MediaTek Dimensity 6300: Powering Next Wave of Affordable 5G Phones

MediaTek Dimensity 6300: Powering Next Wave of Affordable 5G Phones

MediaTek has entered the competitive mid-range market with the introduction of the Dimensity 6300, a new chipset designed to power upcoming affordable 5G smartphones.

Specifications and Features

The Dimensity 6300 is built on a 6nm process, representing a modest improvement from its predecessor, the Dimensity 6100+. MediaTek claims a 10% increase in CPU performance, attributed to two faster Cortex-A76 cores clocked at 2.4GHz, along with six Cortex-A55 cores running at 2GHz. Graphics processing is managed by a Mali-G57 MC2 GPU, a common choice in this segment.

Enhanced Efficiency and Connectivity

One notable feature is the integrated 5G modem that adheres to the 3GPP Release 16 standard. MediaTek boasts of enhanced power efficiency through their UltraSave 3.0+ technology, promising a 13% to 30% improvement in sub-6GHz 5G connections compared to competitors.

Display and Camera Capabilities

The Dimensity 6300 supports Full HD+ displays with a 120Hz refresh rate. Camera capabilities are mid-range, supporting up to 108MP sensors and dual 16MP configurations.

Connectivity and Storage Options

Connectivity options include Bluetooth 5.2 and dual-band Wi-Fi 5 (a/b/g/n/ac), while storage is limited to UFS 2.2 and RAM is capped at LPDDR4x.

The Realme C65 5G is set to be the first smartphone featuring the Dimensity 6300, scheduled for release later this month. MediaTek's initiative is expected to prompt other manufacturers to follow suit, offering budget-friendly 5G connectivity solutions.

While not groundbreaking, the Dimensity 6300 represents a significant step towards making 5G technology more accessible to a wider audience.


MediaTek Dimensity 6300: Powering Next Wave of Affordable 5G Phones
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