Honor Magic 6 & Oppo Find X7 Series Rumored Features
Honor and Oppo are set to launch their latest flagship smartphones, the Magic 6 and Find X7 series, respectively. Ahead of their release, a leak from tipster Digital Chat Station has unveiled some exciting features that may be included in these high-end devices.
Satellite Communication and Low Power Calling
According to the leak, both the Honor Magic 6 and Oppo Find X7 series will boast a mini chipset for satellite communication technology. This will allow users to stay connected even in remote areas where traditional network coverage may be limited. Additionally, the smartphones will feature proprietary low power calling technology, which could serve as an emergency contact method.
Improved Performance with Heat Dissipation
To enhance performance and prevent thermal throttling, the Magic 6 and Find X7 devices will come equipped with heat dissipation technology. This will help regulate the temperature and ensure that the powerful Snapdragon 8 Gen 3 chips on the Magic 6 series can maintain high performance for longer periods.
High-End Image Technology
The tipster also suggests that both the Honor Magic 6 and Oppo Find X7 series will offer high-end image technology. While specific details are not yet available, this feature is expected to enhance the photography and videography capabilities of the smartphones.
Processor Details
In terms of processors, the Find X7 is rumored to come with the MediaTek Dimensity 9300 chip, while the Find X7 Pro will be equipped with the Qualcomm Snapdragon 8 Gen 3 SoC. These powerful processors will ensure smooth performance and efficient multitasking on both devices.
Overall, the leaks hint at some exciting features that could make the Honor Magic 6 and Oppo Find X7 series stand out in the flagship smartphone market. With satellite communication technology, low power calling, heat dissipation, and high-end image capabilities, these devices are expected to offer a premium user experience.
Please note that these features are based on leaks and rumors, and official specifications will be confirmed by the respective companies at the time of launch.
