, the multicore score indicates it remains relevant in the competitive landscape. It will feature a 16 MB L3 cache and a 10 MB System Level Cache (SLC) for the GPU and other components. For memory, it will utilize LPDDR5X-10677 MT/s modules. It’s also compatible with four-lane UFS 4.1 storage.

    Benchmark Comparisons

    As per our benchmark database, the Dimensity 9400 averages scores of 2,605 and 8,078 in Geekbench 6.4. If DCS’s figures are on point, the Dimensity 9500 is expected to be 49% faster in single-core performance and 36% faster in multicore performance. These projections are exceptionally high and nearly impossible to achieve with just a slight node upgrade (from TSMC N3E to N3P). This suggests that Arm has a significant redesign in the works with the Cortex-X925, now referred to as Lumex. Ideally, we should see the SoC make an appearance on a benchmarking platform before its anticipated launch in late September.

    Conclusion

    Digital Chat Station on Weibo has provided these updates, giving us a glimpse into the future of high-performance mobile processors. The advancements in the Dimensity 9500 could set a new standard in the market, making it an exciting development to watch as it approaches its release.

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    MediaTek Dimensity 9500 Geekbench Score Shows Huge Single-Core Boost

     

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  • Oppo Find X9 and X9 Pro to Get Major Design Overhaul Soon

    Oppo Find X9 and X9 Pro to Get Major Design Overhaul Soon

    Key Takeaways

    1. The Oppo Find X8 series competes with the Vivo X200 lineup, both featuring the Dimensity 9400 chipset and round camera designs.
    2. Upcoming versions aim to challenge Vivo’s X300 series, utilizing the new Dimensity 9500 technology.
    3. Design changes may include corner-positioned cameras, similar to OnePlus 13 models and Vivo S30 Pro Mini.
    4. The series is expected to have two models, likely the Find X9 and X9 Pro, with a possible Plus version.
    5. The premium Find X9 Ultra may launch later with the Qualcomm Snapdragon 8 Elite 2 processor.

    The Oppo Find X8 series has been in competition with the Vivo X200 lineup, both being among the first to use the Dimensity 9400 chipset and featuring prominent round camera humps along with premium specs.

    Upcoming Rivals

    Their upcoming versions are expected to challenge Vivo’s X300 series for the title of the first smartphones to utilize the Dimensity 9500 technology. However, there may be a shift in design, as suggested by the reliable leaker, Digital Chat Station.

    Design Changes

    According to the leak, the Find X9 series could adopt corner-positioned cameras, similar to the recent OnePlus 13 models or even the Vivo S30 Pro Mini.

    The new devices are likely to keep the flat screen design of their predecessors, but with potentially thinner bezels thanks to advanced LIPO tech.

    Variants and Expectations

    Interestingly, the rumor mentions two models in different sizes, likely the Find X9 and X9 Pro, while a Plus version may also be included in the series.

    It will be fascinating to see if the design enhancements will also apply to the premium Find X9 Ultra, which could be released later with the more powerful Qualcomm Snapdragon 8 Elite 2 processor.

    The OnePlus 13T has now launched and is available in Europe through TradingShenzhen, adding to the competitive landscape of high-end smartphones.

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  • MediaTek Dimensity 9500 Set to Outperform Snapdragon 8 Elite 2

    MediaTek Dimensity 9500 Set to Outperform Snapdragon 8 Elite 2

    Key Takeaways

    Qualcomm is set to introduce its top SoC for this year, the Snapdragon 8 Elite 2, a bit earlier than usual. However, it seems that its competitor MediaTek might get ahead of the game if recent leaks are accurate.

    MediaTek’s Early Entry

    According to the leaker Digital Chat Station, MediaTek is gearing up to unveil its Dimensity 9500 flagship chipset prior to Qualcomm’s release of the Snapdragon 8 Elite 2 this year. While the leaker hasn’t specified an exact launch date for MediaTek’s chipset, Qualcomm has already announced that its Snapdragon Summit will begin on September 23. Therefore, we can expect the Dimensity 9500 to be unveiled just before that date.

    Upcoming Device Launches

    Typically, the official launches of these two chipsets will be closely followed by the release of next-gen flagship devices using them. Models such as the Xiaomi 16, iQOO 14, and an upgraded version of the OnePlus 13 are likely to come equipped with the Snapdragon 8 Elite 2. On the other hand, the Dimensity 9500 is anticipated to be quickly adopted by the Oppo Find X9 and the Vivo X300 series.

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  • Oppo Find X9 Lineup May Skip Curved Display and Size Details Leak

    Oppo Find X9 Lineup May Skip Curved Display and Size Details Leak

    Key Takeaways

    1. The Oppo Find X9 series will include models with screen sizes of 6.59 inches and 6.78 inches, featuring flat displays instead of curved ones.
    2. There is speculation about a 6.3-inch model, which may be a compact version or a separate variant within the X9 lineup.
    3. The series is expected to have four different models, but further details are still emerging.
    4. The Find X9 devices will be powered by MediaTek’s upcoming Dimensity 9500 chip, built on a 3nm process.
    5. The Dimensity 9500 will feature advanced CPU cores and support for AI and machine learning, with a planned launch in September alongside the Find X9 series.

    Oppo is preparing to launch its Find X9 series, and leaks are starting to trickle in as we approach the anticipated fall release. One of the latest insights comes from Digital Chat Station, which shares information about the display sizes of these new phones.

    Screen Sizes Revealed

    The tipster claims that two models in the Find X9 series will sport screen sizes of 6.59 inches and 6.78 inches, likely representing the standard Find X9 and the Find X9 Pro. Notably, it appears that Oppo is moving away from the curved screens seen in the previous Find X8 series, opting instead for flat displays across the X9 lineup.

    Compact Model Possibility

    Additionally, there’s talk of a 6.3-inch model, but it’s uncertain whether this model is part of the main X9 series or if it’s a separate variant. In context, the previous Find X8s had a screen of similar size, meaning this new 6.3-inch option could either replace it or be a more compact version within the X9 family.

    The Find X9 series is said to include four different models, but details beyond the screen sizes and design are still unfolding. However, what seems to be confirmed is a significant hardware upgrade happening inside the devices.

    Hardware Upgrades on the Horizon

    Reports indicate that Oppo is gearing up to launch the series featuring MediaTek’s soon-to-be-announced Dimensity 9500 chip. This new processor is rumored to be manufactured using TSMC’s advanced third-generation 3nm process (N3P). It is expected to include a CPU architecture with one “Travis” core, three “Alto” cores, and four “Gelas” cores, along with an Immortalis-Drage GPU.

    These innovative cores are based on Arm’s latest X9 architecture, designed to support the SME (Scalable Matrix Extension) instruction set, which aims to enhance efficiency for AI and machine learning tasks. If all goes according to plan, the Dimensity 9500 is set to be unveiled in September, with the first batch of Find X9 devices likely launching at the same time.

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    Oppo Find X9 Lineup May Skip Curved Display and Size Details Leak

     

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  • OPPO Find X9 Ultra: 200MP Camera with Powerful Zoom Features

    OPPO Find X9 Ultra: 200MP Camera with Powerful Zoom Features

    Key Takeaways

    1. OPPO’s Find X9 series is expected to enhance camera quality, particularly in zoom capabilities, continuing the trend set by previous “Ultra” models.
    2. The new OPPO Find X9 series may feature the MediaTek Dimensity 9500 SoC for improved performance, differing from the Snapdragon chipset used in the Find X8 Ultra.
    3. The Find X9 Ultra could include a significant camera upgrade with a dual-periscope lens setup featuring a 50MP and a 200MP sensor.
    4. There is potential for the inclusion of a spectral image sensor in the Find X9 Pro or standard Find X9 models, aimed at improving color accuracy.
    5. The details about the OPPO Find X9 series are based on leaks and are not officially confirmed yet, hinting at strong performance and camera features.

    In the last few years, OPPO’s top-tier smartphones have become known for their outstanding camera features, particularly the “Ultra” versions. A new leak indicates that the OPPO Find X9 series will continue this trend, aiming for even better camera quality, particularly in zoom capabilities.

    New Chipset for Enhanced Performance

    As per trusted Weibo leaker Digital Chat Station, the OPPO Find X9 series is likely to include the cutting-edge MediaTek Dimensity 9500 SoC. This robust chipset guarantees a fast and smooth user experience. Unlike the Find X8 series, where the “Ultra” model utilized a Snapdragon flagship SoC, the OPPO Find X9 Ultra might also be equipped with Dimensity technology.

    Exciting Camera Features Ahead

    If you are keen on optical zoom, the OPPO Find X9 Ultra may feature significant camera upgrades. Reports indicate that the company is working on a prototype that incorporates a 50MP and a 200MP dual-periscope lens setup. This would specifically include Samsung’s ISOCELL JN5 and ISOCELL HP5 sensors. To compare, the current Find X8 Ultra comes with two 50MP periscope lenses. However, it’s important to note that the final sensors for the production version still haven’t been officially finalized.

    Potential New Technologies

    An intriguing prospect is the possible inclusion of the Find X8 Ultra’s spectral image sensor in the more budget-friendly Find X9 Pro or even the standard Find X9 models. This component is effective for improving color accuracy and better representation of skin tones.

    While these details are based on leaks and not yet official confirmations, the indications for the OPPO Find X9 series point to strong performance and remarkable camera features throughout the lineup. It would be great to see more leaks about these exciting upcoming smartphones in the near future.

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  • Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked

    Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked

    Key Takeaways

    1. Qualcomm and MediaTek will launch new chipsets next month, including the Snapdragon 8s Gen 4 and Dimensity 9400+ for upcoming devices.
    2. Qualcomm’s upcoming chipsets, “SM8850” (likely Snapdragon 8 Elite 2) and “SM8845,” will be made using TSMC’s 3nm process and feature Nuvia architecture.
    3. MediaTek’s Dimensity 9500 series, including the Dimensity 9500 and budget-friendly Dimensity 9450, will also use TSMC’s 3nm N3P technology.
    4. The Dimensity 9500 is expected to have a 1+3+4 core setup with ARM’s new X9 and A7 series cores and could achieve an AnTuTu score of around 3.5 million.
    5. The Snapdragon 8 Elite-equipped Samsung Galaxy S25 Ultra is available for purchase on Amazon.

    Both Qualcomm and MediaTek are set to unveil new chipsets next month, with the Snapdragon 8s Gen 4 and Dimensity 9400+ ready to be utilized by many devices right after their release. Both firms are aiming for their upcoming flagship models, and a recent leak has disclosed additional details about the Snapdragon 8 Elite 2 and Dimensity 9500.

    Qualcomm’s Upcoming Flagships

    According to Digital Chat Station, Qualcomm plans to introduce two high-end chipsets by the end of the year, identified as “SM8850” and “SM8845.” The first one is almost certainly the Snapdragon 8 Elite 2—or whatever name the successor of Snapdragon 8 Elite will carry—while the identity of “SM8845” remains uncertain. Regardless, both chipsets will be manufactured using TSMC’s 3nm process and will continue to incorporate Qualcomm’s Nuvia architecture.

    MediaTek’s Competitive Edge

    In a similar vein, MediaTek’s Dimensity 9500 series will also be produced on TSMC’s 3nm N3P technology. There are two expected chipsets: the Dimensity 9500 and a tentatively titled Dimensity 9450. It’s likely that the “Dimensity 9450” will be a more budget-friendly, slightly less powerful alternative to the primary Dimensity 9500.

    The Dimensity 9500 is anticipated to have a 1+3+4 core setup, featuring ARM’s yet-to-be-released X9 and A7 series cores, codenamed “Travis,” “Alto,” and “Gelas.” For the GPU, MediaTek seems to stick with ARM’s Immortalis series as well. Allegedly, the Dimensity 9500 could reach an AnTuTu score around 3.5 million. In contrast, the top-performing Dimensity 9400 device in AnTuTu rankings, the Vivo X200 Pro, achieves a total score of 2.44 million—indicating this would be a notable enhancement.

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    Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked
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  • MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score

    MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score

    Key Takeaways

    1. MediaTek is expected to launch the Dimensity 9500 chip in late 2024, with engineering samples already prepared.
    2. The Dimensity 9500 features an eight-core structure (1+3+4) and aims for an AnTuTu benchmark score of around 3.5 million points.
    3. The chip will include one Cortex-X930 “Travis” core, expected to exceed 4GHz, positioning it competitively against Apple’s M4 chip.
    4. Major brands like Vivo and Oppo are set to be the first to use the Dimensity 9500 in flagship models, with potential launches as early as late September.
    5. MediaTek is also launching the Dimensity 9400 Plus next month, an overclocked version of the D9400, for various upcoming devices.

    MediaTek introduced the Dimensity 9400 chip in October 2024. There are strong rumors suggesting that the Taiwanese chipmaker is developing the Dimensity 9500, which could be launched in the final quarter of this year. A recent post on Weibo by trustworthy leaker Digital Chat Station has shared some initial insights about the D9500 chip.

    Dimensity 9500 Might Be the Top Android SoC

    Details about Dimensity 9500 shared by DCS

    The Weibo post from DCS indicates that the engineering samples for MediaTek’s upcoming chipset are prepared. As per the leak, this chip has an eight-core structure with a 1+3+4 setup, aiming for an AnTuTu benchmark score of approximately 3.5 million points. While the source didn’t directly state the chipset’s name, it seems to refer to MediaTek’s next premium processor—the Dimensity 9500.

    D9500 Will Feature One Cortex-X930 Travis Core

    Earlier, the leaker mentioned that the Dimensity 9500 would come with two Cortex-X930 “Travis” cores. However, he now indicates that there will be only one Travis core, which is expected to exceed 4GHz in performance. For single-core capability, the Dimensity 9500 might compete with Apple’s M4 chip due to features like ARM’s Scalable Matrix Extension (SME) and TSMC’s improved 3nm ‘N3P’ process.

    The informant has also suggested that although it’s not officially announced, smartphones using the Dimensity 9500 alongside Qualcomm’s Snapdragon 8 Elite 2 are likely to launch in October. Some manufacturers might even aim for a quicker release by late September, hoping to have their devices ready before November 1st.

    Major Brands to Adopt Dimensity 9500 First

    Leading brands like Vivo and Oppo are anticipated to be the first to implement the Dimensity 9500, with plans to integrate the chipset into upcoming flagship models such as the Vivo X300 and Oppo Find X8. There are also claims that the Honor Magic 9 series will include the Dimensity 9500 chip.

    In related updates, MediaTek is preparing to launch the Dimensity 9400 Plus chip next month. This chip operates at 3.73GHz and is an overclocked variant of the current D9400 chip, set to power various devices like the Oppo Find X8s, Find X8s+, Vivo X200S, Realme GT 7, iQOO Neo 10S, OnePlus Ace 5S, and Redmi K80 Ultra.

    MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score
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