New Xiaomi Mix Flip surfaces on MIIT
The upcoming Xiaomi Mix Flip, rumored to be a new foldable phone, has been spotted on the MIIT certification platform in China. The smartphone is listed with the model number 2311BPN23C, which aligns with previous reports and listings in the IMEI database. While the MIIT certification doesn’t provide many details, it does confirm an interesting feature that could be included in the Xiaomi Mix Flip.
Support for satellite communication
According to the certification, the new foldable phone will have support for satellite communication. This is a popular feature that has been seen in many flagship devices recently. However, aside from this information, there are no other specific details available from the MIIT certification. Fortunately, a previous leak from tipster Digital Chat Station has provided some key specifications for the Mix Flip.
Snapdragon 8 Gen 2 SoC expected
The Mix Flip is rumored to be equipped with the Qualcomm Snapdragon 8 Gen 2 SoC, according to the leak. This chipset is expected to provide powerful performance and efficient multitasking capabilities for the foldable device. While the exact details of the Snapdragon 8 Gen 2 SoC are not yet known, it is anticipated to offer an enhanced user experience.
Design details revealed
Renders of the Mix Flip that have surfaced online have given us a glimpse of its design. The rear of the phone features a horizontally aligned triple camera setup, which is speculated to include a 3x telephoto lens. Additionally, a small external screen is located just below the rear camera module. On the front, there is a tall clamshell screen with a center-aligned punch hole cutout for the selfie camera.
Stay tuned for more updates
At the moment, these are the only details available about the Xiaomi Mix Flip. As more information becomes available, we will provide updates. Xiaomi fans and tech enthusiasts can look forward to learning more about the upcoming foldable phone and its features.
