Xiaomi's Vice President of Marketing and General Manager of the Redmi brand, Wang Teng, has started unveiling more details about the newly announced Redmi K70 Ultra.
Teng stated that, in terms of comprehensive performance, the K70 Ultra is the top Android device. According to official data, the phone achieves an AnTuTu score of 2,382,780 points. Furthermore, he claimed that the phone's actual gaming performance exceeds expectations.
Collaboration with MediaTek
Redmi has reportedly worked closely with MediaTek to optimize the chipset for their new device. This collaboration is touted as the "deepest" in the industry and is expected to result in a "stronger" Dimensity 9300+. However, we will need to test the device ourselves to confirm its performance.
Enhanced Cooling System
Wang Teng also revealed that the K70 Ultra will feature a new generation of 3D ice cooling technology, incorporating an innovative concave-convex platform design. The convex surface is positioned closer to the processor, reducing the SoC core temperature by up to 3°C compared to the Redmi K60 Ultra. Additionally, the concave surface of the heatsink is designed to be further from the screen, reportedly resulting in a lower screen temperature during heavy workloads.
With the Dimensity 9300+ chipset and new cooling system, the phone reportedly supports 120fps gameplay for Genshin Impact and can handle two games simultaneously. These features are claimed to provide the strongest gaming performance in its category.
Additional Features
Referring to previous information, the phone is also equipped with a D1 independent graphics chip to enhance performance and optimize resource usage. It sports a 1.5K display with a 144Hz refresh rate and a 5,500mAh battery that supports 120W fast charging. Externally, the phone features a metal middle frame and a glass back cover. The camera module has a slightly different design, which you can view from the provided link.
