Tag: TSMC 3nm

  • Samsung Produces 2nm Snapdragon 8 Elite Gen 5 Chip Samples for Qualcomm

    Samsung Produces 2nm Snapdragon 8 Elite Gen 5 Chip Samples for Qualcomm

    Key Takeaways

    1. Qualcomm has announced the Snapdragon 8 Elite Gen 5, primarily manufactured by TSMC using 3nm technology, but is also testing a 2nm version from Samsung Foundry.
    2. The testing of Samsung’s 2nm chips is a critical evaluation to determine their reliability and efficiency for possible mass production.
    3. Qualcomm’s dual-sourcing strategy with both TSMC and Samsung mitigates risks and enhances their negotiating power, potentially leading to better pricing for consumers.
    4. The technical difference lies in TSMC’s 3nm design versus Samsung’s 2nm chip utilizing Gate-All-Around (GAA) technology, which improves performance and power efficiency.
    5. Samsung must achieve consistent high-volume manufacturing yields to compete effectively and potentially challenge TSMC’s dominance in the flagship mobile semiconductor market.

    The Snapdragon 8 Elite Gen 5 has been announced, with TSMC as its primary manufacturer, utilizing their advanced 3nm (N3P) technology. However, there’s exciting news that might change the semiconductor field: Qualcomm has also requested test units of the same flagship chip, but this time made using Samsung Foundry’s new 2nm (SF2) process.

    Rumors Resurface

    This isn’t the first time that a 2nm version of Qualcomm’s Snapdragon 8 Elite Gen 5 has been discussed regarding Samsung’s production. Just weeks ago, there were active discussions about it. Now, reports from South Korea indicate that Qualcomm is already getting sample units of the SoC.

    Testing for Reliability

    Qualcomm’s order for these test chips isn’t just a casual decision. It’s akin to a major audition. Their aim is to assess if Samsung’s 2nm process is dependable and efficient enough to potentially secure a mass production deal.

    Strategic Business Moves

    Using two different manufacturers for the same chip is known as dual-sourcing, and it’s a clever strategy. It allows Qualcomm to mitigate risks, ensuring they don’t face issues if one supplier encounters production problems. Additionally, it strengthens their negotiating position against TSMC. There are whispers that Samsung is aggressively reducing prices on its 2nm process to attract these significant clients. Competition like this benefits everyone, especially consumers who may enjoy better chips at more affordable prices in the future.

    The core technical distinction between the two chips is in their internal designs. TSMC is crafting its version with cutting-edge 3nm tech. In contrast, the Samsung test chip employs its sophisticated Gate-All-Around (GAA) transistor architecture at 2nm. This GAA technology enhances performance and reduces power usage by improving gate control, which regulates electricity flow. The future Exynos 2600 chip, set to power the Galaxy S26 series in select markets, is also anticipated to be produced using 2nm.

    The Challenge Ahead for Samsung

    For Samsung to capture a portion of this significant production market, they must demonstrate one key factor above all: consistent, high-volume manufacturing yields. This testing phase is crucial. If Samsung succeeds, they won’t just land a contract; they could fundamentally alter the industry, potentially loosening TSMC’s dominance in the flagship mobile sector and igniting serious competition in the 2nm arena.

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  • Google Pixel 10 Series: Tensor G5 Chipset Underwhelms Again

    Google Pixel 10 Series: Tensor G5 Chipset Underwhelms Again

    Key Takeaways

    1. Design Leaks: Renders of the Google Pixel 10, Pixel 10 Pro, and Pixel 10 Pro XL have been leaked, showcasing the expected designs of Google’s next flagship smartphones.

    2. Chipset Manufacturing Shift: Google is moving from Samsung to TSMC for the production of the Tensor G5 using advanced 3nm technology, indicating a change in manufacturing strategy.

    3. Performance Expectations: The Tensor G5 is anticipated to offer similar performance to the Tensor G4, with only the manufacturing process being different, according to leaks and benchmark rumors.

    4. Storage Limitations: The Tensor G5 is likely limited to UFS 3.1 storage support, which falls short compared to newer competitors like the Snapdragon 8 Gen 3 that support UFS 4.0.

    5. Consumer Sentiment: Pixel series enthusiasts may prioritize practical performance and efficiency improvements from the new chipset over raw power, especially given the shift to TSMC’s technology.

    Renders of the Google Pixel 10, Pixel 10 Pro, and Pixel 10 Pro XL has leaked, showing what the designs of Google’s next flagship smartphones will look like. The Pixel 10 lineup is rumored to come with various enhancements, such as the new Tensor G5, but it seems that this chipset might not be a big step up after all.

    Manufacturing Changes

    As has been widely discussed, Google has partnered with TSMC to produce the Tensor G5 using its 3nm technology, moving away from the Samsung-made Tensor chipsets that have been used for four generations. This normally would give us hope for a notable boost in performance, but recent information suggests that the new chipset could be quite similar to last year’s model. According to leaker Chunvn8888, fans of the Pixel series can expect the Tensor G5 to deliver performance comparable to the Tensor G4, with the only change being the manufacturing process.

    Performance Expectations

    This assertion isn’t unfounded—rumored benchmarks for the Tensor G5 appeared last year, showing scores that align with the Tensor G4. While these tests were likely conducted on an early version of the chipset, it appears improbable that the final product will be much stronger. Additionally, beyond the benchmarks, the Tensor G5 is reportedly limited to UFS 3.1 storage support, which is disappointing considering that even the Snapdragon 8 Gen 3 from 2023 has already introduced UFS 4.0 support.

    Consumer Reactions

    Nonetheless, enthusiasts of the Pixel series might not be too concerned about the Tensor G5 being the latest installment to lag behind its rivals. Google has been promoting the series for its practical, real-world performance. The transition to TSMC’s 3nm technology is expected to significantly enhance efficiency and sustained performance, which is likely a feature that those interested in the Pixel 10 series would prioritize.

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  • Pixel 10’s Tensor G5: TSMC 3nm Process with Unique Core Design

    Pixel 10’s Tensor G5: TSMC 3nm Process with Unique Core Design

    For many years, Google has worked with Samsung Foundry to produce its Tensor chips. However, this may be changing with the upcoming Tensor G5, which is set to launch with the Pixel 10 series. A recent leak from Google’s gChips division, shared by Android Authority, suggests that Google will use TSMC’s advanced 3nm process for the new chip, which could lead to better efficiency and performance.

    Changes in CPU and GPU Design

    One of the most notable updates in the Tensor G5 is its redesigned CPU architecture. Unlike the previous Tensor G4, which offered only a small performance boost, the G5 retains a primary Cortex-X4 core but includes a revamped mid-cluster. The new setup features five Cortex-A725 cores, an increase from the previous three Cortex-A720 cores, while the smaller cluster has been downgraded to two Cortex-A520 cores. This change indicates that Google is trying to find a better balance between performance and power usage, although the decision to keep the Cortex-X4 instead of upgrading to the latest Cortex-X925 is quite interesting.

    Innovations in Graphics Performance

    The Tensor G5 also breaks away from tradition by not using the ARM Mali GPU. Instead, it adopts a new GPU from Imagination Technologies (IMG), the DXT-48-1536. This GPU adds ray tracing support, a first for Tensor chips, and includes GPU virtualization features that could improve graphics performance for gaming and other demanding tasks. While the new TPU in the Tensor G5 shows a 40% rise in TOPS (Trillions of Operations Per Second), internal benchmarks indicate a more modest 14% enhancement in real-world applications. Furthermore, the TPU now allows on-device training and incorporates embedded RISC-V cores that enable capabilities that weren’t available before, likely expanding its AI functions.

    Anticipation for the Pixel 10 Series

    For those eagerly awaiting the Pixel 10 series, there’s good news! The Pixel 10, expected to be released in the latter half of next year, will be the first device to sport the Tensor G5. Switching to TSMC’s 3nm process could greatly improve power efficiency, addressing previous concerns regarding the Tensor series, especially issues like thermal management and performance slowdowns. Reports suggest that Google aims to compete more effectively with Snapdragon-powered smartphones by making this strategic move, as TSMC’s manufacturing technology has been crucial for Qualcomm’s recent achievements.

    In summary, these updates reflect Google’s ambitious intentions to establish the Pixel 10 series as a more formidable player in the flagship smartphone market.

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