MediaTek is focusing on improving the power consumption and efficiency of its SoC (system on a chip) using advanced technology and TSMC’s second-generation 3nm process node. CEO Cai Lixing announced that the Dimensity 9400 flagship chipset will be introduced in October.
Enhanced AI Performance
The Dimensity 9400 is expected to deliver 40% better AI performance compared to its predecessor. The company claims that this new chipset can manage most on-device large language models available in the market. Additionally, the CEO is confident that the revenue generated from this chipset will lead to a 50% year-over-year revenue growth.
This information was revealed during a press conference held on July 31st. The Dimensity 9400 is set to offer 40% improved AI performance over the Dimensity 9300, which has an AI performance rated at 48 TOPS. According to the CEO, MediaTek is at the forefront of NPU (neural processing unit) performance in flagship SoCs. However, he also noted that the average selling price (ASP) of phones featuring this flagship chip will be higher compared to the previous year.
CPU Core Configuration
Rumors suggest that the Dimensity 9400 will not include power-efficient cores, similar to its predecessor. The new chip is expected to use ARM’s BlackHawk CPU architecture and rely solely on performance cores to achieve outstanding single-core and multi-core performance. Additionally, it is rumored that the Dimensity 9400 will have the largest die ever, measuring 150mm² and consisting of 30 billion transistors. Nevertheless, real-life test data will be necessary to accurately assess the chip's performance capabilities.
Collaboration with Nvidia
MediaTek and Nvidia are also working together on automotive chips, with the first product anticipated to launch in early 2025. In this collaboration, Nvidia will provide the GPU while MediaTek will contribute the CPU and ISP. CEO Cai Lixing expects significant advancements in the automotive sector from 2027 to 2028 due to this collaboration.
