Samsung is said to be gearing up to enhance its foldable phone range in 2024 by launching the Galaxy Z Flip FE, a more affordable version of its well-known clamshell design. New leaks have also provided insights into the chipset configurations for both the Galaxy Z Flip FE and its high-end sibling, the Z Flip7.
Exynos 2500 Chipset for Galaxy Z Flip7
As per insider Jukanlosreve, the Galaxy Z Flip7 is set to come with the new Exynos 2500 chipset, indicating a major change from the Snapdragon processors that previous models like the Z Flip6 relied on. This change comes amid Samsung's struggles with manufacturing its 3nm chips. The choice of the 3nm Exynos 2500 for the Z Flip7, instead of the anticipated S25 series chips that were meant to launch in January, shows Samsung's aim to improve its production yield before ramping up mass production to lower manufacturing costs.
So far, Samsung has utilized Qualcomm chips for its foldable phones, and it will be intriguing to see if the Exynos 2500 can deliver better performance and energy efficiency for the Z Flip 7. Interestingly, the source did not mention the Z Fold 7, leaving it likely to continue using the Snapdragon 8 Elite chipset.
Affordable Galaxy Z Flip FE with Exynos 2400e
The Galaxy Z Flip FE is anticipated to be introduced as a cost-effective option compared to the luxury Z Flip lineup. This device is rumored to come equipped with the Exynos 2400e, which is a slightly downclocked variant of the Exynos 2400 chipset found in the Galaxy S24 FE.
Utilizing the Exynos 2400e presents a good compromise between affordability and performance. This chipset has shown it can manage daily tasks well, making it a strong candidate for a budget-friendly foldable smartphone.
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