Tag: Dimensity 9500

  • Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked

    Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked

    Key Takeaways

    1. Qualcomm and MediaTek will launch new chipsets next month, including the Snapdragon 8s Gen 4 and Dimensity 9400+ for upcoming devices.
    2. Qualcomm’s upcoming chipsets, “SM8850” (likely Snapdragon 8 Elite 2) and “SM8845,” will be made using TSMC’s 3nm process and feature Nuvia architecture.
    3. MediaTek’s Dimensity 9500 series, including the Dimensity 9500 and budget-friendly Dimensity 9450, will also use TSMC’s 3nm N3P technology.
    4. The Dimensity 9500 is expected to have a 1+3+4 core setup with ARM’s new X9 and A7 series cores and could achieve an AnTuTu score of around 3.5 million.
    5. The Snapdragon 8 Elite-equipped Samsung Galaxy S25 Ultra is available for purchase on Amazon.

    Both Qualcomm and MediaTek are set to unveil new chipsets next month, with the Snapdragon 8s Gen 4 and Dimensity 9400+ ready to be utilized by many devices right after their release. Both firms are aiming for their upcoming flagship models, and a recent leak has disclosed additional details about the Snapdragon 8 Elite 2 and Dimensity 9500.

    Qualcomm’s Upcoming Flagships

    According to Digital Chat Station, Qualcomm plans to introduce two high-end chipsets by the end of the year, identified as “SM8850” and “SM8845.” The first one is almost certainly the Snapdragon 8 Elite 2—or whatever name the successor of Snapdragon 8 Elite will carry—while the identity of “SM8845” remains uncertain. Regardless, both chipsets will be manufactured using TSMC’s 3nm process and will continue to incorporate Qualcomm’s Nuvia architecture.

    MediaTek’s Competitive Edge

    In a similar vein, MediaTek’s Dimensity 9500 series will also be produced on TSMC’s 3nm N3P technology. There are two expected chipsets: the Dimensity 9500 and a tentatively titled Dimensity 9450. It’s likely that the “Dimensity 9450” will be a more budget-friendly, slightly less powerful alternative to the primary Dimensity 9500.

    The Dimensity 9500 is anticipated to have a 1+3+4 core setup, featuring ARM’s yet-to-be-released X9 and A7 series cores, codenamed “Travis,” “Alto,” and “Gelas.” For the GPU, MediaTek seems to stick with ARM’s Immortalis series as well. Allegedly, the Dimensity 9500 could reach an AnTuTu score around 3.5 million. In contrast, the top-performing Dimensity 9400 device in AnTuTu rankings, the Vivo X200 Pro, achieves a total score of 2.44 million—indicating this would be a notable enhancement.

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    Snapdragon 8 Elite 2 and Dimensity 9500 Early Specs Leaked
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  • MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score

    MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score

    Key Takeaways

    1. MediaTek is expected to launch the Dimensity 9500 chip in late 2024, with engineering samples already prepared.
    2. The Dimensity 9500 features an eight-core structure (1+3+4) and aims for an AnTuTu benchmark score of around 3.5 million points.
    3. The chip will include one Cortex-X930 “Travis” core, expected to exceed 4GHz, positioning it competitively against Apple’s M4 chip.
    4. Major brands like Vivo and Oppo are set to be the first to use the Dimensity 9500 in flagship models, with potential launches as early as late September.
    5. MediaTek is also launching the Dimensity 9400 Plus next month, an overclocked version of the D9400, for various upcoming devices.

    MediaTek introduced the Dimensity 9400 chip in October 2024. There are strong rumors suggesting that the Taiwanese chipmaker is developing the Dimensity 9500, which could be launched in the final quarter of this year. A recent post on Weibo by trustworthy leaker Digital Chat Station has shared some initial insights about the D9500 chip.

    Dimensity 9500 Might Be the Top Android SoC

    Details about Dimensity 9500 shared by DCS

    The Weibo post from DCS indicates that the engineering samples for MediaTek’s upcoming chipset are prepared. As per the leak, this chip has an eight-core structure with a 1+3+4 setup, aiming for an AnTuTu benchmark score of approximately 3.5 million points. While the source didn’t directly state the chipset’s name, it seems to refer to MediaTek’s next premium processor—the Dimensity 9500.

    D9500 Will Feature One Cortex-X930 Travis Core

    Earlier, the leaker mentioned that the Dimensity 9500 would come with two Cortex-X930 “Travis” cores. However, he now indicates that there will be only one Travis core, which is expected to exceed 4GHz in performance. For single-core capability, the Dimensity 9500 might compete with Apple’s M4 chip due to features like ARM’s Scalable Matrix Extension (SME) and TSMC’s improved 3nm ‘N3P’ process.

    The informant has also suggested that although it’s not officially announced, smartphones using the Dimensity 9500 alongside Qualcomm’s Snapdragon 8 Elite 2 are likely to launch in October. Some manufacturers might even aim for a quicker release by late September, hoping to have their devices ready before November 1st.

    Major Brands to Adopt Dimensity 9500 First

    Leading brands like Vivo and Oppo are anticipated to be the first to implement the Dimensity 9500, with plans to integrate the chipset into upcoming flagship models such as the Vivo X300 and Oppo Find X8. There are also claims that the Honor Magic 9 series will include the Dimensity 9500 chip.

    In related updates, MediaTek is preparing to launch the Dimensity 9400 Plus chip next month. This chip operates at 3.73GHz and is an overclocked variant of the current D9400 chip, set to power various devices like the Oppo Find X8s, Find X8s+, Vivo X200S, Realme GT 7, iQOO Neo 10S, OnePlus Ace 5S, and Redmi K80 Ultra.

    MediaTek Dimensity 9500 Chip Architecture Leak: 3.5M AnTuTu Score
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  • Xiaomi 16 and OnePlus 14 Launch Expected in September 2023

    Xiaomi 16 and OnePlus 14 Launch Expected in September 2023

    Key Takeaways

    1. Qualcomm and MediaTek are speeding up their flagship chipset release timelines, with the Snapdragon 8 Elite 2 and Dimensity 9500 expected to launch as early as September.
    2. The first wave of Android flagship devices, including models from Xiaomi, OnePlus, and Vivo, may debut in September, ahead of China’s National Day on October 1.
    3. The Snapdragon 8 Elite 2 and Dimensity 9500 could lead to quicker releases of flagship smartphones, similar to past trends with these companies.
    4. The new Android devices will remain exclusive to the Chinese market until 2026, following historical patterns.
    5. Next-gen Android flagships might be released shortly after the iPhone 17 series, which could impact market competition.

    Both Qualcomm and MediaTek has been rapidly advancing their flagship chipsets’ release timelines in recent years. The Dimensity 9400 and Snapdragon 8 Elite made their appearance around mid-October last year, and now it seems that their successors might come out even sooner this year.

    Upcoming Launches

    According to Digital Chat Station, the first wave of Android flagship devices is set to arrive no later than October, likely alongside the Snapdragon 8 Elite 2 and Dimensity 9500. There were earlier reports suggesting the Snapdragon 8 Elite’s successor could be released in early October, but it looks like both it and the MediaTek chipset might actually launch in September instead.

    Early Flagship Debuts

    It’s rumored that OEMs utilizing the Snapdragon 8 Elite 2 and Dimensity 9500 could hasten the release of their flagship models to September, just ahead of China’s National Day on October 1. Historically, companies like Xiaomi, OnePlus, and Vivo are the first to adopt these new chipsets, so it’s possible we could see announcements for the Xiaomi 16 series, OnePlus 14, and Vivo X300 series as early as September.

    Market Exclusivity and Timing

    While this isn’t earth-shattering news—these devices will still be exclusive to the Chinese market until 2026—it does suggest that next-gen Android flagships like the Xiaomi 16 and OnePlus 14 might hit the market just weeks after the iPhone 17 series launches. For context, both the iPhone 15 and iPhone 16 series were available in the last part of September.

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  • MediaTek Dimensity 9500: N3P Process for 2025 Flagship Chip

    MediaTek Dimensity 9500: N3P Process for 2025 Flagship Chip

    The new MediaTek Dimensity 9500 processor is going to use TSMC’s N3P process node, moving away from earlier ideas about a 2nm manufacturing method. This change seems to be due to the high costs and low production capacity, especially with Apple readying to adopt TSMC’s 2nm node for its upcoming M5 series chips.

    A Major Design Change

    The Dimensity 9500 represents a big architectural change, shifting to a 2+6 core arrangement rather than the 4+4 setup of its predecessor. The fresh layout includes two Cortex-X930 “super cores” and six Cortex-A730 performance cores, with clock speeds expected to surpass the 4 GHz mark. There’s also talk that this processor will support the SME (Scalable Matrix Extension) instruction set.

    Performance Comparison

    In contrast, the Dimensity 9400 features one 3.62 GHz Cortex-X925 super core, three 3.3 GHz Cortex-X4 large cores, and four 2.4 GHz Cortex-A720 large cores. According to industry insider Digital Chat Station, the X930 cores in the Dimensity 9500 are likely to provide significantly better single-core performance.

    Launch Timeline and Competition

    MediaTek is targeting an October 2025 release, which could lead to a competition with Samsung’s Exynos 2600, rumored to be manufactured using Samsung Foundry’s 2nm technology. Both processors may power various flagship devices, with rumors hinting that the Exynos 2600 could be at the heart of Samsung’s Galaxy Z Fold 7, Z Flip 7, and S26 series.

    While TSMC’s N3P process might not be as power-efficient as the upcoming 2nm, it still offers an upgrade over the N3E process found in the current Dimensity 9400. Choosing N3P also highlights a wider industry trend, as several leading tech firms are seemingly reconsidering their quick shift to TSMC’s 2nm node due to the high costs and limited production capacity.

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