We’ve been hearing rumors that Google will itself design the Tensor G5 chip for the Pixel 10 and 10 Pro. Unlike previous Tensor chips, which have relied on Samsung’s expertise and Foundry since its debut, G5 is said to make a switch to TSMC for its fabrication process.
Now, the publication Android Authority has got its hands on the shipping manifest for a sample Tensor G5 chip imported into India, confirming that Google is switching to TSMC.
Chip Details and Codename
The document reveals several details about the chip, including Google’s part number (G313-09488-00), the product categories (Integrated Circuit, System on a Chip), and that it is a new product.
It also confirms that TSMC is the manufacturer of the SoC. The speculation that this is the Tensor G5 SoC is supported by the component’s codename, LGA, which stands for “Laguna Beach,” believed to be the codename for the fifth-generation Tensor chipset.
Packaging Technology and Memory Options
Another sign that TSMC is making the Tensor G5 can be seen on the document where InFO POP is listed as the packaging technology used on the chipset. InFO POP technology is exclusive to TSMC.
Additionally, the document confirms the chip passed a system-level test (SLT) simulating basic functionalities. It also mentions 16GB of POP (package-on-package) RAM, potentially hinting at similar memory options for the upcoming Pixel 10 series.
Potential Upgrade Consideration
Considering this leak, if you’re planning to upgrade to a Pixel phone this year (Pixel 9 series), you might want to wait for the Pixel 10 in 2025. The Pixel 10 is likely to feature a more powerful and customized chip designed by Google, offering optimized performance for the Pixel 10 line.
