Key Takeaways
1. MediaTek’s new Dimensity 8500 chipset targets the mid-range smartphone market, enhancing performance for budget-friendly “sub-flagship” devices.
2. The chipset will be manufactured using TSMC’s 4nm technology, improving graphics capabilities with a significantly upgraded Mali-G720 GPU.
3. The Dimensity 8500 is expected to achieve an AnTuTu benchmark score of over 2 million, a notable increase from the Dimensity 8400’s score of around 1.6 million.
4. The first smartphones to feature the Dimensity 8500 include the upcoming Redmi Turbo 5 and the Poco X8 Pro, both expected to launch in early 2026.
5. Other brands, including Honor and BBK Electronics (Oppo, OnePlus, Realme, Vivo, iQOO), are also planning to release devices with the Dimensity 8500, featuring a standard metal middle frame.
MediaTek seems to be preparing for a significant impact in the mid-range smartphone sector with the introduction of its new Dimensity 8500 chipset. While the high-end Dimensity 9500 is set to drive next-gen flagship devices, the Dimensity 8500 is designed to provide robust performance for more budget-friendly “sub-flagship” phones. Recent leaks indicate that this chipset could enhance GPU performance, potentially achieving a score of over 2 million on AnTuTu.
Manufacturing Process Insights
As per insider Digital Chat Station on Weibo, MediaTek will utilize TSMC’s 4nm technology for producing the Dimensity 8500. The most intriguing aspect is the anticipated improvement in graphics capabilities. Although there might not be significant changes to the core CPU design, the Mali-G720 GPU is expected to see considerable upgrades.
Benchmark Expectations
This enhancement is reportedly so major that the chip could secure an astonishing AnTuTu benchmark score of more than 2 million points. For reference, the existing Dimensity 8400 scores around 1.6 million, marking a substantial increase in performance.
Which smartphones will be among the first to use this powerful new chip? The tipster hints that the upcoming Redmi Turbo 5 will likely be included. This device might launch by the end of this year or in early January 2026. Global users are expected to first experience this SoC in the Poco X8 Pro, rumored to be a rebranded Redmi Turbo 5, set to debut around January 2026.
Other Brands Joining In
In addition to Xiaomi’s sub-brands, other significant manufacturers are also preparing to embrace the Dimensity 8500. Honor, along with BBK Electronics—which encompasses Oppo, OnePlus, Realme, Vivo, and iQOO—are all anticipated to introduce smartphones featuring this new MediaTek chipset. There are even whispers of the Realme Neo 8 SE and iQOO Z11 Turbo incorporating this chip, following the paths set by their earlier models.
Interestingly, reports suggest that a metal middle frame will be standard across all these forthcoming Dimensity 8500 devices. Thus, brands that have been utilizing plastic frames for their “affordable flagships” may finally begin to move away from that design choice.
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