DDR6 Development Begins Amid DRAM Crisis by Leading Manufacturers

Development of DDR6 Memory Modules Has Begun

Despite the ongoing problems with DRAM shortages, top manufacturing companies are not slowing down with their next-gen memory plans. Its been revealed that the initial phases of DDR6 memory projects are already underway, although the full specs are still in the making. Prices and full details are still not available, and DDR6 isn’t expected to hit the market till probably 2028, maybe later.

Continued Progress Despite Uncertain Specs

Sources from the substrate industry shared that giant firms like Samsung, SK Hynix, and Micron, have started working with substrate makers to create DDR6 components. However, crucial details like the final thickness standards are still being debated and haven’t been settled by the JEDEC, the authority overseeing memory standards. This incomplete information suggests the process is still in initial stages.

Expected Timeline and Material Development

With some basic details like the module’s thickness, stacking arrangement, and wiring configurations disclosed, substrate developers are working towards creating preliminary test samples. Usually, joint efforts between memory and substrate manufacturers launch about two years before a product is released to the market. This timeline means DDR6 modules might be available sometime in 2028 at the earliest, maybe later, depending on development progress.

Enhanced Speed and Cost Considerations

DDR6 promises to be much faster than DDR5, with speeds reaching up to 17.6 Gbps compared to DDR5’s 9.6 Gbps ceiling. While improvements like this sound attractive, they typically come with a big increase in the cost. As with DDR5’s jump over DDR4, prices for DDR6 could be significantly higher initially. Amidst the current crisis, hopes are alive that by 2028 or 2029, the chip market might stabilize and bring prices down as supply catches up with demand.