Category: Computers

  • Ryzen AI 7 350 ‘Krackan Point’ Outperforms Ryzen 7 & Core Ultra

    Ryzen AI 7 350 ‘Krackan Point’ Outperforms Ryzen 7 & Core Ultra

    CES 2025 is gearing up to be an exciting showdown for high-performance laptop chips, with both AMD and Intel ready to introduce new premium mobile processors. Intel is anticipated to reveal its Arrow Lake-H/X series, while AMD is set to unveil its highly awaited Strix Halo products. Interestingly, there’s buzz about AMD launching a new 8-core APU called Krackan Point, which has recently appeared on Geekbench.

    Details About the New APU

    The 8-core APU, probably branded as the Ryzen AI 350, features four Zen 5 cores and four Zen 5c cores, boasting a maximum clock speed of 5.05 GHz, as shown in a recent Geekbench report shared by our friends at Videocardz. It was evaluated in an Acer Swift laptop, achieving single-core and multi-core scores of 2,677 and 11,742, respectively. This puts the APU ahead of the Ryzen 7 8845HS and the Core Ultra 7 256V ‘Lunar Lake’ chips, though Apple’s entry-level M4 MacBook Pro still leads the pack.

    What’s Next for Krackan Point?

    At this time, specifics about the forthcoming Krackan Point APU remain unclear. However, we suspect that it will likely feature Strix Point‘s XDNA 2 NPU along with a Radeon 860M integrated GPU. The Strix Halo products are expected to carry the Ryzen AI Max label and will likely have a robust iGPU capable of competing with the RTX 4060 Laptop GPU. Intel’s Arrow Lake-HX lineup will also make its appearance, but who will emerge as the champion in this x86 battle is still uncertain.

    Source: Link

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  • Samsung Galaxy Book5 Pro: Two Sizes Previewed Before Release

    Samsung Galaxy Book5 Pro: Two Sizes Previewed Before Release

    A few months ago, Samsung launched the Galaxy Book5 Pro 360, which comes with Intel’s Core Ultra 7 256V and Core Ultra 7 258V chips. Recently, the company has shared some initial information about its next Intel Lunar Lake laptop, although it’s not completely revealed yet. This new device is referred to as the ‘Galaxy Book5 Pro’ in a press release written in Korean.

    Key Specifications

    Samsung states that the Galaxy Book5 Pro will be powered by Intel Core Ultra Processors (Series 2), likely including the Core Ultra 7 256V or Core Ultra 7 258V, similar to the Galaxy Book5 Pro 360, which is currently priced at $1,599.99 on Amazon. The new model is expected to be lighter and slimmer than the convertible version, but Samsung hasn’t confirmed this detail yet.

    Display and Battery Life

    The Galaxy Book5 Pro will come in 14-inch and 16-inch sizes, both featuring AMOLED screens. These displays will have an anti-reflective coating to minimize glare. Additionally, the device is claimed to provide up to 25 hours of battery life on a single charge, which is the same promise made for the Galaxy Book5 Pro 360.

    Design and Connectivity

    Images that have been released indicate that the 16-inch model will include a dedicated number pad and an off-centre trackpad. This version will also come equipped with a 3.5 mm headphone jack, a MicroSD card slot, a full-sized HDMI port, two USB Type-C ports, and one USB Type-A port. The official launch in South Korea is set for January 2, 2025, but there’s no information yet on when it will be available worldwide.

    Source: Link

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  • Apple M4 Extreme SoC with 64-Core CPU and 160-Core GPU Canceled

    Apple M4 Extreme SoC with 64-Core CPU and 160-Core GPU Canceled

    Apple has recently unveiled the M4 series of SoCs, showcasing impressive capabilities. It has been four years since Apple introduced its Silicon, and the M-series ARM chips are now more advanced in terms of both power and efficiency. Currently, the ‘Ultra’ variant of the M SoCs stands out as the most powerful option, featuring two ‘Max’ dies. Although there are rumors about an M4 Ultra being in the works, those who hope for an even more powerful M4 Extreme may need to adjust their hopes.

    Delay on the M4 Extreme

    A report from The Information, highlighted by MacRumors, reveals that Apple has been looking into a high-performance ‘M4 Extreme’ SoC, which would combine the power of two M4 Ultra chips or four M4 Max chips. However, these plans have reportedly been put on hold by Apple. The report suggests that this decision was made to focus on creating a server chip based on Apple Silicon. Those familiar with the evolution of Apple Silicon might recall that a similar situation occurred with the rumored M2 Extreme, which likely contributed to the Mac Pro’s struggle to maintain its status as a leading workstation.

    The Potential Power of the M4 Extreme

    Should the M4 Extreme ever become a reality, it could feature an astonishing 64-core CPU and an integrated GPU boasting 160 cores. The die size would be extraordinarily large, and the number of transistors might surpass even that of server-grade equipment. With the M4 Extreme now seeming unlikely, it is uncertain if Apple will revisit this concept in the future. Nonetheless, a Mac Pro equipped with an M4 Extreme would undoubtedly be seen as a premier product, although developing and marketing it may not be practical. Ultimately, only time will tell what Apple decides.

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  • GPD Win Mini 2025: AMD Strix Point & M.2 2280 SSD Upgrades

    GPD Win Mini 2025: AMD Strix Point & M.2 2280 SSD Upgrades

    GPD is actively refreshing its range of products with AMD’s newest Ryzen APUs. They have shared intentions to enhance the Win Mini, which was last updated with the AMD Ryzen 5 8640U and Ryzen 7 8840U APUs at the beginning of the year (currently priced at $1,094.99 on Amazon). For some context, GPD also launched updated versions of the Win 4 and Win Max 2 featuring AMD’s Ryzen AI 9 HX 370 APU.

    New Options for the Win Mini 2025

    The upcoming Win Mini 2025 will not only include the Ryzen AI 9 HX 370 but will also offer the more affordable Ryzen AI 9 365. To clarify, the Ryzen AI 9 365 does not perform as well as the 9 HX 370 in both CPU and GPU tests. Therefore, it is reasonable to anticipate that GPD will price the Ryzen AI 9 365 models of the Win Mini 2025 lower than those with the 9 HX 370. Additionally, there will be even more budget-friendly Ryzen 7 8840U options as well.

    Specifications and Features

    According to GPD’s product information, both Zen 5 APUs will come with choices of 32 GB or 64 GB of RAM and 2 TB of storage. Interestingly, this time around, the RAM operates at 7,500 MT/s right out of the box. Previously, the Win Mini had 6,400 MT/s RAM that could be overclocked to 7,500 MT/s manually. Furthermore, GPD has included M.2 2230 SSDs in the initial two versions of the Win Mini.

    For the 2025 model, however, they have switched to an M.2 2280 slot. The product page further notes that the Win Mini 2025 weighs 35 g more, is 4 mm taller, and 1 mm thicker compared to earlier versions. While there are no explanations provided for these adjustments, it appears that the Win Mini 2025 might also feature an enhanced cooling system. Unfortunately, GPD has not disclosed the price of the new Win Mini or when it will start shipping.

    Source: Link

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  • Dockcase USB Hub with Touchscreen, M.2 Slot, 4K 120Hz Support

    Dockcase USB Hub with Touchscreen, M.2 Slot, 4K 120Hz Support

    Dockcase is starting to become a familiar name in the tech world. The company is gearing up to launch a new product: a USB docking solution that features a more upscale design and enhanced specifications. It’s being promoted as a 7-in-1 device that serves not only as a docking station but also as external storage.

    Advanced Storage Capabilities

    This device can take in either an M.2 2230 or M.2 2242 SSD. The storage drive connects through PCIe and NVMe, which allows for faster data transfer using a modern protocol. Data is transmitted over two PCIe 3.0 lanes, providing a bandwidth of 10 Gbit/s. While this speed isn’t as impressive as that of high-end external SSDs, it remains quite good on its own.

    Lightweight and User-Friendly Design

    At a weight of 113 g (0.25 lb) and dimensions of 97.8 x 55.0 x 20.9 mm (3.9 x 2.2 x 0.8 in), the device features a 1.9-inch touchscreen with a resolution of 320 x 170 pixels. Besides showing information like SSD specs, it allows users to adjust the built-in cooling fan. There’s also a read-only mode designed to help users protect the data stored on their SSD.

    Connectivity and Pricing Details

    In addition, the dock supports memory cards and includes a HDMI 2.1 port that can handle 4K output at 120Hz. It connects to computers through USB-C, but it can only deliver a maximum of 100 watts via Power Delivery. Priced at $179, the Dockcase Smart USB-C Hub 7in1 will soon be available on Kickstarter, probably with some discounts typical of crowdfunding campaigns.

    You may also want to check out a similar product: the ORICO 8-in-1 USB-C hub available on Amazon.

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  • Lam Research Dextro Robot Doubles Precision in Semiconductor Care

    Lam Research Dextro Robot Doubles Precision in Semiconductor Care

    Lam Research has launched Dextro, a new collaborative robot designed to meet the needs of semiconductor manufacturing equipment maintenance. This mobile robot is already operational in various advanced wafer fabs worldwide, managing maintenance for 50 to 100 chambers in Lam tools each month.

    Unique Features of Dextro

    Dextro tackles major issues in semiconductor maintenance and boasts three key features. Firstly, it installs consumable parts with more than twice the accuracy compared to human workers, enhancing etch performance at the wafer’s edges. Additionally, it tightens vacuum-sealing bolts to exact specifications, removing the common 5 percent error rate associated with manual work. This improvement minimizes the risk of temperature changes in the chambers that could disrupt production.

    Enhanced Cleaning Processes

    Furthermore, Dextro includes automated cleaning and polymer removal technology that efficiently eliminates side-wall build-up in the chambers without the need for disassembling the lower sections. This innovation increases safety by removing the necessity for protective equipment like breathing masks, which were essential during manual cleanings.

    Industry Insights

    Young Ju Kim, who is the VP and head of the Memory Etch Technology Team at Samsung Electronics, emphasized the significance of prompt and effective maintenance: "When manufacturing equipment needs maintenance, it’s critical that it’s performed swiftly and effectively to prevent tool downtime and unnecessary costs. Error-free maintenance from Dextro contributes to better production variability and yield."

    Currently, Dextro is compatible with Lam’s Flex G and H series dielectric etch tools, with plans to broaden its compatibility across more equipment by 2025. The system operates on a mobile cart and is managed by fab technicians or engineers, utilizing different end-effectors for various maintenance jobs.

    Source: Link

  • Dell Pro Max 16 & 18 Plus Workstations Leaked: OLED & CAMM2 RAM

    Dell Pro Max 16 & 18 Plus Workstations Leaked: OLED & CAMM2 RAM

    Apple has recently updated its premium MacBook Pro 14 and MacBook Pro 16 laptops, which are currently priced at $2,249 on Amazon. These new models come equipped with M4, M4 Pro, and M4 Max chipsets, along with various other enhancements compared to last year’s versions. Interestingly, Dell seems to be gearing up for its own updates that might not be too far off. In a surprising twist, at least two of these new models appear to borrow from Apple’s recent iPhone naming conventions.

    Upcoming Dell Models

    Insider information suggests that the Pro Max 16 Plus and Pro Max 18 Plus are set to make their official appearance next month at CES 2025 in Las Vegas. It’s important to mention that the images displayed below have not been confirmed yet. However, they align with earlier leaks and product visuals associated with Dell.

    Specifications and Features

    Reports indicate that Dell intends to equip the Pro Max 16 Plus and Pro Max 18 Plus with Intel Arrow Lake HX processors that boast 55 W TDPs. The total system power is expected to rise to 170 W and 200 W, respectively, when in performance mode, thanks to Nvidia RTX 5000 laptop GPUs. Notably, both laptops will incorporate a robust cooling system, earning them the title of ‘industry first 3 fan mobile workstation.’

    Additional Details

    Additionally, these models will feature dual OLED displays, offer up to 16 TB of storage spread across 4 M.2 slots, and include 256 GB of CAMM2 RAM. Importantly, these components are designed for easy access, making repairs and servicing simpler. Furthermore, both laptops will support Thunderbolt 5 connectivity, achieving transfer speeds of up to 120 Gbit/s in specific configurations. It seems that Dell may have more laptop refreshes in the pipeline for CES 2025, though details on those remain undisclosed.

    Source: Link

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  • Aostar Unveils Ryzen AI 9 HX 370 Mini PC with OCuLink Port

    Aostar Unveils Ryzen AI 9 HX 370 Mini PC with OCuLink Port

    Aoostar is yet to launch the GEM 10 370, which was introduced as the company’s first product featuring the Ryzen AI 9 HX 370. This mini PC was announced in September, and before the year concludes, the company has hinted at another small computer that utilizes the same APU.

    Teaser Insights

    According to the teaser image, the AMD Strix Point APU in this new mini PC can be adjusted to 54W TDP, providing the Radeon 890M iGPU with sufficient power to effectively run modern AAA games at good graphical settings. Moreover, the system includes an OCuLink port, allowing users to connect an eGPU for enhanced gaming performance (GPD G1 can be found on Amazon).

    Connectivity Features

    In addition to the OCuLink port, this latest Aoostar mini PC is equipped with a USB4 port, further improving its compatibility with eGPUs. There are additional connectivity options, and it appears the system is designed to be compact. The overall design seems to be distinct from other products offered by the brand.

    Performance Specifications

    The teaser image also indicates that the Ryzen AI 9 HX 370 is combined with LPDDR5 RAM operating at 8,000 MHz, which is higher than the standard 7,500 MHz RAM typically found in most mini PCs. It also shows that the system has a VC cooling system, supports WiFi 7, and includes dual SSD slots.

    Pricing Information

    As for the price, the teaser image suggests that the model with 32 GB of RAM and 1 TB of storage will be priced at CNY 5,299 (approximately $731). This price is more budget-friendly compared to the GEM 10 370’s expected launch price, which could be around $1,000, similar to other Ryzen AI 9 HX 370 mini PCs that have been released in the international market.

    Source: Link

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  • PNY CS2150 SSD Launches with 10GB/s Read Speed via PCIe Gen5

    PNY CS2150 SSD Launches with 10GB/s Read Speed via PCIe Gen5

    PNY believes that replacing your current SSD with the CS2150 is the best way to improve load times, performance, and overall gaming experience on a PC. This is especially true if your system has other modern components that meet at least DDR5 and DirectX 12 standards, like the XLR8 Gaming-series memory and RTX 4000-series graphics cards, as heavily suggested by the OEM.

    Features and Compatibility

    The new M.2 2280 SSD is compatible with Microsoft DirectStorage, which is available for PCs running Windows 10 version 1909 or later. It’s also promoted as a useful tool for productivity, thanks to its TCG Opal 2.0 feature that could enhance security at the hardware level.

    Durability and Reliability

    PNY claims that the CS2150 is a “highly durable” SSD, boasting a mean time between failure (MTBF) rating of 1.5 million hours. Additionally, it employs a low-density parity check (LDPC) error-correction code (ECC) algorithm to ensure data integrity.

    Pricing and Models

    The CS2150 SSD is currently available in a 1TB version, which has a maximum read speed of up to 10.2GB/s and a write speed of up to 8.3GB/s. There’s also a higher-end 2TB model that features a read speed of up to 10.3GB/s and a write speed of 8.6GB/s.

    On Amazon, you can find these models listed at their suggested retail prices of $99.99 for the 1TB and $179.99 for the 2TB, both of which come with a 5-year limited warranty or total bytes written (TBW) in the United States.their suggested retail prices of $99

    Source: Link

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  • Genki Moonbase Power Strip: 240W USB-C Charger & RGB Lighting

    Genki Moonbase Power Strip: 240W USB-C Charger & RGB Lighting

    From laptops to portable gaming devices and smartphones, more gadgets are now using USB-C for charging. This trend has left many users with a clutter of chargers, making their desks look untidy. The Genki Moonbase is designed to solve this problem.

    Efficient Charging Solution

    The Genki power strip includes a built-in GaN charger that features four USB-C ports, which can deliver a total of 240 watts to various devices. The most robust port can output up to 140 watts, which is sufficient to charge a 16-inch Apple MacBook Pro, priced at about $2,250 on Amazon. When all four USB-C ports are in use at the same time, two of them can provide up to 100 watts each, while the remaining two are limited to 20 watts. This is still adequate for charging smartphones and numerous tablets.

    User-Friendly Design

    In addition to the four USB-C ports, the Genki Moonbase is equipped with three sockets that include lighting, making it easier to use in dimly lit areas. Users can change the color of the lighting with a specific button located on the side of the power strip. Genki also has plans to release a version with European sockets, but this will only happen if at least 240 people commit to ordering the EU model. If not, those in Europe who backed the Indiegogo project will get their money back.

    Pricing Details

    Currently, the Genki Moonbase power strip is available for preorder on Indiegogo, with an “early bird” price of $88 plus additional shipping fees and taxes. Eventually, the price will rise to approximately $119. The product is expected to ship starting in April 2025. As is common with crowdfunding projects, there could be delays in shipping.

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